JPS63120715A - Resin composition and solder resist ink composition - Google Patents
Resin composition and solder resist ink compositionInfo
- Publication number
- JPS63120715A JPS63120715A JP61266604A JP26660486A JPS63120715A JP S63120715 A JPS63120715 A JP S63120715A JP 61266604 A JP61266604 A JP 61266604A JP 26660486 A JP26660486 A JP 26660486A JP S63120715 A JPS63120715 A JP S63120715A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- acrylate
- solder resist
- parts
- acryloylmorpholine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 title claims description 23
- 239000011342 resin composition Substances 0.000 title claims description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 229920000193 polymethacrylate Polymers 0.000 claims abstract description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 14
- 239000000126 substance Substances 0.000 abstract description 14
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 abstract description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003054 catalyst Substances 0.000 abstract description 4
- 238000010292 electrical insulation Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- 239000003112 inhibitor Substances 0.000 abstract description 3
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 17
- -1 poly(methane acrylate) Polymers 0.000 description 10
- 238000007654 immersion Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 3
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 2
- NPBCZIXJFJJSNL-UHFFFAOYSA-N C(C=C)(=O)OOCCC.C(C=C)(=O)OOCCC.C(C=C)(=O)OOCCC.C(O)C(CC)(CO)CO Chemical compound C(C=C)(=O)OOCCC.C(C=C)(=O)OOCCC.C(C=C)(=O)OOCCC.C(O)C(CC)(CO)CO NPBCZIXJFJJSNL-UHFFFAOYSA-N 0.000 description 2
- MWMBMDKWXVQCHY-UHFFFAOYSA-N C.OC(=O)C=C Chemical compound C.OC(=O)C=C MWMBMDKWXVQCHY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- JHGGYGMFCRSWIZ-UHFFFAOYSA-N 2,2-dichloro-1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C(Cl)Cl)=CC=C1OC1=CC=CC=C1 JHGGYGMFCRSWIZ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- NIUZJTWSUGSWJI-UHFFFAOYSA-M triethyl(methyl)azanium;chloride Chemical compound [Cl-].CC[N+](C)(CC)CC NIUZJTWSUGSWJI-UHFFFAOYSA-M 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、放射線硬化型の樹脂組成物及びソルダーレジ
ストインキ組成物に関し特に、プリント配線基板の永久
保護膜として使用される紫外線により硬化し、耐熱性、
耐薬品性、耐湿性、密着性及び電気絶縁性に優れたツル
ダーレジストに適するソルダーレジストインキ組成物に
関する。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to radiation-curable resin compositions and solder resist ink compositions, and particularly relates to radiation-curable resin compositions and solder resist ink compositions that are cured by ultraviolet rays and used as permanent protective films for printed wiring boards. Heat-resistant,
The present invention relates to a solder resist ink composition suitable for a solder resist having excellent chemical resistance, moisture resistance, adhesion, and electrical insulation properties.
（従来の技術す
近年、省資源、省エネルギー、作業性向上、生産性向上
などの理由により紫外線硬化型組成物が多用されて米て
いる。プリント配線基板加工分野においても同様の理由
によりソルダーレジストインキ、マーキングインキなど
種々のインキが従来の熱硬化型組成物から紫外線硬化型
組成物へと移行してきている。ソルダーレジストインキ
はいち早く紫外線硬化型組成物へと移行した。(Conventional technology) In recent years, ultraviolet curable compositions have been widely used for reasons such as saving resources, saving energy, improving workability, and improving productivity.In the field of printed wiring board processing, solder resist inks are also used for the same reasons. Various inks such as , marking ink, etc. have been transitioning from conventional thermosetting compositions to ultraviolet curable compositions.Solder resist inks were among the first to transition to ultraviolet curable compositions.
（発明が解決しようとする問題点）
しかしながら、現在この紫外線硬化型即成物の適用され
ている用途としては、ラジオ、ビデオ、テレビ等に使用
されている民生用基板と称せられる分骨に限られ、コン
ピューター、制御機器等の産業用基板といわれる分野へ
の適用は未だ行われていないのが実情である。これは、
産業用基板に使用されるソルダーレジストインキには、
民生基板用ソルダーレジストインキには、民生基板用ソ
ルダーレジストインキに要求されていない、高電気絶縁
性、加湿下における・・ンダ、耐熱性、密着性、耐薬品
性など高い性能が更求されており、現在の民生基板用ソ
ルダーレジストインキでは要求性能レベルに達していな
いためである。(Problems to be Solved by the Invention) However, the current application of this UV-curable ready-made product is limited to the so-called backbone of consumer-use circuit boards used in radios, videos, televisions, etc. The reality is that it has not yet been applied to the field of industrial substrates for computers, control equipment, etc. this is,
Solder resist inks used for industrial boards include:
Solder resist inks for consumer boards are required to have higher performance, such as high electrical insulation, resistance to humidity, heat resistance, adhesion, and chemical resistance, which are not required of solder resist inks for consumer boards. This is because current solder resist inks for consumer boards do not meet the required performance level.
（問題点を解決するための手段）
本発明者らは、上記の問題点を解決するため鋭意研究の
結果、紫外線硬化型ソルダーレジストインキに適した、
耐熱性、耐湿性、耐溶剤性、電気絶縁性及び密着性に憂
れ１こ樹脂組成物を提供することに成功した。すなわち
、本発明は、（１） エポキシ樹脂と（メタンアクリ
ル酸とを反応させて得られる１分子中に２個以上の（メ
タ）アクリロイル基を有するエポキシポリ（メタコアク
リレート（５）とアクリロイルモルホリン■と他の不飽
和基含有化合物（Ｃ）を含むことを特徴とする樹脂組成
物及
び（２） エポキシ樹脂と（メタ）アクリル酸とを反
応させて得られる１分子中に２個以上の（メタノアクリ
ル酸ル基を有するエポキシポリ（メタンアクリレート因
とアクリロイルモルホリン（Ｂ）と他の不飽和基含有化
合物（Ｃ）を含むことを特徴とするソルダーレジストイ
ンキ組成物である。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present inventors have conducted extensive research and found that the
We have succeeded in providing a resin composition with poor heat resistance, moisture resistance, solvent resistance, electrical insulation properties, and adhesion. That is, the present invention provides (1) an epoxy poly(methacrylate (5) having two or more (meth)acryloyl groups in one molecule obtained by reacting an epoxy resin with methaneacrylic acid (5) and acryloylmorpholine). and another unsaturated group-containing compound (C); This is a solder resist ink composition characterized by containing an epoxy poly(methane acrylate) having an acrylic acid group, an acryloylmorpholine (B), and another unsaturated group-containing compound (C).
本発明の樹脂組成物に使用する前記穴乃至（Ｏの成分に
ついて、具体例を示して、更に詳しく説明する。先ず（
４）成分のエポキシポリ（メタ）アクリレートは、エポ
キシ樹脂と（メタノアクリル酸（アクリル酸又はメタク
リル酸ンとを反応させ得られる１分子中に２個以上の（
メタ）アクリロイル基を有す化合物であり、使用するエ
ポキシ樹脂としては、ビスフェノールＡタイプ（例えば
、シェル化学■製、エピコート８２８．１００１．１０
０４等ン、ビスフェノールＦタイプ（例えば、シェル化
学■製、エピコートＲ−８０７）、ビスフェノールＳタ
イプ、フェノールノボラックタイプ（例えば、日本化薬
（株製ＥＰＰＮ２０１、シェル化学■製、エピコート１
５２゜１５４等）、クレゾールノボラックタイプ（例え
ば、日本化薬■製、ＥＯＣＮ−１０２，１０３等）、ヒ
ダントインタイプ等のエポキシ樹脂が挙げられる。エポ
キシ樹脂と（メタノアクリル酸とのう
反応を行〜場合、エポキシ樹脂の１化学当滑に対する（
メタ）アクリル酸の使用割合は、０．３〜２，０化学当
量であるのが好ましく、特に好ましくに、０．５〜１．
１化学当量である。反応は、触媒を使用し促進させるこ
とができる。この様な触媒はトリフェニルスチビン、メ
チルトリエチルアンモニウムクロライド等の公知の触媒
でありその使用■は、反応液の重量に対して好ましくは
、０．１〜２０％、特に好ましくは、１〜５％使用され
る。反応温度は、好ましくは６０〜１２０℃、特に好ま
しくは７０〜１００℃である。反応時の重合防止のため
に重合防止剤を添加しておくことが好ましく、そのよう
な重合防止剤には、ハイドロキノン、ｐ−メトキシフェ
ノール、フェノチアジン、Ｎ−ニトロンフェニルアミン
、銅塩等が挙げられる。その使用量は、通常反応混合物
に対して０．０１〜１重量％が好ましい。このようにし
て得られるエポキシポリ（メタノアクリレート囚は公知
である。囚成分の具体的化合物のうちで特に良好な性質
を示すものとしては、エポキシ樹脂としてフェノールノ
ボラックタイプのエポキシ樹脂を使用したエポキシポリ
アクリレートが挙げられる。■成分の配合量は、（４）
乃至（Ｃ）の成分のｍ ｔ １００重量に対して１０〜
７０重量部が好ｆしく、特に２０〜５０重量部が好まし
い。The components of the holes (O) used in the resin composition of the present invention will be explained in more detail by showing specific examples.
4) Component epoxy poly(meth)acrylate has two or more (
It is a compound having a meth)acryloyl group, and the epoxy resin used is bisphenol A type (for example, Epicoat 828.1001.10 manufactured by Shell Chemical ■).
04 etc., bisphenol F type (e.g. Shell Chemical ■, Epicoat R-807), bisphenol S type, phenol novolac type (e.g. Nippon Kayaku Co., Ltd. EPPN201, Shell Chemical ■, Epicoat 1)
52°154, etc.), cresol novolac type (for example, Nippon Kayaku ■, EOCN-102, 103, etc.), and hydantoin type epoxy resins. When carrying out a reaction between an epoxy resin and (methanoacrylic acid), one chemical reaction of the epoxy resin (
The proportion of meth)acrylic acid used is preferably 0.3 to 2.0 chemical equivalents, particularly preferably 0.5 to 1.0 chemical equivalents.
1 chemical equivalent. The reaction can be accelerated using a catalyst. Such catalysts are known catalysts such as triphenylstibine and methyltriethylammonium chloride, and the amount used is preferably 0.1 to 20%, particularly preferably 1 to 5%, based on the weight of the reaction solution. used. The reaction temperature is preferably 60 to 120°C, particularly preferably 70 to 100°C. It is preferable to add a polymerization inhibitor to prevent polymerization during the reaction, and examples of such polymerization inhibitors include hydroquinone, p-methoxyphenol, phenothiazine, N-nitron phenylamine, copper salt, etc. . The amount used is usually preferably 0.01 to 1% by weight based on the reaction mixture. The epoxy poly(methanoacrylate) obtained in this way is known.Among the specific compounds of the prison component, those showing particularly good properties include epoxy poly(methanoacrylate) using a phenol novolac type epoxy resin as the epoxy resin. Examples include acrylate. ■The amount of ingredients is (4)
10 to 100 m t of components (C) to 100 weight
It is preferably 70 parts by weight, particularly preferably 20 to 50 parts by weight.
（Ｄ成分であるアクリロイルモルホリンは、公知であり
、市場より容易に入手する事ができる。(Acryloylmorpholine, component D, is well known and can be easily obtained from the market.
例えば、異人■製、Ａ ＣＭ Ｏ等である。（Ｄ成分の
配合量は、因乃至（Ｃ）の成分の飴量１００重量部に対
して５〜５０重量部が好ましく、特に１０〜４０重量部
が好ましい。次に（Ｃ）成分は、囚成分及び＜８）成分
以外の不飽和基含有化合物であり具体的化合物としては
、２−ヒドロキシエチル（メタ）アクリレート、カルピ
トール（メタ）アクリレート、フェニルオキシエチル（
メタ）アクリレート、テトラヒドロフルフリル（メタ）
アクリレート、インボロニル（メタ）アクリレート、ジ
シクロペンタジェンエトキシ（メタ）アクリレート、水
添ジシクロペンタジェン（メタンアクリレート、トリメ
チロールプロパントリ（メタノアクリレート、トリメチ
ロールプロパントリエトキシトリ（メタ）アクリレート
、トリメチロールプロパントリプロポキシトリ（メタ）
アクリレート、ペンタエリスリトールトリ（メタンアク
リレート、ヒドロキシピパリン酸エステルネオペンチル
グリコールジ（メタ）アクリレート（例えば、日本化薬
■製、ＫＡＹＡＲＡＤ ＭＡＮＤＡ）、２−ヒドロキシ
エチル（メタノアクリレートのリン酸エステル（例えば
、日本化薬■製、ＫＡＹＡＭＡ ＰＭｌ、ＰＭ２）、２
−ヒドロキシエチル（メタノアクリレートのε−カプロ
ラクトン付加物のリン酸エステル（例えば、日本化薬■
製、ＫＡＹＡＭＡ ＰＭ２１等う等が挙げられる。特
に好ましい（Ｃ）成分としては、カルピトールアクリレ
ート、フェニルオキシエチルアクリレート、トリメチロ
ールプロパントリアクリレート、トリメチロールプロパ
ントリプロポキシトリアクリレート、ヒドロキシピバリ
ン酸エステルネオペンチルグリコールジアクリレート等
が挙げられる。For example, it is made by Ijinjin, ACM O, etc. (The blending amount of component D is preferably 5 to 50 parts by weight, particularly preferably 10 to 40 parts by weight, based on 100 parts by weight of candy of components (C) to Component (C). Specific examples of unsaturated group-containing compounds other than component and <8) include 2-hydroxyethyl (meth)acrylate, calpitol (meth)acrylate, phenyloxyethyl (
meth) acrylate, tetrahydrofurfuryl (meth)
Acrylate, inbornyl (meth)acrylate, dicyclopentadiene ethoxy (meth)acrylate, hydrogenated dicyclopentadiene (methane acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane triethoxytri(meth)acrylate, trimethylolpropane Tripropoxytri (meth)
acrylate, pentaerythritol tri(methane acrylate, hydroxypiparic acid ester neopentyl glycol di(meth)acrylate (e.g. Nippon Kayaku, KAYARAD MANDA), 2-hydroxyethyl (phosphate ester of methanoacrylate (e.g. Nippon Kayaku, KAYARAD MANDA), Made by Kayaku ■, KAYAMA PMl, PM2), 2
-Hydroxyethyl (phosphate ester of ε-caprolactone adduct of methanoacrylate (e.g., Nippon Kayaku ■
and KAYAMA PM21. Particularly preferred component (C) includes carpitol acrylate, phenyloxyethyl acrylate, trimethylolpropane triacrylate, trimethylolpropane triproxytriacrylate, hydroxypivalate neopentyl glycol diacrylate, and the like.
