CN100435306C - 微型传感器点焊工艺方法 - Google Patents

微型传感器点焊工艺方法 Download PDF

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CN100435306C
CN100435306C CNB2007100198101A CN200710019810A CN100435306C CN 100435306 C CN100435306 C CN 100435306C CN B2007100198101 A CNB2007100198101 A CN B2007100198101A CN 200710019810 A CN200710019810 A CN 200710019810A CN 100435306 C CN100435306 C CN 100435306C
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spot welding
copper wire
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汪洋
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NANJING SHIHENG ELECTRONICS CO Ltd
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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Abstract

本发明涉及一种微型传感器点焊工艺方法，属于电子器件焊接工艺技术领域。该方法包括按序排线、摊布芯片、助剂浸润、线端点焊等工艺步骤，不仅妥善解决了细铜丝柔软以及微型芯片难以镊持给焊接带来的难题，而且由于合理借助了定位条，使焊接可以批量进行，并为各后道的批量清洗、批量包封创造了良好的条件。从而大大提高了工效。与现有技术相比，具有显著的实质性特点和突出的进步。

Description

微型传感器点焊工艺方法
技术领域
本发明涉及一种焊接工艺方法，尤其是一种微型传感器点焊工艺方法，属于电子器件焊接工艺技术领域。
背景技术
小型传感器制作过程的一道重要工序是将传感器芯片与两根引出导线焊接在一起。以往由于导线为具有一定弹性的双排细钢丝，而小型传感器芯片自身的厚度略大于双排细钢丝的间距。因此，长期以来采用的焊接工艺方法是先用镊子夹起传感器芯片，将其插在两根细钢丝导线之间暂时固定，再浸入熔化的焊锡后取出，冷却即可。
然而，随着传感器的微型化以及对传感器性能品质要求的不断提高，对于芯片尺寸规格在0.5毫米左右、导线要求采用直径在0.2毫米以下细漆包铜丝的微型传感器而言，由于传感器芯片镊持困难，且细铜丝十分柔软，显然无法采用以上浸焊工艺方法。不得已只能采取单件手工精细点焊的方法。不仅效率极低，而且焊接质量难以控制。
发明内容
本发明要解决的技术问题是：针对上述微型传感器焊接的难题，提出一种可以显著提高工效、并便于保证焊接质量的微型传感器点焊工艺方法。
为了解决以上技术问题，本发明的微型传感器点焊工艺方法采用以下步骤：
1)、按序排线——将预定长度的细铜丝两根一组按序基本垂直间隔排布固定在定位条上，待焊端露出；
2)、摊布芯片——将待焊芯片摊布在平滑的耐温垫板上；
3)、助剂浸润——将溶化的助焊剂滴洒在垫板上，浸润芯片；
4)、线端点焊——扶持定位条，并用蘸有焊锡的烙铁头将一芯片推向露出定位条的细铜丝端头，使其焊合。
采用以上工艺方法不仅妥善解决了细铜丝柔软以及微型芯片难以镊持给焊接带来的难题，而且由于合理借助了定位条，使焊接可以批量进行，并为各后道的批量清洗、批量包封创造了良好的条件。从而大大提高了工效。与现有技术相比，具有显著的实质性特点和突出的进步。
附图说明
下面结合附图对本发明作进一步的说明。
图1为本发明一个实施例的示意图。
具体实施方式
实施例一
本实施例需要将一种尺寸为0.65x0.65x0.4的微型温度传感器与两根直径0.15的漆包线细铜丝焊接在一起。
具体的工艺方法步骤如下(参见图1)：
1)、按序排线——将预定长度的细铜丝两根一组按序垂直间隔排布在两条平行的硬纸板定位条1上，用不干胶条2粘贴固定，待焊端露出；
2)、摊布芯片——将待焊芯片4均匀摊布在平滑的陶瓷垫板上；
3)、助剂浸润——将溶化的助焊剂均匀滴洒在垫板上，浸润芯片；
4)、单端推焊——一手扶持定位条，另一手用蘸有焊锡的恒温电烙铁头将就近的芯片推向露出定位条的细铜丝3端头之一，点接触焊合(点焊)；焊锡采用无铅焊锡丝，成分为Sn96.5±5％、Ag3.0±0.5％、Cu0.5±0.1％，烙铁头温度控制在270±10℃，点焊时间＜1秒；
5)、逐一焊合——重复步骤4)，将定位条上各组细铜丝之一分别与一芯片焊合；
6)、点焊另端——每组细铜丝一端分别与一个芯片焊合之后，用小镊子逐一使每组细铜丝另一端与对应的芯片接触，并用电烙铁点接触焊合；
7)、检验分离——检验合格后，揭去不干胶条，使焊有两根引线的芯片相互分离。
采用本实施例的微型传感器点焊工艺方法后，不仅同时解决了细铜丝过于柔韧无法产生夹持力、以及芯片过小难以镍持的难题，并且可以保证以基本稳定的质量和较高的效率完成所需的焊接。
除上述实施例外，本发明还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案，均落在本发明要求的保护范围。

