JPS60246643A - テ−プボンダ - Google Patents

テ−プボンダ

Info

Publication number
JPS60246643A
JPS60246643A JP10170684A JP10170684A JPS60246643A JP S60246643 A JPS60246643 A JP S60246643A JP 10170684 A JP10170684 A JP 10170684A JP 10170684 A JP10170684 A JP 10170684A JP S60246643 A JPS60246643 A JP S60246643A
Authority
JP
Japan
Prior art keywords
tool
pellet
bonding
tape
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10170684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH022288B2 (enrdf_load_stackoverflow
Inventor
Seiichi Chiba
誠一 千葉
Akihiro Nishimura
明浩 西村
Hisao Ishida
久雄 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP10170684A priority Critical patent/JPS60246643A/ja
Publication of JPS60246643A publication Critical patent/JPS60246643A/ja
Publication of JPH022288B2 publication Critical patent/JPH022288B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP10170684A 1984-05-22 1984-05-22 テ−プボンダ Granted JPS60246643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10170684A JPS60246643A (ja) 1984-05-22 1984-05-22 テ−プボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10170684A JPS60246643A (ja) 1984-05-22 1984-05-22 テ−プボンダ

Publications (2)

Publication Number Publication Date
JPS60246643A true JPS60246643A (ja) 1985-12-06
JPH022288B2 JPH022288B2 (enrdf_load_stackoverflow) 1990-01-17

Family

ID=14307749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10170684A Granted JPS60246643A (ja) 1984-05-22 1984-05-22 テ−プボンダ

Country Status (1)

Country Link
JP (1) JPS60246643A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233436U (enrdf_load_stackoverflow) * 1988-08-26 1990-03-02
US5205460A (en) * 1991-05-20 1993-04-27 Kabushiki Kaisha Shinkawa Bonding apparatus
KR100605313B1 (ko) * 1999-12-13 2006-07-28 삼성전자주식회사 반도체 디바이스 제조용 다이 본딩 설비

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233436U (enrdf_load_stackoverflow) * 1988-08-26 1990-03-02
US5205460A (en) * 1991-05-20 1993-04-27 Kabushiki Kaisha Shinkawa Bonding apparatus
KR100605313B1 (ko) * 1999-12-13 2006-07-28 삼성전자주식회사 반도체 디바이스 제조용 다이 본딩 설비

Also Published As

Publication number Publication date
JPH022288B2 (enrdf_load_stackoverflow) 1990-01-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees