JPS60243114A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS60243114A
JPS60243114A JP9909284A JP9909284A JPS60243114A JP S60243114 A JPS60243114 A JP S60243114A JP 9909284 A JP9909284 A JP 9909284A JP 9909284 A JP9909284 A JP 9909284A JP S60243114 A JPS60243114 A JP S60243114A
Authority
JP
Japan
Prior art keywords
components
compound
curable
resin composition
photopolymerizable compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9909284A
Other languages
Japanese (ja)
Other versions
JPS637570B2 (en
Inventor
Junichi Sakamoto
Hideo Miyake
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP9909284A priority Critical patent/JPS637570B2/ja
Publication of JPS60243114A publication Critical patent/JPS60243114A/en
Publication of JPS637570B2 publication Critical patent/JPS637570B2/ja
Expired legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition, consisting of a specific epoxy compound, photopolymerizable compound and thermal polymerization initiator, primarily curable by active rays, e.g. ultraviolet rays, and completely curable by heating, and having improved adhesive property and chemical and water resistance, etc.
CONSTITUTION: A curable resin composition obtained by incorporating (A) an epoxy compound having at least two epoxy groups in the molecule with (B) a photopolymerizable compound having one or more carboxyl groups in the molecule, e.g. acrylic acid, methacrylic acid and a compound expressed by the formula (R1 is H or methyl; R2 and R3 are general residue; A is ester bond; m and n are integers 1W3) alone or together with (C) a photopolymerizable compound other than the component (C), and further adding (D) a thermal polymerization initiator, e.g. a peroxy ester or peroxyketal, thereto. The compounding ratio of the components is preferably as follows; 20:80W80:20 weight ratio between the components (A) and the total of the components (B) and (C), and the amount of the component (D) is 0.5W10wt% based on the total of the components (A), (B) and (C).
COPYRIGHT: (C)1985,JPO&Japio
JP9909284A 1984-05-16 1984-05-16 Expired JPS637570B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9909284A JPS637570B2 (en) 1984-05-16 1984-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9909284A JPS637570B2 (en) 1984-05-16 1984-05-16

Publications (2)

Publication Number Publication Date
JPS60243114A true JPS60243114A (en) 1985-12-03
JPS637570B2 JPS637570B2 (en) 1988-02-17

Family

ID=14238238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9909284A Expired JPS637570B2 (en) 1984-05-16 1984-05-16

Country Status (1)

Country Link
JP (1) JPS637570B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627779A (en) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd Corrosion-resistant photosetting adhesive composition
JPS63168041A (en) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd Semiconductor device and manufacture thereof
JPH01188517A (en) * 1988-01-25 1989-07-27 Toagosei Chem Ind Co Ltd Production of curable composition and photosetting composition produced thereby
US7144471B2 (en) 2001-02-13 2006-12-05 International Business Machines Corporation Bonding method and apparatus
EP2670797B1 (en) 2011-01-31 2015-03-18 United Initiators GmbH & Co. KG Peroxide mixtures for the accelerated cure of ethylene-vinyl acetate
JP2015174961A (en) * 2014-03-17 2015-10-05 スリーボンドファインケミカル株式会社 Sealant for photoelectric conversion element

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627779A (en) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd Corrosion-resistant photosetting adhesive composition
JPS63168041A (en) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd Semiconductor device and manufacture thereof
JPH01188517A (en) * 1988-01-25 1989-07-27 Toagosei Chem Ind Co Ltd Production of curable composition and photosetting composition produced thereby
US7144471B2 (en) 2001-02-13 2006-12-05 International Business Machines Corporation Bonding method and apparatus
EP2670797B1 (en) 2011-01-31 2015-03-18 United Initiators GmbH & Co. KG Peroxide mixtures for the accelerated cure of ethylene-vinyl acetate
US9382405B2 (en) 2011-01-31 2016-07-05 United Initiators Gmbh & Co. Kg Peroxide blends for cross-linking ethylene vinyl acetate in an accelerated manner
EP2670797B2 (en) 2011-01-31 2018-09-12 United Initiators GmbH Peroxide mixtures for the accelerated cure of ethylene-vinyl acetate
JP2015174961A (en) * 2014-03-17 2015-10-05 スリーボンドファインケミカル株式会社 Sealant for photoelectric conversion element

Also Published As

Publication number Publication date
JPS637570B2 (en) 1988-02-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees