JPS6025716A - モ−ルデイングの製造方法 - Google Patents

モ−ルデイングの製造方法

Info

Publication number
JPS6025716A
JPS6025716A JP13417783A JP13417783A JPS6025716A JP S6025716 A JPS6025716 A JP S6025716A JP 13417783 A JP13417783 A JP 13417783A JP 13417783 A JP13417783 A JP 13417783A JP S6025716 A JPS6025716 A JP S6025716A
Authority
JP
Japan
Prior art keywords
resin
end cap
sections
manufacturing
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13417783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240169B2 (US20020051482A1-20020502-M00057.png
Inventor
Yuichi Watanabe
祐一 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hashimoto Forming Industry Co Ltd
Original Assignee
Hashimoto Forming Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hashimoto Forming Industry Co Ltd filed Critical Hashimoto Forming Industry Co Ltd
Priority to JP13417783A priority Critical patent/JPS6025716A/ja
Publication of JPS6025716A publication Critical patent/JPS6025716A/ja
Publication of JPS6240169B2 publication Critical patent/JPS6240169B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336Coating a portion of the article, e.g. the edge of the article
    • B29C45/14409Coating profiles or strips by injecting end or corner or intermediate parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP13417783A 1983-07-22 1983-07-22 モ−ルデイングの製造方法 Granted JPS6025716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13417783A JPS6025716A (ja) 1983-07-22 1983-07-22 モ−ルデイングの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13417783A JPS6025716A (ja) 1983-07-22 1983-07-22 モ−ルデイングの製造方法

Publications (2)

Publication Number Publication Date
JPS6025716A true JPS6025716A (ja) 1985-02-08
JPS6240169B2 JPS6240169B2 (US20020051482A1-20020502-M00057.png) 1987-08-27

Family

ID=15122240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13417783A Granted JPS6025716A (ja) 1983-07-22 1983-07-22 モ−ルデイングの製造方法

Country Status (1)

Country Link
JP (1) JPS6025716A (US20020051482A1-20020502-M00057.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164082A2 (de) * 1984-06-05 1985-12-11 Gebr. Happich GmbH Verfahren und Vorrichtung zum Anbringen von Endstücken an Kunststoff-Profilleisten
WO2003018285A1 (fr) * 2001-08-22 2003-03-06 Sony Corporation Procede et dispositif permettant de former un composant electronique de module, composant electronique de module associe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051577Y2 (US20020051482A1-20020502-M00057.png) * 1985-09-26 1993-01-14

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164082A2 (de) * 1984-06-05 1985-12-11 Gebr. Happich GmbH Verfahren und Vorrichtung zum Anbringen von Endstücken an Kunststoff-Profilleisten
EP0164082A3 (de) * 1984-06-05 1988-01-20 Gebr. Happich GmbH Verfahren und Vorrichtung zum Anbringen von Endstücken an Kunststoff-Profilleisten
WO2003018285A1 (fr) * 2001-08-22 2003-03-06 Sony Corporation Procede et dispositif permettant de former un composant electronique de module, composant electronique de module associe
US6940159B2 (en) 2001-08-22 2005-09-06 Sony Corporation Method and apparatus for molding, module electronic devices and a module electronic device molded thereby

Also Published As

Publication number Publication date
JPS6240169B2 (US20020051482A1-20020502-M00057.png) 1987-08-27

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