JPS60246643A - テ−プボンダ - Google Patents
テ−プボンダInfo
- Publication number
- JPS60246643A JPS60246643A JP10170684A JP10170684A JPS60246643A JP S60246643 A JPS60246643 A JP S60246643A JP 10170684 A JP10170684 A JP 10170684A JP 10170684 A JP10170684 A JP 10170684A JP S60246643 A JPS60246643 A JP S60246643A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- pellet
- bonding
- tape
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 238000007906 compression Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 241000201776 Steno Species 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10170684A JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10170684A JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60246643A true JPS60246643A (ja) | 1985-12-06 |
| JPH022288B2 JPH022288B2 (enrdf_load_stackoverflow) | 1990-01-17 |
Family
ID=14307749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10170684A Granted JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60246643A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233436U (enrdf_load_stackoverflow) * | 1988-08-26 | 1990-03-02 | ||
| US5205460A (en) * | 1991-05-20 | 1993-04-27 | Kabushiki Kaisha Shinkawa | Bonding apparatus |
| KR100605313B1 (ko) * | 1999-12-13 | 2006-07-28 | 삼성전자주식회사 | 반도체 디바이스 제조용 다이 본딩 설비 |
-
1984
- 1984-05-22 JP JP10170684A patent/JPS60246643A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233436U (enrdf_load_stackoverflow) * | 1988-08-26 | 1990-03-02 | ||
| US5205460A (en) * | 1991-05-20 | 1993-04-27 | Kabushiki Kaisha Shinkawa | Bonding apparatus |
| KR100605313B1 (ko) * | 1999-12-13 | 2006-07-28 | 삼성전자주식회사 | 반도체 디바이스 제조용 다이 본딩 설비 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH022288B2 (enrdf_load_stackoverflow) | 1990-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |