JPH0152902B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to a sealed IC module or element. More specifically, it relates to a encapsulated IC module or element characterized in that it is encapsulated using a curable resin composition that is primarily cured by actinic light such as ultraviolet rays and then completely cured by heating. Stop IC modules or devices are used in industrial and consumer electronics equipment. (Prior art) Resin has been used to protect electronic components such as ICs and LSIs (hereinafter abbreviated as IC modules) or elements, such as to prevent vibrations, or to improve heat dissipation. It is known to encapsulate devices. For example, IC or LSI
Liquid thermosetting liquid epoxy resins have been mainly used for back sealants and top sealants for directly drip coating semiconductor devices such as ICs and LSIs. (Problems to be Solved by the Invention) Thermosetting liquid epoxy resins have a good balance of mechanical properties, as well as excellent electrical insulation and chemical resistance, and are useful as back sealants and Although it is highly reliable as a top sealant, it has the following drawbacks. 1) Since it is a thermosetting resin, heat curing using an acid anhydride curing agent usually requires after-curing at a high temperature of 150°C or higher and for 10 hours or more. 2) In room temperature curing using amine curing agents, etc.
In order to completely cure the product, it is necessary to discharge it for several days. 3) When used as a back sealant for IC modules, etc., there is no adhesion between the aluminum cap and the ceramic substrate, causing deterioration of the semiconductor elements mounted on the module over time. 4) Since it is a thermosetting resin, it is necessary to fix the module for a long time using various jigs until the resin hardens, which reduces productivity and increases the product defect rate due to misalignment during fixation. Leads to increase. 5) Both heat curing and room temperature curing are two-component resins consisting of an epoxy resin and a curing agent, so workability is poor, and the pot life of the resin after mixing is short. 6) When the module is back-sealed, curing is slow, so the resin rises up onto the pins, leading to an increase in the product defect rate. On the other hand, in recent years, due to social demands such as resource saving, non-pollution, and safety, development of ultraviolet curable resins, which are so-called solvent-free resins, has been actively promoted. However, UV curable resins generally have a fatal flaw in that they cannot be completely cured in areas that are difficult to be irradiated with UV rays or in thick film areas where UV rays do not reach sufficiently. As an improvement method, there is a known method that uses a combination of ultraviolet curing and thermal curing using an organic peroxide. In this method, the fluidity of the resin is first lost by ultraviolet curing, and then the resin is completely cured by thermal curing with an organic peroxide, and is applied to ultraviolet curing paints and the like. However, since organic peroxides are usually used in this method, 1) storage stability is poor, 2) adhesion is poor, 3) resin tends to foam during heat curing, and 4) due to oxygen in the air. It has many disadvantages such as inhibited curing. (Means for Solving the Problem) The present inventors have solved the defects of conventional thermosetting resins and ultraviolet curable resins, and have improved fast-curing properties, adhesion, heat resistance, thermal shock resistance, and As a result of extensive research in order to obtain a back sealant for IC modules and a top sealant for semiconductor devices that have excellent impact resistance, we have developed a photopolymerizable compound containing an epoxy compound and a photopolymerizable compound having a carboxyl group in the molecule. By using a curable resin composition consisting of a chemical compound, the above-mentioned problems can be solved at once,
Backup of IC module can be done in a very short time.
We have discovered that it is possible to obtain a back sealant for IC modules and a top sealant for devices that are capable of sealing and top-sealing devices, and at the same time have excellent adhesiveness, heat resistance, thermal shock resistance, electrical insulation, etc. We have arrived at the present invention. That is, the present invention provides an epoxy compound (A) having at least two epoxy groups, a photopolymerizable compound monomer (B) having a carboxyl group, or the compound monomer (B) and another photopolymerizable compound ( A sealed IC module and an element characterized in that the IC module or element is sealed using a curable resin composition containing a mixture of C). The IC module referred to in the present invention is one in which an integrated circuit chip formed on a silicon or gallium arsenide crystal substrate is mounted on a ceramic substrate or the like and protected with an aluminum cap. Electronic components that generate electrical characteristics such as amplification, oscillation, rectification, and photoelectric conversion by moving holes or both, or by interaction between the two, and specifically include transistors, diodes, thyristors, It refers to individual semiconductor elements such as photoelectric conversion elements and magnetoelectric conversion elements, and integrated circuits such as semiconductor integrated circuits and hybrid integrated circuits in which these individual semiconductor elements are formed on one semiconductor substrate. The epoxy compound (A) having at least two epoxy groups used in the present invention is an epoxy compound having two or more epoxy groups in one molecule,
Its epoxy equivalent is 100~4000, preferably 100~
It is 1000. Representative compounds include bisphenol A,
Bisphenol F, halogenated bisphenol A
Representative examples include bisphenol type epoxy resins, which are diglycidyl ethers such as 2, and novolac type epoxy resins, which are polyglycidyl ethers such as phenol novolak and cresol novolak.
polyglycidyl ethers of polyhydric phenols with a valence of more than 2, polyhydric alcohols with a valence of 2 or more such as ethylene glycol, propylene glycol, neopentyl glycol, 1,4-butanediol, 1,6-hexanediol, trimethylolpropane, etc. and polyglycidyl ethers. These epoxy compounds can be used alone or in combination of two or more. In addition, one epoxy group is added in the molecule of allyl glycidyl ether, phenyl glycidyl ether, etc.
It can also be used in combination with its own epoxy compounds. Preferred epoxy compounds among these epoxy compounds having at least two epoxy groups include bisphenol A type epoxy compounds, phenol novolak type polyepoxy compounds, and cresol novolak type polyepoxy compounds. Examples of the photopolymerizable compound monomer (B) having a carboxyl group used in the present invention include (i) acrylic acid, methacrylic acid, itaconic acid, crotonic acid,
Unsaturated carboxylic acid compounds such as fumaric acid and (ii)
There is a compound represented by the following general formula (). (In the formula, R ₁ represents hydrogen or a methyl group, R ₂ and R ₃ each represent an aliphatic, aromatic, or alicyclic residue, A represents an ester bond, and m and n each represent 1 to 1. Indicates a positive integer of 3.) In the general formula (), R ₂ has 2 to 2 carbon atoms.
10 or a hydroxyl group-containing hydrocarbon group, R ₃
is a di- to tetravalent aliphatic polybasic acid residue having 2 to 10 carbon atoms, a di- to tetravalent aromatic polybasic acid residue having 6 to 15 carbon atoms, or a residue having 6 to 10 carbon atoms. Preferably, it is a certain di- to tetravalent alicyclic polybasic acid residue. Examples of the compound represented by the general formula () include the following compounds. Examples of the compound where m=1 and n=1 include succinic acid mono(meth)acryloyloxyethyl ester, succinic acid mono(meth)acryloyloxyethyl ester (acryloyloxyethyl ester and methacryloyloxyethyl ester, hereinafter similarly abbreviated), phthalic acid mono(meth) )
Acryloyloxyethyl ester, maleic acid mono(meth)acryloyloxyethyl ester, tetrahydrophthalic acid mono(meth)acryloyloxyethyl ester, hexahydrophthalic acid mono(meth)acryloyloxyethyl ester, endobicyclo(2.2.1) )-5-
Heptene-2,3-dicarboxylic acid mono(meth)acryloyloxyethyl ester, tetrahydrophthalic acid mono-2-(meth)acryloyloxy-1-(phenoxymethyl)ethyl ester,
Examples include phthalic acid mono-2-hydroxy-3-(meth)acryloyloxypropyl ester and succinic acid mono-2-hydroxy-3-(meth)acryloyloxypropyl ester. Examples of the compound where m=1 and n=2 include trimellitic acid mono-2-(meth)acryloyloxyethyl ester. m=1, n=3
Examples of the compound include pyromellitic acid mono-2-(meth)acryloyloxyethyl ester. Examples of the compound where m=2 and n=1 include phthalic acid mono-[2,3-bis(meth)acryloyloxyisopropyl] ester, methyltetrahydrophthalic acid mono-[2,3-bis(meth)
Examples include acryloyloxyisopropyl] ester, tetrahydrophthalic acid mono-[2,3-bis(meth)acryloyloxyisopropyl] ester, and succinic acid mono-[2,3-bis(meth)acryloyloxyisopropyl] ester. Examples of the compound where m=2 and n=2 include trimellitic acid mono-[4,5-bis(meth)acryloyloxyneopentyl] ester, trimellitic acid mono-[3,4-bis(meth)acryloyloxyisobutyl] ] Esters, etc. Examples of compounds where m=3 and n=2 include trimellitic acid mono-[3,4,5-tris(meth)
Examples include acryloyloxyneopentyl ester. Examples of compounds where m=3 and n=3 include pyromellitic acid mono-[3,4,5-tris(meth)
Examples include acryloyloxyneopentyl ester. Photopolymerizable compound monomer with carboxyl group
As (B), among the above-mentioned compounds, (ii) is particularly preferable. These photopolymerizable compound monomers (B) having a carboxyl group may be used alone or in combination of two or more, or one of the other photopolymerizable compounds (C) described below.
Used as a species or in combination with two or more species. Photopolymerizable compound monomer (B) having a carboxyl group used in the present invention and other photopolymerizable compound monomers
The amount of photopolymerizable compound monomer (B) containing one or more carboxyl groups in the molecule in the photopolymerizable compound consisting of (C) is 10 to 100% by weight.
If the amount is less than 10% by weight, the curability of the resulting resin composition will be significantly poor. The photopolymerizable compound (C) used in the present invention is a photopolymerizable compound having one or more photopolymerizable double bonds in the molecule. Examples of photopolymerizable compounds having one photopolymerizable double bond in the molecule include (i) methyl (meth)acrylate, ethyl (meth)acrylate, n- and i-propyl (meth)acrylate, Alkyl (meth)acrylates such as n-, sec- and t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, hydroxyalkyl (such as 2-hydroxyethyl (meth)acrylate) meth)acrylates, or polyoxyalkylene glycol mono(meth)acrylates such as polyethylene glycol mono(meth)acrylate and polypropylene glycol mono(meth)acrylate, and heterocycle-containing (meth)acrylates such as tetrahydrofurfuryl (meth)acrylate. aminoalkyl (meth), such as dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, etc.
acrylates, (ii) mono(meth)acrylates of alkylene oxide adducts of bisphenol A, such as ethylene oxide and prolene oxide adducts of bisphenol A, (iii) diisocyanate compounds and one or more alcoholic hydroxyl groups. A urethane-modified mono(meth)acrylate having one (meth)acryloyloxy group in the molecule obtained by reacting a terminal isocyanate group-containing compound obtained by reacting a compound in advance with an alcoholic hydroxyl group-containing (meth)acrylate. ) acrylates, (iv) epoxy mono(meth)acrylates obtained by reacting acrylic acid or methacrylic acid with a compound having one or more epoxy groups in the molecule, and (v) acrylic acid or methacrylic acid as the carboxylic acid component. Examples include oligoester mono(meth)acrylates obtained by reacting methacrylic acid and polycarboxylic acid with a polyhydric alcohol having a valence of 2 or more as an alcohol component. Examples of photopolymerizable compounds having two photopolymerizable double bonds in the molecule include (i) ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, 1,4-butanediol di (meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-
Alkylene glycol di(meth)acrylates such as hexanediol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate , polypropylene glycol di(meth)
Polyoxyalkylene glycol di(meth)acrylates such as acrylates, (ii) di(meth)acrylates of alkylene oxide adducts of bisphenol A such as ethylene oxide and propylene oxide adducts of bisphenol A, (iii) diisocyanate compounds A terminal isocyanate group-containing compound obtained by reacting two or more alcoholic hydroxyl group-containing compounds in advance with an alcoholic hydroxyl group-containing (meth)acrylate, resulting in two (meth)acryloyl groups in the molecule. Epoxy di(meth)acrylates obtained by reacting urethane-modified di(meth)acrylates having an oxy group, (iv) a compound having two or more epoxy groups in the molecule with acrylic acid or/and methacrylic acid.