（Ｃ）成分の配合量は、■乃至（Ｃ）の成分の総量１０
０重量部に対して、１０〜７０重量部が好ましく、特に
２０゛〜６０重量部が好ましい。本発明の樹脂組成物（
ソルダーレジストインキ組開始剤を使用する必要がある
。光重合開始剤としては、公知のどのような光重合開始
剤であっても良いが配合後の貯蔵安定性の良い事が要求
される。この様な光重合開始剤としては、例えハ、ベン
ゾインエチルエーテル、ベンゾインブチルエーテルなど
のベンゾインアルキルエーテル系、２．２−ジェトキシ
アセトフェノン、４−フェノキシ−２，２−ジクロロア
セトフェノンなどのアセトフェノン系、２−ヒドロキシ
−２−メチルプロピオフェノン、４′−インプロピル−
２−ヒドロキシ−２−メチルプロピオフェノンなどのプ
ロピオフェノン糸、ベンジルジメチルケタール、１−ヒ
ドロキシシクロへキシルフェニルケトン及び２−エチル
アントラキノン、２！クロロアントラキノンなどのアン
トラキノン糸、２−クロロチオキサントン、２．４−ジ
エチルチオキサントンなどのチオキサントン系元重合開
始剤等があげられる。特に好ましい光重合開始剤として
は、２−エチルアントラキノン、２．４−ジェトキシチ
オキサントン等が挙げられる。これら光重合開始剤は、
一種でも、二種以上任童の割合で混合使用してもかまわ
ない。そ つの使用量は、通常、樹脂組成物（ソルダー
レジストインキ組成物）の０．１〜１０重景％好ましく
は１〜５重量％である。The blending amount of component (C) is the total amount of components from ■ to (C) 10
It is preferably 10 to 70 parts by weight, particularly preferably 20 to 60 parts by weight. The resin composition of the present invention (
It is necessary to use a solder resist ink initiator. As the photopolymerization initiator, any known photopolymerization initiator may be used, but it is required to have good storage stability after blending. Examples of such photopolymerization initiators include benzoin alkyl ethers such as benzoin ethyl ether and benzoin butyl ether, acetophenones such as 2,2-jethoxyacetophenone and 4-phenoxy-2,2-dichloroacetophenone, and -Hydroxy-2-methylpropiophenone, 4'-inpropyl-
Propiophenone threads such as 2-hydroxy-2-methylpropiophenone, benzyl dimethyl ketal, 1-hydroxycyclohexylphenyl ketone and 2-ethylanthraquinone, 2! Examples include anthraquinone threads such as chloroanthraquinone, and thioxanthone-based polymerization initiators such as 2-chlorothioxanthone and 2,4-diethylthioxanthone. Particularly preferred photopolymerization initiators include 2-ethylanthraquinone and 2,4-jethoxythioxanthone. These photoinitiators are
It is okay to use one type or a mixture of two or more types at the same ratio. The amount used is usually 0.1 to 10% by weight, preferably 1 to 5% by weight of the resin composition (solder resist ink composition).
本発明の樹脂組成物はソルダーレジストインキに有用で
ある他、金属の保護コーティング等にも使用できる。The resin composition of the present invention is useful not only as a solder resist ink but also as a protective coating for metals.
本発明のソルダーレジストインキ組成物を用いて印刷す
る場合、スクリーン印刷法またはオフセット印刷法によ
り印刷されるが、その場合の印刷性を向上させるため、
例えば、メルク、炭酸カルシウム、アルミナ、硫酸バリ
ウム、マイカなどの体質顔料、およびレベリング剤、着
色顔料、種変剤、増粘剤、キレート剤などを本発明組成
物に加えてもかまわない。本発明の組成物は、紫外線を
照射することにより常法により硬化させることができる
。When printing using the solder resist ink composition of the present invention, printing is performed by a screen printing method or an offset printing method, but in order to improve printability in that case,
For example, extender pigments such as Merck, calcium carbonate, alumina, barium sulfate, and mica, as well as leveling agents, colored pigments, speciation agents, thickeners, chelating agents, and the like may be added to the composition of the present invention. The composition of the present invention can be cured by conventional methods by irradiating it with ultraviolet rays.
（実施例）
以下、本発明を実施例により具体的に説明する。なお実
施例中の部は、重量部である。(Example) Hereinafter, the present invention will be specifically explained with reference to Examples. Note that parts in the examples are parts by weight.
畔施例１゜
エポキシポリ（メタ）アクリレートとしてフ工ノールノ
ボラック型エポキシ樹脂（シェル化学■製、エピコート
１５４）とアクリル酸の当量付加物１６部、アクリロイ
ルモルホリン（異人■製、ＡＣＭＯ）１７部、ヒドロキ
シピバリン酸エステルネオペンチルグリコールジアクリ
レート（日本化薬■製、ＫＡＹＡＲＡＤ ＭＡＮＤＡ）
１４部、トリメチロールプロパントリアクリレート（日
本化薬■製、ＫＡＹＡＲＡＤ ＴＭＰＴＡ）１３部、
シアニングリーンｔｓ部、タルク３０部、モダフロー（
モンサンド社製のレベリング剤）１部及び２−エチル・
アントラキノン１部を加え５０〜８０℃で＋ −に混合
した後、三本ロール（■弁上製作所製）で十分に混練し
たものを、スクリーンにタテ２０１１０１、ヨコ３０闘
のパターンをもつスクリーンを用いてスクリーン印刷法
により、プリント配線板の銅箔上に印刷し、紫外線で硬
化した所、硬化塗膜の鉛筆硬度は３Ｈ，常態、４０℃９
０％ＲＨ４時間の加湿処理及び８０’Ｃ温水１時間浸漬
直後における２６０℃、１２０秒間のハンダ浸漬におい
てフクレ、ハガレを生じなかった。ヌ、絶縁抵抗は１．
５ＸＩＯΩであった。Example 1 Epoxy poly(meth)acrylate: 16 parts of an equivalent adduct of phenol novolak type epoxy resin (manufactured by Shell Chemical ■, Epicoat 154) and acrylic acid, 17 parts of acryloylmorpholine (manufactured by Ijin ■, ACMO), Hydroxypivalic acid ester neopentyl glycol diacrylate (manufactured by Nippon Kayaku, KAYARAD MANDA)
14 parts, 13 parts of trimethylolpropane triacrylate (manufactured by Nippon Kayaku ■, KAYARAD TMPTA),
Cyanine Green TS part, Talc 30 parts, Modaflow (
Leveling agent manufactured by Monsando) 1 part and 2-ethyl.
Add 1 part of anthraquinone and mix at + - at 50-80°C, then thoroughly knead with three rolls (manufactured by Bengami Seisakusho) using a screen with a pattern of 201101 vertically and 30 horizontally. The pencil hardness of the cured film is 3H, normal state, 40℃9.
No blistering or peeling occurred during humidification treatment at 0% RH for 4 hours and solder immersion at 260°C for 120 seconds immediately after immersion in 80'C warm water for 1 hour. nu, insulation resistance is 1.
It was 5XIOΩ.
実施例２゜
エポキシポリ（メタ）アクリレートとして、フェノール
・ノボラック型エポキシ樹脂（日本化薬■製、ＥＰＰＮ
−２０１）とアクリル酸の当量付加物２１．５部、アク
リロイルモルホリン（異人■製、ＡＣＭＯ）２７．６部
、トリメチロールプロパントリプロポキシトリアクリレ
ート（日本化薬■製、ＫＡＹＡＲＡＤ ＴＰＡ−３３
０）２０．９部、シアニングリーン１．５ 部、タルク
３０部、モダフロー１部、及びイルガキュアー６５１（
チバ・ガイギー社裂、光重合開始剤）３部を加え、実施
例１と同様に混線、印刷、硬化した所、硬化塗膜の鉛筆
硬度は３Ｈ１常態、４０ ’Ｃ９０％ＲＩ−１４時間の
加湿処理及び８０°Ｃ温水１時間浸漬直後における２６
０℃、１２０秒間のハンダ浸漬においてフクレ、ハガレ
を生じなかった。又絶縁抵抗は５．ＯＸ １０”Ωであ
った。Example 2゜As epoxy poly(meth)acrylate, phenol novolak type epoxy resin (manufactured by Nippon Kayaku ■, EPPN
-201) and acrylic acid, 27.6 parts of acryloylmorpholine (manufactured by Ijin ■, ACMO), trimethylolpropane tripropoxy triacrylate (manufactured by Nippon Kayaku ■, KAYARAD TPA-33).
0) 20.9 parts, cyanine green 1.5 parts, talc 30 parts, Modaflow 1 part, and Irgacure 651 (
After adding 3 parts of Ciba Geigy Co., Ltd., photopolymerization initiator), cross-linking, printing, and curing in the same manner as in Example 1, the pencil hardness of the cured film was 3H1 normal, 40'C90%RI-humidified for 14 hours. 26 immediately after treatment and immersion in 80°C hot water for 1 hour
No blistering or peeling occurred during solder immersion at 0°C for 120 seconds. Also, the insulation resistance is 5. OX 10”Ω.
