JPS6038897A - 薄板とリングの貼着方法 - Google Patents

薄板とリングの貼着方法

Info

Publication number
JPS6038897A
JPS6038897A JP58148550A JP14855083A JPS6038897A JP S6038897 A JPS6038897 A JP S6038897A JP 58148550 A JP58148550 A JP 58148550A JP 14855083 A JP14855083 A JP 14855083A JP S6038897 A JPS6038897 A JP S6038897A
Authority
JP
Japan
Prior art keywords
tape
ring
thin plate
adhesive tape
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58148550A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337018B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
雨谷　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58148550A priority Critical patent/JPS6038897A/ja
Publication of JPS6038897A publication Critical patent/JPS6038897A/ja
Publication of JPS6337018B2 publication Critical patent/JPS6337018B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP58148550A 1983-08-11 1983-08-11 薄板とリングの貼着方法 Granted JPS6038897A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58148550A JPS6038897A (ja) 1983-08-11 1983-08-11 薄板とリングの貼着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58148550A JPS6038897A (ja) 1983-08-11 1983-08-11 薄板とリングの貼着方法

Publications (2)

Publication Number Publication Date
JPS6038897A true JPS6038897A (ja) 1985-02-28
JPS6337018B2 JPS6337018B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-07-22

Family

ID=15455263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58148550A Granted JPS6038897A (ja) 1983-08-11 1983-08-11 薄板とリングの貼着方法

Country Status (1)

Country Link
JP (1) JPS6038897A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312563A (ja) * 1986-07-02 1988-01-19 Fujitsu Ltd 半導体装置の製造方法
JPH01209262A (ja) * 1988-02-16 1989-08-23 Shin Nippon Koki Kk テープの横ずれ防止方法およびその装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles
JPS55128817A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Device for bonding piece on tape
JPS5839846U (ja) * 1981-09-11 1983-03-16 東芝機械株式会社 テ−プ自動貼付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles
JPS55128817A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Device for bonding piece on tape
JPS5839846U (ja) * 1981-09-11 1983-03-16 東芝機械株式会社 テ−プ自動貼付装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312563A (ja) * 1986-07-02 1988-01-19 Fujitsu Ltd 半導体装置の製造方法
JPH01209262A (ja) * 1988-02-16 1989-08-23 Shin Nippon Koki Kk テープの横ずれ防止方法およびその装置

Also Published As

Publication number Publication date
JPS6337018B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-07-22

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