Examples include acrylates, (v) oligoester di(meth)acrylates obtained by reacting acrylic acid or methacrylic acid as a carboxylic acid component, and polyhydric carboxylic acid with a polyhydric alcohol having a valence of 2 or more as an alcohol component. Examples of photopolymerizable compounds having three or more photopolymerizable double bonds in the molecule include (i) trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate,
Poly(meth)acrylates of trihydric or higher aliphatic polyhydric alcohols such as pentaerythritol tetra(meth)acrylate, (ii) terminal isocyanate obtained by reacting a diisocyanate compound with a compound containing three or more alcoholic hydroxyl groups in advance Urethane-modified poly(meth)acrylates having three or more (meth)acryloyloxy groups in the molecule obtained by reacting a group-containing compound with an alcoholic hydroxyl group-containing (meth)acrylate, (iii) There are epoxy poly(meth)acrylates obtained by reacting a compound having three or more epoxy groups with acrylic acid and/or methacrylic acid. The epoxy compound (A) used in the present invention and the photopolymerizable compound (B) having a carboxyl group, or
The blending ratio of the mixture of (B) and other photopolymerizable compounds (C) is epoxy compound (A):photopolymerizable compound [(B) or
(B) + (C)] = 10:90 to 90:10 (weight ratio), preferably epoxy compound (A): photopolymerizable compound [(B) or (B) + (C)] =20:80~80:20 (weight ratio)
is within the range of If the amount of the epoxy compound (A) is less than 10% by weight, the reaction between the photopolymerizable compound (B) having a carboxyl group and the epoxy compound (A) will be substantially too small, resulting in poor adhesiveness, heat resistance, etc. It is difficult to obtain a cured product with excellent properties. In addition, if the amount of the epoxy compound (A) exceeds 90% by weight, the viscosity of the curable resin composition will be high, resulting in poor handling, and the advantage of the curing reaction due to actinic rays, i.e., fast curing. I can't make use of it. In the present invention, in order to improve the adhesion between the aluminum cap of the IC module and the ceramic substrate, a thermal polymerization initiator and/or a thermal polymerization initiator selected from peroxyesters and/or peroxyketals is used. A polymerization initiator having both the functions of a photopolymerization initiator, for example, 3,
Addition of a polymerization initiator such as 3',4,4'-tetra-(t-butylperoxycarbonyl)benzophenone is effective. Peroxy esters include t-butylperoxyacetate, t-butylperoxyisobutyrate, t-butylperoxyoctoate,
t-Butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxybenzoate, di-t
-butyl diperoxyisophthalate, 2,5-
Dimethyl-2,5-di(benzoylperoxy)
Examples of peroxyketals include hexane, t-butylperoxyisopropyl carbonate, and 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane.
1,1-bis(t-butylperoxy)cyclohexane, 2,2-bis(t-butylperoxy)
Octane, n-butyl-4,4-bis(t-butylperoxy)valerate, 2,2-bis(t-
butylperoxy)butane, etc., which may be used alone or in combination of two or more. Examples of the polymerization initiator having the functions of both a thermal polymerization initiator and a photopolymerization initiator include 3,3',4,4'-tetra-(t-butylperoxycarbonyl)benzophenone. The amount of this thermal polymerization initiator is epoxy compound (A)
and the total amount of photopolymerizable compound (B+C)
The amount is 0.05 to 5% by weight, preferably 0.1 to 3% by weight. If the amount of the thermal polymerization initiator is less than 0.05% by weight, the curability of the light-shielding portion decreases, making it difficult to obtain a completely cured product. Furthermore, when the amount of the thermal polymerization initiator exceeds 5% by weight, the curability decreases, making it difficult to obtain a completely cured product, and at the same time, foaming and coloring of the resin become significant during heating. In the present invention, when primary curing is performed using actinic rays other than electron beams, addition of a photoinitiator is effective. Examples of the photoinitiator include ketals such as benzyl dimethyl ketal, benzoins such as benzoin methyl ether, benzoin ethyl ether, benzoin-i-propyl ether, benzoin, and α-methylbenzoin, 9,10-anthraquinone, 1- Anthraquinones such as chloranthraquinone, 2-chloroanthraquinone, 2-ethylanthraquinone, benzophenone, p-
Benzophenones such as chlorobenzophenone and p-dimethylaminobenzophenone, 2-hydroxy-2-methylpropiophenone, 1-(4-
isopropylphenyl)-2-hydroxy-2-
Propiophenones such as methylpropiophenone, suberones such as dibenzosuberone, sulfur-containing compounds such as diphenyl disulfide, tetramethylthiuram disulfide, thioxanthone, pigments such as methylene blue, eosin, fluorescein, etc. are used alone or in combination of two or more. The amount of this photoinitiator is 0.05 to 0.05 to the total amount of the epoxy compound (A) and the photopolymerizable compound (B+C).
