JPH022288B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape bonder equipped with a transistor for cleaning and shaping the bonding surface of a bonding tool for thermocompression bonding a lead of a film carrier and a semiconductor pellet.

[Background of the Invention] As is well known, there are two methods for thermocompression bonding a film carrier lead and a semiconductor pellet: a constant heat method and a pulse heat method. Among these, the bonding tool used for the tape bonder using the constant heat method has a natural or artificial diamond bonded to the tip of a metal shank. This bonding tool is heated to approximately 600℃ by a cartridge heater.
As a result, the lead and the semiconductor pellet are bonded together by thermocompression. However, when a bonding tool using thermocompression bonding is used several times, lead plating and molten metal residue from the wiring terminal of the semiconductor pellet adhere to the bonding surface (diamond portion) of the bonding tool, and the flatness of the bonding surface deteriorates. Therefore, it becomes necessary to clean it.

In addition, the bonding tool used for tape bonders using the pulse heat method is shaped like a bent metal plate, and a voltage is applied to both ends of the tool to generate heat, heating the bonding surface to a maximum of approximately 600°C, thereby bonding the lead. The semiconductor pellets are bonded by thermocompression.
However, after bonding several times, the bonding surface of the tool is deformed, and the lead plating and the meltable metal of the wiring terminal of the semiconductor pellet adhere to it, which deteriorates the flatness of the bonding surface. It becomes necessary.

By the way, conventionally, when cleaning the bonding tool in a constant heat type tape bonder, an operator slides a grindstone onto the bonding surface to remove any deposits, and then wipes it with alcohol, etc.; Shaping was performed by lapping the bonding surface of the tool with a lapping surface plate made of hard ceramic that moved from side to side, and then the worker wiped away foreign matter around the tool with alcohol.

[Object of the Invention] As mentioned above, the object of the present invention is to fully automatically clean and shape a bonding tool, which conventionally required manual labor by an operator, thereby greatly improving work efficiency. Our purpose is to provide tape bonders.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Reference numeral 1 denotes a pellet supply table for supplying semiconductor pellets to the bonding position, and positioning is performed by means not shown in the XY direction, the Z direction perpendicular to these, and the θ direction rotating around a central axis parallel to the Z direction. is configured to allow. 2 is a stage for bonding provided on the pellet supply table 1, 3 is a semiconductor pellet placed on the stage 2, and 4 is a pair of positioners that open and close to correctly position the semiconductor pellet 3 with respect to the stage 2. A claw, 5 is a lead of a film carrier that is supplied to the bonding position directly above the pellet supply table 1 by a supply device (not shown), and 6 is a bonding tool, which moves the bonding position on the pellet supply table 1 and a predetermined retreat position. It can move back and forth in between, and up and down at each position.

Reference numeral 10 is provided adjacent to the pellet supply table 1 and below the rear end position of the bonding tool 6.
An XY table, 11 is a ring rotatably supported on a bracket 12 provided on the XY table 10, 13 is a metal brush fixed to the outer periphery of the ring 11, and 14 is a ring provided on the XY table 10 by a belt means 15. 11 is a motor that rotates the XY table 10, and 16 is adjacent to the ring 11.
This is a lap surface plate installed on top.

Next, the operation will be explained. When the semiconductor pellet 3 is placed on the stage 2 by means not shown,
The positioning claw 4 operates to position the semiconductor pellet 3 and retreat it. Then, the pellet supply table 1 rotates in the θ direction and supplies the semiconductor pellets 3.
Position it directly below lead 5 of the film carrier. At this time, delicate alignment between the semiconductor pellets 3 and the leads 5 is performed by moving the pellet supply table 1 in the X and Y directions. Next, when the bonding tool 6 advances to the bonding position and descends, the pellet supply table 1 rises in the Z direction,
As a result, the semiconductor pellet 3 and the lead 5 are bonded together by thermocompression. When this bonding work is started, in the case of a constant heat type tape bonder, the ring 11 is rotated by the motor 14 and the metal brush 13 stands by while rotating. When the bonding operation is completed, the bonding tool 6 is raised and moved to the retracted position, and then lowered to bring the bonding surface of the bonding tool 6 into contact with the rotating metal brush 13, thereby performing cleaning. Furthermore, the XY table 10 can be moved to change the position of the metal brush 13 with respect to the bonding tool 6, if necessary.

Furthermore, in the case of a pulse heat type tape bonder, when the operator presses the automatic lap switch as necessary or when a preset number of bonding passes, the XY table 10 moves and the lap surface plate 16 is placed on the bonding tool 6. Located directly below the retreat position. Thereafter, the bonding tool 6 descends and hits the lapping surface plate 16, and from that time the XY table 10 moves left and right for a preset time, and the bonding surface is wrapped and flattened. When the wrapping is finished, the bonding tool 6 rises, the XY table 10 moves and the metal brush 13 is positioned below it, and after rotating the metal brush 13, the bonding tool 6
Lower it again and clean the bonding surface.

[Effects of the Invention] As is clear from the above description, according to the present invention, cleaning and flattening of the bonding tool can be automatically performed as necessary, so that a highly productive tape bonder can be obtained.

[Brief explanation of drawings]

The figures show an embodiment of the tape bonder according to the present invention, with FIG. 1 being a front view and FIG. 2 being a plan view. 1... Pellet supply table, 3... Semiconductor pellet, 5... Lead, 6... Bonding tool, 7... XY table, 8... Ring, 9...
Metal brush, 12...lap surface plate.

Claims (1)

[Claims] 1. A tape bonder for thermocompression bonding a lead of a film carrier and a semiconductor pellet using a bonding tool, comprising: a rotatable ring to which a metal brush for brushing the bonding tool is fixed; means for rotating the ring with power;
A tape bonder comprising a wrap surface plate for wrapping the bonding tool, and an XY table on which the ring and the wrap surface plate are placed.