JPS6045045A - 多層セラミックパッケ−ジ - Google Patents

多層セラミックパッケ−ジ

Info

Publication number
JPS6045045A
JPS6045045A JP15362883A JP15362883A JPS6045045A JP S6045045 A JPS6045045 A JP S6045045A JP 15362883 A JP15362883 A JP 15362883A JP 15362883 A JP15362883 A JP 15362883A JP S6045045 A JPS6045045 A JP S6045045A
Authority
JP
Japan
Prior art keywords
internal wiring
substrate
conductive
wall
led out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15362883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0478014B2 (enrdf_load_html_response
Inventor
Takeshi Kobayashi
小林　壯
Fumio Miyagawa
文雄 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP15362883A priority Critical patent/JPS6045045A/ja
Publication of JPS6045045A publication Critical patent/JPS6045045A/ja
Publication of JPH0478014B2 publication Critical patent/JPH0478014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP15362883A 1983-08-23 1983-08-23 多層セラミックパッケ−ジ Granted JPS6045045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15362883A JPS6045045A (ja) 1983-08-23 1983-08-23 多層セラミックパッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15362883A JPS6045045A (ja) 1983-08-23 1983-08-23 多層セラミックパッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6045045A true JPS6045045A (ja) 1985-03-11
JPH0478014B2 JPH0478014B2 (enrdf_load_html_response) 1992-12-10

Family

ID=15566655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15362883A Granted JPS6045045A (ja) 1983-08-23 1983-08-23 多層セラミックパッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6045045A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267497A (ja) * 1992-03-23 1993-10-15 Japan Radio Co Ltd 電子部品パッケージ
JPH065067U (ja) * 1992-06-22 1994-01-21 日本航空電子工業株式会社 照光式一体型キートップ
CN109411365A (zh) * 2016-07-17 2019-03-01 高锦 一种防止弯折翘曲的叠层集成电路封装结构的封装方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911575A (enrdf_load_html_response) * 1972-06-01 1974-02-01
JPS511392A (ja) * 1974-06-14 1976-01-08 Mitsubishi Kakoki Kk Aryusangasuganjugasukaraionoseizohoho
JPS5213772A (en) * 1975-07-22 1977-02-02 Kyocera Corp Ic package
JPS5254963A (en) * 1975-10-31 1977-05-04 Nippon Electric Co Circuit substrate having metalized wiring layer
JPS5822741U (ja) * 1981-08-07 1983-02-12 京セラ株式会社 半導体パツケ−ジ
JPS58122459U (ja) * 1982-02-15 1983-08-20 株式会社東芝 半導体素子外囲器
JPS58197861A (ja) * 1982-05-14 1983-11-17 Nec Corp セラミック基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911575A (enrdf_load_html_response) * 1972-06-01 1974-02-01
JPS511392A (ja) * 1974-06-14 1976-01-08 Mitsubishi Kakoki Kk Aryusangasuganjugasukaraionoseizohoho
JPS5213772A (en) * 1975-07-22 1977-02-02 Kyocera Corp Ic package
JPS5254963A (en) * 1975-10-31 1977-05-04 Nippon Electric Co Circuit substrate having metalized wiring layer
JPS5822741U (ja) * 1981-08-07 1983-02-12 京セラ株式会社 半導体パツケ−ジ
JPS58122459U (ja) * 1982-02-15 1983-08-20 株式会社東芝 半導体素子外囲器
JPS58197861A (ja) * 1982-05-14 1983-11-17 Nec Corp セラミック基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267497A (ja) * 1992-03-23 1993-10-15 Japan Radio Co Ltd 電子部品パッケージ
JPH065067U (ja) * 1992-06-22 1994-01-21 日本航空電子工業株式会社 照光式一体型キートップ
CN109411365A (zh) * 2016-07-17 2019-03-01 高锦 一种防止弯折翘曲的叠层集成电路封装结构的封装方法
CN109411361A (zh) * 2016-07-17 2019-03-01 高锦 一种叠层集成电路封装结构的封装方法

Also Published As

Publication number Publication date
JPH0478014B2 (enrdf_load_html_response) 1992-12-10

Similar Documents

Publication Publication Date Title
JPH0220848Y2 (enrdf_load_html_response)
US5426263A (en) Electronic assembly having a double-sided leadless component
US7372131B2 (en) Routing element for use in semiconductor device assemblies
JPH0697225A (ja) 半導体装置
JPS63211660A (ja) 集積回路用高端子数パッケージ
US8302277B2 (en) Module and manufacturing method thereof
KR20030075386A (ko) 칩 패키지 및 그 제조방법
US20090085192A1 (en) Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof
JP2003110084A (ja) 半導体装置
US8791501B1 (en) Integrated passive device structure and method
JPH1168026A (ja) 配線用補助パッケージおよび印刷回路配線板構造
JP3899059B2 (ja) 低抵抗高密度信号線をする電子パッケージおよびその製造方法
US5016082A (en) Integrated circuit interconnect design
JPH06163794A (ja) メタルコアタイプの多層リードフレーム
JPH06140738A (ja) リードレスチップキャリア
US8486825B2 (en) Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices
JPS6045045A (ja) 多層セラミックパッケ−ジ
JPH05218228A (ja) 電子部品搭載用基板
JP4395989B2 (ja) プリント配線板
JPH01258446A (ja) 混成集積回路の多層厚膜基板
US10881006B2 (en) Package carrier and package structure
JPH025028B2 (enrdf_load_html_response)
US20080036098A1 (en) Configurable universal interconnect device
JPH02271544A (ja) 配線基板およびこれを用いた半導体装置
KR100873420B1 (ko) 서로 다른 와이어 본딩이 가능한 인쇄 회로 기판 및 이를채용한 반도체 전력용 모듈