20% by weight, preferably 0.5-10% by weight. In the present invention, if it is necessary to promote the reaction between the epoxy group and the carboxyl group, it is effective to add a reaction promoter. Examples of the reaction accelerator include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-methylimidazole, benzyldimethylamine, triethanolamine, N, These include tertiary amines such as N-dimethylaminoethanol, N,N-diethylaminoethanol, and N,N-dipropylaminoethanol, and tertiary amine salts such as triacetate and tribenzoate of tridimethylaminomethylphenol. They may be used alone or in combination of two or more. The amount of these reaction accelerators added is epoxy compound (A)
and the total amount of photopolymerizable compound (B+C)
The amount is 0.05 to 5% by weight, preferably 0.1 to 3.5% by weight. The curable resin composition of the present invention is easily produced by stirring and mixing at room temperature or under heating if necessary. In order to prevent thermal polymerization during production and dark reactions during storage, hydroquinone, hydroquinone monomethyl ether, 1-butyl-catechol, p
It is desirable to add a known thermal polymerization inhibitor such as -benzoquinone, 2,5-t-butyl-hydroquinone, or phenothiazine. The amount added is based on the photopolymerizable compound (B+C) used in the present invention.
0.001-0.1% by weight, preferably 0.001-0.05
Weight%. In addition to the above-mentioned additives, various additives such as known colorants, surface smoothing agents, antifoaming agents, thixotropic agents, and fillers may be added to the curable resin composition used in the present invention, as necessary. be able to. The method for curing the curable resin composition used in the present invention is to first cure the photopolymerizable compound (B) having a carboxyl group or a mixture of (B) and another photopolymerizable compound (C) by irradiation with actinic rays. It consists of two steps: polymerization to form a carboxyl group-containing polymer, and then heating to cause the epoxy compound (A) to react with the carboxyl groups contained in the polymer to completely cure it. In the present invention, the curable resin composition is applied to an IC using a liquid metering dispensing device such as a dispenser.
Sealing the module or semiconductor element. Specifically, the sealing method involves setting the device in a mold frame, injecting liquid resin, polymerizing it by irradiating it with actinic light, and then completely curing it by heating (see Figure 1). Set the element in the case,
After injecting liquid resin, it is polymerized by irradiation with actinic rays, and then completely cured by heating (see Figure 2).The device is immersed in liquid resin, the resin is attached to the surface of the device, and then irradiated with actinic rays. A method of polymerizing by irradiation and then completely curing by heating (see Figure 3), and a method of dropping liquid resin onto the element,
There is a method of polymerizing by irradiation with actinic rays and then completely curing by heating (see Fig. 4). Photopolymerization reaction conditions include light intensity of 20mW/cm ² to 200
In mW/ ^cm2 , the time is preferably 0.1 seconds to 5 minutes.
The thermosetting reaction conditions are preferably 40°C to 250°C and 10 seconds to 120 minutes. The cured shelving resin composition used in the present invention is irradiated with active light such as ultraviolet rays and electron beams to induce a polymerization reaction. The light source used for ultraviolet irradiation is
Sunlight, chemical lamps, low-pressure mercury lamps, high-pressure mercury lamps, carbon arc lamps, xenon lamps, metal halide lamps, etc. are used. A photoinitiator is not necessarily required when irradiating with an electron beam. As the heat source used for heating, for example, known heating methods such as an infrared heater, hot air heating, and high frequency heating are used. (Function) The curable resin composition used in the present invention is a thermosetting resin composition, an ultraviolet curable resin composition, or a conventional ultraviolet thermosetting resin composition that uses both ultraviolet curing and thermosetting with an organic peroxide. Back sealants for IC modules and top sealants for IC modules, which are cured by a reaction that is essentially different from other substances, are fast-curing, and have excellent performance such as adhesion, heat resistance, thermal shock resistance, and electrical insulation. Provide sealant. (Effects of the Invention) Particularly excellent effects of the present invention include the following points. 1) The curable resin composition used in the present invention can obtain a completely cured resin even in thick parts that are difficult to irradiate with actinic rays such as ultraviolet rays or in parts that are completely shielded from light. It has fast curing properties, which is a feature of ultraviolet curable resin, and IC
