JPS60243114A - 硬化型樹脂組成物 - Google Patents

硬化型樹脂組成物

Info

Publication number
JPS60243114A
JPS60243114A JP9909284A JP9909284A JPS60243114A JP S60243114 A JPS60243114 A JP S60243114A JP 9909284 A JP9909284 A JP 9909284A JP 9909284 A JP9909284 A JP 9909284A JP S60243114 A JPS60243114 A JP S60243114A
Authority
JP
Japan
Prior art keywords
meth
compound
resin composition
epoxy
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9909284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS637570B2 (enrdf_load_stackoverflow
Inventor
Junichi Sakamoto
淳一 坂本
Hideo Miyake
英男 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP9909284A priority Critical patent/JPS60243114A/ja
Publication of JPS60243114A publication Critical patent/JPS60243114A/ja
Publication of JPS637570B2 publication Critical patent/JPS637570B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP9909284A 1984-05-16 1984-05-16 硬化型樹脂組成物 Granted JPS60243114A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9909284A JPS60243114A (ja) 1984-05-16 1984-05-16 硬化型樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9909284A JPS60243114A (ja) 1984-05-16 1984-05-16 硬化型樹脂組成物

Publications (2)

Publication Number Publication Date
JPS60243114A true JPS60243114A (ja) 1985-12-03
JPS637570B2 JPS637570B2 (enrdf_load_stackoverflow) 1988-02-17

Family

ID=14238238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9909284A Granted JPS60243114A (ja) 1984-05-16 1984-05-16 硬化型樹脂組成物

Country Status (1)

Country Link
JP (1) JPS60243114A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627779A (ja) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd 防食性光硬化性接着剤組成物
JPS63168041A (ja) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd 半導体装置とその製造方法
JPH01188517A (ja) * 1988-01-25 1989-07-27 Toagosei Chem Ind Co Ltd 硬化用組成物の製造方法および光硬化用組成物
US7144471B2 (en) 2001-02-13 2006-12-05 International Business Machines Corporation Bonding method and apparatus
EP2670797B1 (de) 2011-01-31 2015-03-18 United Initiators GmbH & Co. KG Peroxidabmischungen für die beschleunigte vernetzung von ethylenvinylacetat
JP2015174961A (ja) * 2014-03-17 2015-10-05 スリーボンドファインケミカル株式会社 光電変換素子用シール剤

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627779A (ja) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd 防食性光硬化性接着剤組成物
JPS63168041A (ja) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd 半導体装置とその製造方法
JPH01188517A (ja) * 1988-01-25 1989-07-27 Toagosei Chem Ind Co Ltd 硬化用組成物の製造方法および光硬化用組成物
US7144471B2 (en) 2001-02-13 2006-12-05 International Business Machines Corporation Bonding method and apparatus
EP2670797B1 (de) 2011-01-31 2015-03-18 United Initiators GmbH & Co. KG Peroxidabmischungen für die beschleunigte vernetzung von ethylenvinylacetat
US9382405B2 (en) 2011-01-31 2016-07-05 United Initiators Gmbh & Co. Kg Peroxide blends for cross-linking ethylene vinyl acetate in an accelerated manner
EP2670797B2 (de) 2011-01-31 2018-09-12 United Initiators GmbH Peroxidabmischungen für die beschleunigte vernetzung von ethylenvinylacetat
JP2015174961A (ja) * 2014-03-17 2015-10-05 スリーボンドファインケミカル株式会社 光電変換素子用シール剤

Also Published As

Publication number Publication date
JPS637570B2 (enrdf_load_stackoverflow) 1988-02-17

Similar Documents

Publication Publication Date Title
JP4584839B2 (ja) 感光性樹脂組成物及びその硬化物
US4551215A (en) Curable resin composition
JP2008303362A (ja) 光硬化性防湿絶縁塗料、この光硬化性防湿絶縁塗料を用いて防湿絶縁された電子部品及びその製造方法
JPS60243114A (ja) 硬化型樹脂組成物
JPS61101526A (ja) 硬化型樹脂組成物
EP1829909B1 (en) Method for producing branched polyether resin composition and method for producing acid-pendant branched polyether resin composition
JP2897272B2 (ja) 電子部品封止用硬化型樹脂組成物
JPH0152902B2 (enrdf_load_stackoverflow)
JPH11148045A (ja) 活性エネルギー線硬化型塗料組成物及びそれを用いた被膜形成方法
JPS61171721A (ja) 積層体
JPS60127321A (ja) 低収縮性硬化型樹脂組成物
JPH0473448B2 (enrdf_load_stackoverflow)
JPS63251416A (ja) 樹脂組成物及びソルダ−レジスト用樹脂組成物
JP2003002958A (ja) アルカリ水溶液可溶性ポリエステル化合物及びそれを用いた感光性樹脂組成物並びにその硬化物
JPH0321629A (ja) 光硬化性樹脂組成物
JPH10231354A (ja) エポキシ樹脂組成物、熱硬化性樹脂フィルム及び基板に対する硬化樹脂フィルムの形成方法
JPS6147727A (ja) 硬化型樹脂組成物
JPH01188517A (ja) 硬化用組成物の製造方法および光硬化用組成物
JPH0673394B2 (ja) 回路板上における半田付方法
KR20020064958A (ko) 활성 에너지선 경화성 수지조성물
JPS63120715A (ja) ソルダーレジストインキ組成物
JPS5829814A (ja) 重合性樹脂組成物
JPS6058416A (ja) 光硬化性樹脂組成物
JPH0463558B2 (enrdf_load_stackoverflow)
JPH04136021A (ja) 光硬化性樹脂組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees