JPH022288B2 - - Google Patents
Info
- Publication number
- JPH022288B2 JPH022288B2 JP10170684A JP10170684A JPH022288B2 JP H022288 B2 JPH022288 B2 JP H022288B2 JP 10170684 A JP10170684 A JP 10170684A JP 10170684 A JP10170684 A JP 10170684A JP H022288 B2 JPH022288 B2 JP H022288B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding tool
- tool
- pellet
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 12
- 230000001680 brushing effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10170684A JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10170684A JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60246643A JPS60246643A (ja) | 1985-12-06 |
| JPH022288B2 true JPH022288B2 (enrdf_load_stackoverflow) | 1990-01-17 |
Family
ID=14307749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10170684A Granted JPS60246643A (ja) | 1984-05-22 | 1984-05-22 | テ−プボンダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60246643A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0528766Y2 (enrdf_load_stackoverflow) * | 1988-08-26 | 1993-07-23 | ||
| JP2827060B2 (ja) * | 1991-05-20 | 1998-11-18 | 株式会社新川 | ボンデイング装置 |
| KR100605313B1 (ko) * | 1999-12-13 | 2006-07-28 | 삼성전자주식회사 | 반도체 디바이스 제조용 다이 본딩 설비 |
-
1984
- 1984-05-22 JP JP10170684A patent/JPS60246643A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60246643A (ja) | 1985-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112117204B (zh) | 一种封装结构的制作方法 | |
| US5735449A (en) | Method and apparatus for bonding semiconductor electronic devices | |
| EP0297244A2 (en) | Single lead automatic clamping and bonding system | |
| CN104658754B (zh) | 线圈制造方法及装置 | |
| JPH022288B2 (enrdf_load_stackoverflow) | ||
| JP2008162012A (ja) | 切断装置のワーククランプ構造 | |
| US5395038A (en) | High placement accuracy wire bonder for joining small closely spaced wiring features | |
| US4198736A (en) | Automated burnishing apparatus and method for burnishing the terminal posts of lead-acid batteries | |
| JP5270481B2 (ja) | 電極加工方法 | |
| JPS63230280A (ja) | 抵抗溶接機 | |
| JPH02248055A (ja) | ワイヤボンディング装置 | |
| JPH11273471A (ja) | 絡め線の自動ロウ付け方法及びその装置 | |
| CN113601009A (zh) | 一种基于预置增材的钛合金激光增材制造方法 | |
| JP2008119829A (ja) | ワークの切断装置 | |
| JPH03181148A (ja) | ダイシング方法 | |
| JP2575062B2 (ja) | コイル用ボビン及びコイルのワイヤ端末処理方法 | |
| JPS5828845A (ja) | 半導体装置の製造装置 | |
| JP3836414B2 (ja) | 半導体装置の製造装置、ヒートコマ及び半導体装置の製造方法 | |
| JPS6397360A (ja) | はんだ付け方法 | |
| JP2753076B2 (ja) | インナリードボンディング装置 | |
| JPH04199526A (ja) | ボンディング装置 | |
| JP2533851B2 (ja) | 扁平直流モ−タのアマチユア製造方法 | |
| JPH0775240B2 (ja) | 被覆線のワイヤボンディング方法およびその装置 | |
| KR920000900Y1 (ko) | 반도체 제조에 있어서의 웨이퍼 이송 및 익스팬딩장치 | |
| JPH0570932B2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |