JPS6048251U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6048251U JPS6048251U JP13740883U JP13740883U JPS6048251U JP S6048251 U JPS6048251 U JP S6048251U JP 13740883 U JP13740883 U JP 13740883U JP 13740883 U JP13740883 U JP 13740883U JP S6048251 U JPS6048251 U JP S6048251U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- semiconductor equipment
- leadless chip
- carrier
- leadless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリードレス・チップキャリアの構造を示
す図、第２図は、従来のリードレス・チップキャリアが
セラミック基板（または、プリント配線基板）に実装さ
れている状態の要部を示す図、第３図は本考案に係るキ
ャビティアップ形のリードレス・チップキャリアの一実
施例を示す図、第４図は本考案によるチップキャリアに
おいて改修のためジャンパ線を接続した状態を示す図、
第５図は本考案に係るキャビティダウン形のリードレス
・チップキャリヤの実施例を示す図である。
１・・・・・・ＬＳＩチップ、２・・・・・・内部配線
、３・・・・・・チップキャリア端子、４・・・・・・
保護用キャップ、５・・・・・・セラミック基板（また
は、プリント配線基板）、６・・・・・・リードレス・
チップキャリア、７・・・・・・ハンダ付は部分、８・
・・・・・セラミック基板（または、プリント配線基板
）のパッド、９・・・・・・途中ＥＣパッドを経由する
内部配線、１０・・・・・・スルーホール、１１・・・
・・・アレー状のＥＣパッド、１２−−−−−−ジャン
パ線。なお各図中同一符号は同一または相当部分を示す
ものとする。Figure 1 shows the structure of a conventional leadless chip carrier, and Figure 2 shows the main parts of a conventional leadless chip carrier mounted on a ceramic substrate (or printed wiring board). 3 is a diagram showing an embodiment of the cavity-up type leadless chip carrier according to the present invention, and FIG. 4 is a diagram showing a state in which jumper wires are connected for repair in the chip carrier according to the present invention.
FIG. 5 is a diagram showing an embodiment of a cavity-down type leadless chip carrier according to the present invention. 1... LSI chip, 2... Internal wiring, 3... Chip carrier terminal, 4...
Protective cap, 5...Ceramic board (or printed wiring board), 6...Leadless
Chip carrier, 7... Soldered part, 8.
... Pad of ceramic board (or printed wiring board), 9 ... Internal wiring passing through EC pad on the way, 10 ... Through hole, 11 ...
...Array-shaped EC pad, 12-------jumper wire. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
リードレス・チップキャリアのキャビティ内の半導体チ
ップから外部端子までの配線途中で、スルーホールを介
して前記リードレス・チップキャリアの上部を経由させ
、該チップキャリヤに改修用パッドを設けたことを特徴
とする半導体装置。In a leadless chip carrier for a semiconductor device, the chip is passed through the upper part of the leadless chip carrier via a through hole in the middle of the wiring from the semiconductor chip in the cavity of the leadless chip carrier to the external terminal. A semiconductor device characterized in that a carrier is provided with a repair pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740883U JPS6048251U (en) | 1983-09-05 | 1983-09-05 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740883U JPS6048251U (en) | 1983-09-05 | 1983-09-05 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6048251U true JPS6048251U (en) | 1985-04-04 |
Family
ID=30308645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13740883U Pending JPS6048251U (en) | 1983-09-05 | 1983-09-05 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048251U (en) |
-
1983
- 1983-09-05 JP JP13740883U patent/JPS6048251U/en active Pending
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