Back sealing of modules and top sealing of devices can be done in a short time. 2) The curable resin composition used in the present invention has excellent adhesion to various types of plastics, ceramics, glass, metals, etc., and can completely seal IC modules and devices. 3) When a large amount of filler is mixed or even in thick parts, the fluidity of the resin will be lost in a very short time due to UV irradiation, so it can be moved to the next process immediately, and the conventional It is possible to greatly improve productivity compared to thermosetting resins or ultraviolet thermosetting resins. 4) The epoxy compound (A) and the photopolymerizable compound ((B) or (B) and (C)) have good compatibility, and the viscosity of the resin composition can be adjusted freely. Taking advantage of these advantages, the curable resin composition used in the present invention can be used as a back sealant for IC modules and a top sealant for devices such as diodes, thyristors, hybrid ICs, resistors, capacitors, light emitting diodes, etc. Used for sealing and coating various electronic components and elements such as liquid crystal display elements, optical sensors, pressure sensors, and humidity sensors. It can also be used in fields such as paints, inks, and adhesives. (Examples) Hereinafter, examples will be given to specifically explain the present invention, but the present invention is not limited to these examples at all. In the examples, parts and % indicate parts by weight and % by weight, respectively. The resin properties of the curable resin composition and the performance of the cured product were measured by the following method. 1) Viscosity: Measured at 25°C using a Bruckfield viscometer according to JIS K6901. 2) Hardness: Pencil hardness was measured. 3) Adhesion: Measured by a cellophane tape peel test. 4) Heat resistance: A back-sealed IC module was immersed in a 260°C solder bath for 60 seconds, visually observed for any change in appearance, and then subjected to a bubble leak test. In the case of the top seal of the element, only the appearance change after immersion in a 260°C solder bath for 60 seconds was visually observed. 5) Thermal shock resistance: -40℃, 1 hour to 125℃, 1
After repeating the time heat cycle 100 times,
After visually observing whether there was any change in appearance, the sample was immersed in a fluorocarbon solvent and a bubble leak test was performed. For top sealing of elements, heat
Only changes in appearance after 100 cycles were visually observed. 6) Electrical insulation: 3mm thick according to JIS K6911
A casting plate was made and the volume resistivity was measured. Example 1 100 parts of Epicote 1001 (manufactured by Yuka Ciel Epoxy Co., Ltd.), a bisphenol A type epoxy compound, 48 parts of succinic acid monoacryloyloxyethyl ester
and tetrahydrofurfuryl acrylate 70
A portion of the mixture was placed in a stirring container and mixed and stirred at 80°C to obtain a transparent resin composition (1). The resulting resin composition (1) had a viscosity of 15 poise. This resin composition (1) 100
0.5 part of t-butyl peroxybenzoate as a thermal polymerization initiator, 0.5 part of 2-hydroxy-2-methylpropiophenone as a photoinitiator, and 0.5 part of 1-benzyl-2-methylimidazole as a curing accelerator. Cured resin composition (a)
I got it. Next, an IC was created by protecting the ceramic substrate on which the IC chip was mounted with an aluminum cap.
Cured resin composition obtained on the back side of the module (a)
After injecting using a dispenser, 80mW/
cm ² of ultraviolet rays for 10 seconds, and then heated at 150° C. for 15 minutes to cure and obtain a sealed IC module (see Figure 5). The measurement results of the obtained sealed IC module are shown in Table 1.

[Table] Comparative Example 1 100 parts of Epicote 828 (manufactured by Yuka Ciel Epoxy Co., Ltd.), a bisphenol A type epoxy compound, 80 parts of hexahydrophthalic anhydride, and 1.8 parts of benzyldimethylamine were placed in a container and heated at 50°C. The mixture was mixed and stirred to obtain a transparent thermosetting resin composition (b). The obtained thermosetting resin composition (b) had a viscosity of 180 poise. Next, in exactly the same manner as in Example 1, the obtained thermosetting resin composition (b) was injected onto the back side of the IC module, heated at 150°C for 15 minutes, and then heated at 100°C.
A 10-hour after cure was performed to obtain a sealed IC module. When we measured the adhesion of this IC module to an aluminum cap, it was found to be 70/1.
