JPS603144A - 半導体パツケ−ジのリ−ド処理方法 - Google Patents

半導体パツケ−ジのリ−ド処理方法

Info

Publication number
JPS603144A
JPS603144A JP58110214A JP11021483A JPS603144A JP S603144 A JPS603144 A JP S603144A JP 58110214 A JP58110214 A JP 58110214A JP 11021483 A JP11021483 A JP 11021483A JP S603144 A JPS603144 A JP S603144A
Authority
JP
Japan
Prior art keywords
lead
plated
plating
semiconductor package
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58110214A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349383B2 (cg-RX-API-DMAC7.html
Inventor
Yutaka Okuaki
奥秋　裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58110214A priority Critical patent/JPS603144A/ja
Publication of JPS603144A publication Critical patent/JPS603144A/ja
Publication of JPS6349383B2 publication Critical patent/JPS6349383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58110214A 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法 Granted JPS603144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58110214A JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58110214A JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Publications (2)

Publication Number Publication Date
JPS603144A true JPS603144A (ja) 1985-01-09
JPS6349383B2 JPS6349383B2 (cg-RX-API-DMAC7.html) 1988-10-04

Family

ID=14529954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58110214A Granted JPS603144A (ja) 1983-06-21 1983-06-21 半導体パツケ−ジのリ−ド処理方法

Country Status (1)

Country Link
JP (1) JPS603144A (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5719540A (en) * 1980-07-10 1982-02-01 Toshiba Corp Relative humidity detecting method for air conditioner
JP2017112201A (ja) * 2015-12-16 2017-06-22 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
WO2020003529A1 (ja) * 2018-06-29 2020-01-02 日立ジョンソンコントロールズ空調株式会社 空調システム、空調方法、及びプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164552A (en) * 1981-04-01 1982-10-09 Hitachi Cable Ltd Lead-frame for semiconductor device
JPS5875861A (ja) * 1981-10-30 1983-05-07 Fuji Denka:Kk 回路素子気密パツケ−ジ用リ−ド線及びその製造方法
JPS59161850A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164552A (en) * 1981-04-01 1982-10-09 Hitachi Cable Ltd Lead-frame for semiconductor device
JPS5875861A (ja) * 1981-10-30 1983-05-07 Fuji Denka:Kk 回路素子気密パツケ−ジ用リ−ド線及びその製造方法
JPS59161850A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5719540A (en) * 1980-07-10 1982-02-01 Toshiba Corp Relative humidity detecting method for air conditioner
JP2017112201A (ja) * 2015-12-16 2017-06-22 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
WO2020003529A1 (ja) * 2018-06-29 2020-01-02 日立ジョンソンコントロールズ空調株式会社 空調システム、空調方法、及びプログラム

Also Published As

Publication number Publication date
JPS6349383B2 (cg-RX-API-DMAC7.html) 1988-10-04

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