CA1203640A - Dispositif refroidisseur de puces a circuit integre - Google Patents

Dispositif refroidisseur de puces a circuit integre

Info

Publication number
CA1203640A
CA1203640A CA000428435A CA428435A CA1203640A CA 1203640 A CA1203640 A CA 1203640A CA 000428435 A CA000428435 A CA 000428435A CA 428435 A CA428435 A CA 428435A CA 1203640 A CA1203640 A CA 1203640A
Authority
CA
Canada
Prior art keywords
film
contact
paste
integrated circuit
mat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000428435A
Other languages
English (en)
Inventor
Faquir C. Mittal
Charles R. Solis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sperry Corp
Original Assignee
Sperry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Corp filed Critical Sperry Corp
Application granted granted Critical
Publication of CA1203640A publication Critical patent/CA1203640A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA000428435A 1983-02-07 1983-05-18 Dispositif refroidisseur de puces a circuit integre Expired CA1203640A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46429483A 1983-02-07 1983-02-07
US464,294 1983-02-07

Publications (1)

Publication Number Publication Date
CA1203640A true CA1203640A (fr) 1986-04-22

Family

ID=23843332

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000428435A Expired CA1203640A (fr) 1983-02-07 1983-05-18 Dispositif refroidisseur de puces a circuit integre

Country Status (3)

Country Link
JP (1) JPS6057139U (fr)
CA (1) CA1203640A (fr)
DE (1) DE3404027A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
JP4626082B2 (ja) * 2001-04-16 2011-02-02 株式会社日立製作所 冷却水路を備えた電気装置
AU2003240418A1 (en) * 2002-05-22 2003-12-02 Curamik Electronics Gmbh Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package

Also Published As

Publication number Publication date
JPS6057139U (ja) 1985-04-20
DE3404027A1 (de) 1984-08-16
JPH0135484Y2 (fr) 1989-10-30

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Legal Events

Date Code Title Description
MKEX Expiry