JPS60248892A - 高純度パラジウム・ニッケル合金メッキ液及び方法 - Google Patents

高純度パラジウム・ニッケル合金メッキ液及び方法

Info

Publication number
JPS60248892A
JPS60248892A JP59103720A JP10372084A JPS60248892A JP S60248892 A JPS60248892 A JP S60248892A JP 59103720 A JP59103720 A JP 59103720A JP 10372084 A JP10372084 A JP 10372084A JP S60248892 A JPS60248892 A JP S60248892A
Authority
JP
Japan
Prior art keywords
gold
plating
alloy
palladium
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59103720A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422990B2 (enExample
Inventor
Kazuhiro Higuchi
和宏 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP59103720A priority Critical patent/JPS60248892A/ja
Priority to PCT/JP1985/000285 priority patent/WO1985005381A1/ja
Priority to US06/824,693 priority patent/US4699697A/en
Priority to EP19850902643 priority patent/EP0183852A4/en
Publication of JPS60248892A publication Critical patent/JPS60248892A/ja
Publication of JPH0422990B2 publication Critical patent/JPH0422990B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP59103720A 1984-05-24 1984-05-24 高純度パラジウム・ニッケル合金メッキ液及び方法 Granted JPS60248892A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59103720A JPS60248892A (ja) 1984-05-24 1984-05-24 高純度パラジウム・ニッケル合金メッキ液及び方法
PCT/JP1985/000285 WO1985005381A1 (fr) 1984-05-24 1985-05-23 Bain de placage en alliage de palladium-nickel de grande purete, son procede de production et articles recouverts de cet alliage, et articles recouverts de cet alliage ainsi que d'or ou d'un alliage d'or
US06/824,693 US4699697A (en) 1984-05-24 1985-05-23 High-purity palladium-nickel alloy plating solution and process
EP19850902643 EP0183852A4 (en) 1984-05-24 1985-05-23 HIGH-PURITY PALLADIUM-NICKEL ALLOY PLATING BATH, METHOD, AND ITEMS COATED WITH THIS ALLOY, AND ITEMS COATED WITH GOLD OR GOLD ALLOY.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59103720A JPS60248892A (ja) 1984-05-24 1984-05-24 高純度パラジウム・ニッケル合金メッキ液及び方法

Publications (2)

Publication Number Publication Date
JPS60248892A true JPS60248892A (ja) 1985-12-09
JPH0422990B2 JPH0422990B2 (enExample) 1992-04-21

Family

ID=14361520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59103720A Granted JPS60248892A (ja) 1984-05-24 1984-05-24 高純度パラジウム・ニッケル合金メッキ液及び方法

Country Status (4)

Country Link
US (1) US4699697A (enExample)
EP (1) EP0183852A4 (enExample)
JP (1) JPS60248892A (enExample)
WO (1) WO1985005381A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2186597B (en) * 1986-02-17 1990-04-04 Plessey Co Plc Electrical contact surface coating
DE3809139A1 (de) * 1988-03-18 1989-09-28 Lpw Chemie Gmbh Verwendung einer palladium/nickel-legierungsschicht als zwischenschicht zwischen einem nichtkorrosionsbestaendigen oder wenig korrosionsbestaendigen metallischen grundmaterial und einer nach dem pvd-verfahren aufgebrachten beschichtung
US4895771A (en) * 1988-06-14 1990-01-23 Ab Electronic Components Limited Electrical contact surface coating
FR2638174B1 (fr) * 1988-10-26 1991-01-18 Onera (Off Nat Aerospatiale) Procede de protection de surface de pieces metalliques contre la corrosion a temperature elevee, et piece traitee par ce procede
US5178745A (en) * 1991-05-03 1993-01-12 At&T Bell Laboratories Acidic palladium strike bath
KR970067816A (ko) * 1996-03-26 1997-10-13 이대원 집적회로용 리드프레임 및 그 제조방법
GB2349391A (en) * 1999-04-27 2000-11-01 Mayfair Brassware Limited Outer gold coated article
CN102098880B (zh) * 2011-02-18 2012-12-26 深南电路有限公司 一种印刷线路板的表面处理方法
CN102802364B (zh) * 2012-09-11 2014-11-05 深圳市和美精艺科技有限公司 一种在印刷电路板的导电层中设置金属钯层的方法及其层状结构
CN106480439A (zh) * 2016-11-29 2017-03-08 江苏澳光电子有限公司 一种化学镀镍钯合金渡液及其应用
CN113699566B (zh) * 2021-09-28 2023-07-04 万明电镀智能科技(东莞)有限公司 耐阳极电解腐蚀的钯镍组合镀层及其电镀方法
CN113699565B (zh) * 2021-09-28 2023-07-04 万明电镀智能科技(东莞)有限公司 高耐蚀性钯镍合金镀层及其电镀方法和钯镍镀层电镀液
CN113737236B (zh) * 2021-09-28 2023-06-16 万明电镀智能科技(东莞)有限公司 一种高耐蚀性复合镀层及其制备方法和应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB958685A (en) * 1960-10-11 1964-05-21 Automatic Telephone & Elect Improvements in or relating to palladium plating
JPS4733176B1 (enExample) * 1967-01-11 1972-08-23
JPS4733177B1 (enExample) * 1967-05-08 1972-08-23
CH572989A5 (enExample) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
JPS5677352A (en) * 1979-11-30 1981-06-25 Seiko Epson Corp Exterior decorative parts for pocket watch
JPS5760090A (en) * 1980-09-29 1982-04-10 Nisshin Kasei Kk Supplying method for palladium to palladium-nickel alloy plating solution
JPS5929118B2 (ja) * 1980-09-19 1984-07-18 セイコーエプソン株式会社 パラジウム・ニツケル合金メツキ液
DE3227723C1 (de) * 1982-07-24 1984-03-15 LPW-Chemie GmbH, 4040 Neuss Verfahren zum galvanischen Abscheiden einer Palladium/Nickel-Legierung

Also Published As

Publication number Publication date
EP0183852A1 (en) 1986-06-11
EP0183852A4 (en) 1986-07-17
JPH0422990B2 (enExample) 1992-04-21
US4699697A (en) 1987-10-13
WO1985005381A1 (fr) 1985-12-05

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Legal Events

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