It was 00. Furthermore, the aluminum cap of the IC module and the ceramic substrate were not in close contact with each other and easily peeled off. Example 2 100 parts of Epicote 1001 (manufactured by Yuka Ciel Epoxy Co., Ltd.), a bisphenol A type epoxy compound, 50 parts of phthalic acid monoacryloyloxyethyl ester
and 70 parts of tetrahydrofurfuryl acrylate were placed in a stirring vessel, and mixed and stirred at 80°C to obtain a transparent resin composition (2). The resulting resin composition (2) had a viscosity of 47 poise. For 100 parts of this resin composition (2), 0.5 part of 2-hydroxy-2-methylpropiophenone as a photoinitiator, N as a curing accelerator,
A curable resin composition (C) was obtained by blending 0.5 part of N-diethylaminoethanol and 1.0 part of t-butyl peroxybenzoate as a thermal polymerization initiator. Next, using a dispenser, the obtained curable resin composition (C) was drip-coated onto the IC chip mounted on the ceramic substrate, followed by coating at 80°C.
After irradiating with mW/ ^cm2 ultraviolet light for 10 seconds, it was heated at 120℃ for 30 minutes.
The material was heated for a minute to cure it, and a sealing element was obtained (see FIG. 6). Table 2 shows the measurement results of the obtained sealing element.

[Table] Comparative Example 2 40 parts of diacrylate of 4 moles of ethylene oxide adduct of bisphenol A, 15 parts of tetrahydrofurfuryl acrylate, and 15 parts of trimethylolpropane triacrylate were placed in a container, mixed and stirred at room temperature, and a transparent resin composition was obtained. I got item (3). The resulting resin composition (3) had a viscosity of 4 poise. 3 parts of benzoin ethyl ether was blended with 100 parts of this resin composition (3) to form an ultraviolet curable resin composition (d).
I got it. Next, in exactly the same manner as in Example 2, using a dispenser, the obtained ultraviolet curable resin composition (d) was drip coated on the IC chip mounted on the ceramic substrate, and then coated for 80 m.
Although it was irradiated with ultraviolet rays of W/cm ² for 84 seconds, it was not completely cured. Example 3 100 parts of Epicote 1001 (manufactured by Yuka Ciel Epoxy Co., Ltd.), a bisphenol A type epoxy compound, 48 parts of succinic acid monoacryloyloxyethyl ester
1 part and 84 parts of phenoxyethyl acrylate were placed in a stirring vessel, and mixed and stirred at 80°C to obtain a transparent resin composition (4). The viscosity of the obtained resin composition (4) is
It was 26 poise. 3,3',4,4'-tetra- as a polymerization initiator per 100 parts of this resin composition (4).
A curable resin composition was prepared by blending 2 parts of (t-butylperoxycarbonyl)benzophenone (manufactured by NOF Corporation, trade name BTTB-50) and 0.5 of 1-benzyl-2-methylimidazole as a curing accelerator.
I got (e). Next, the ceramic substrate on which the IC chip was mounted was protected with an aluminum cap.
After injecting the obtained curable resin composition (e) onto the back side of the IC module, it was irradiated with ultraviolet rays of 80 mW/cm ² for 10 seconds, and then heated at 150°C for 15 minutes to cure and form the sealed IC module. Obtained. Table 3 shows the measurement results of the obtained sealed IC module.

[Table] Example 4 and Comparative Examples 3 and 4 Example 3 using the curable composition shown in Table 4
A sealed IC module was obtained in the same manner as above. Chemical resistance and water resistance tests were conducted on the obtained sealed IC module. The results are shown in Table 5.

【table】

【table】

【table】 [Brief explanation of drawings]

1 to 4 show a specific example of the sealing method.
FIG. 5 shows the sealing method in Examples 1 and 3. FIG. 6 shows a sealing method in Example 2.

Claims (1)

[Claims] 1 An epoxy compound (A) having at least two epoxy groups, a photopolymerizable compound monomer (B) having a carboxyl group, or a combination of the compound monomer (B) and another photopolymerizable compound (C) 1. A sealed IC module or element, characterized in that the IC module or element is sealed using a curable resin composition containing the mixture.