Claims (6)

1.一种微型传感器点焊工艺方法，包括以下步骤：
1)、按序排线——将预定长度的细铜丝两根一组按序基本垂直间隔排布固定在定位条上，待焊端露出；
2)、摊布芯片——将待焊芯片摊布在平滑的耐温垫板上；
3)、助剂浸润——将熔化的助焊剂滴洒在垫板上，浸润芯片；
4)、线端点焊——扶持定位条，并用蘸有焊锡的烙铁头将一芯片推向露出定位条的细铜丝端头，使其焊合。
2.根据权利要求1所述微型传感器点焊工艺方法，其特征在于：所述步骤4)、分成以下工步完成：
单端推焊——一手扶持定位条，另一手用蘸有焊锡的烙铁头将就近的芯片推向露出定位条的细铜丝端头之一点接触焊合；
逐一焊合——重复以上工步，将定位条上各组细铜丝之一分别与一芯片焊合；
点焊另端——每组细铜丝一端分别与一个芯片焊合之后，用小镊子逐一使每组细铜丝另一端与对应的芯片接触，并用烙铁点接触焊合。
3.根据权利要求2所述微型传感器点焊工艺方法，其特征在于：所述步骤1)中为，将预定长度的细铜丝两根一组按序垂直间隔排布在两条硬纸板定位条上，用不干胶条粘贴固定，待焊端露出。
4.根据权利要求3所述微型传感器点焊工艺方法，其特征在于：所述各步骤完成之后，还包括：
检验分离——检验合格后，揭去不干胶条，使焊有两根引线的芯片相互分离。
5.根据权利要求4所述微型传感器点焊工艺方法，其特征在于：所述焊锡采用无铅焊锡丝，成分为Sn96.5±5％、Ag3.0±0.5％、Cu0.5±0.1％。
6.根据权利要求5所述微型传感器点焊工艺方法，其特征在于：所述烙铁头温度控制在270±10℃，点焊时间小于1秒。
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CN103398884B (zh) * 2013-07-30 2016-01-13 江苏法尔胜材料分析测试有限公司 细规格钢丝金相制样的热镶嵌方法
CN103722260A (zh) * 2013-12-12 2014-04-16 成都赛英科技有限公司 锡焊微封装管芯工艺
CN103794299B (zh) * 2014-01-28 2016-02-10 南京时恒电子科技有限公司 一种半自动排线装置及排线方法
CN106077880B (zh) * 2016-07-12 2019-06-25 南京时恒电子科技有限公司 线材焊接用排线工装
CN108357985A (zh) * 2018-01-26 2018-08-03 贵州钢绳股份有限公司 一种定位纸及其在胎圈钢丝卷绕中的应用

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US5139972A (en) * 1991-02-28 1992-08-18 General Electric Company Batch assembly of high density hermetic packages for power semiconductor chips
CN1338349A (zh) * 2001-09-26 2002-03-06 长春海拉车灯有限公司 多点自动调整热板焊接方法
CN1700432A (zh) * 2003-09-22 2005-11-23 优利讯国际贸易有限责任公司 用于对准芯片焊接机的焊接头的方法
CN1841690A (zh) * 2005-03-09 2006-10-04 雅马哈株式会社 使用引线框架制造物理量传感器的方法及使用的焊接装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139972A (en) * 1991-02-28 1992-08-18 General Electric Company Batch assembly of high density hermetic packages for power semiconductor chips
CN1338349A (zh) * 2001-09-26 2002-03-06 长春海拉车灯有限公司 多点自动调整热板焊接方法
CN1700432A (zh) * 2003-09-22 2005-11-23 优利讯国际贸易有限责任公司 用于对准芯片焊接机的焊接头的方法
CN1841690A (zh) * 2005-03-09 2006-10-04 雅马哈株式会社 使用引线框架制造物理量传感器的方法及使用的焊接装置

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