実施例３゜
エポキシポリ（メタ）アクリレートとしては、フェノー
ル・ノボラック型エポキシ樹脂（シェル化学■製、エビ
コー）］ ５４）とアクリル酸の当量付加物１６部、ビ
スフェノールＦ型エポキシ樹脂（シェル化学■製、エピ
コートＲ−８０７）とアクリル酸のｉｔ付加物１６部、
アクリロイルモルホリン（異人■製、ＡＣＭＯ）１０．
５部、カルピトールアクリレート１７．５部、トリメチ
ロールプロパントリプロポキシトリアクリレート（日本
化薬（掬製、ＫＡＹＡＲＡＤ ＴＰＡ−３，３０）１０
．０部、シアニングリーン１．５］ タルク３０部、モ
ダフロー１部及び２−二チルアントラキノン１部を加え
実施例Ｉと同様に混線、印刷、硬化した所、硬化塗膜の
鉛筆硬度５Ｈ，常態、４０°Ｇ９０％ＲＨ４時間の加湿
処理及び８０℃温水１時間浸漬直後における２６０℃、
１２０秒間のハンダ浸漬においてフクレ、ハガレを生じ
ながった。ヌ、絶縁抵抗は、１．０Ｘ１０ Ωであった
。Example 3 Epoxy poly(meth)acrylates include 16 parts of an equivalent adduct of phenol novolac type epoxy resin (manufactured by Shell Chemical ■, Ebicor)] 54) and acrylic acid, and bisphenol F type epoxy resin (manufactured by Shell Chemical ■, Ebicor). , Epicote R-807) and 16 parts of it adduct of acrylic acid,
Acryloylmorpholine (manufactured by Ijin ■, ACMO) 10.
5 parts, carpitol acrylate 17.5 parts, trimethylolpropane tripropoxy triacrylate (Nippon Kayaku Co., Ltd., KAYARAD TPA-3,30) 10
．． 0 parts, cyanine green 1.5 parts] 30 parts of talc, 1 part of Modaflow and 1 part of 2-dithylanthraquinone were mixed, printed and cured in the same manner as in Example I. The pencil hardness of the cured film was 5H, normal condition. 260°C immediately after humidification treatment at 40°G, 90% RH for 4 hours and immersion in 80°C warm water for 1 hour,
No blistering or peeling occurred during solder immersion for 120 seconds. The insulation resistance was 1.0×10 Ω.
比較例１゜
実施例１の配合組成の中で、アクリロイルモルホリンの
ところをトリメチロールプロパントリアクリレートにか
えた以外は、実施例１と同様にして硬化した所、硬化塗
膜の鉛筆硬度は、４Ｈ１常態、４０℃９０％ＲＨ４時間
の加湿処理及び８０℃温水１時間浸漬直後における２６
０℃、６０秒のハンダ浸漬においてフクレ、ハガレが発
生した。Comparative Example 1゜Cured in the same manner as in Example 1 except that acryloylmorpholine in the formulation of Example 1 was replaced with trimethylolpropane triacrylate. The pencil hardness of the cured coating was 4H1. Normal state, 4 hours of humidification treatment at 40°C, 90% RH, and 1 hour of immersion in 80°C warm water.
Blistering and peeling occurred during solder immersion at 0°C for 60 seconds.
又、絶縁抵抗は１．０Ｘ１０ Ωであった。Further, the insulation resistance was 1.0×10 Ω.
（発明の効果）
本発明の樹脂組成物及びソルダーレジストインキ組成物
は、耐熱性、耐湿性、耐溶剤性及び′ポ気絶縁性に優れ
、ソルダーレジストに％ＫＪする。(Effects of the Invention) The resin composition and solder resist ink composition of the present invention have excellent heat resistance, moisture resistance, solvent resistance, and porosity insulation properties, and are superior to solder resists by %KJ.
Claims (2)
て得られる１分子中に２個以上の（メタ）アクリロイル
基を有するエポキシポリ（メタ）アクリレート（Ａ）と
アクリロイルモルホリン（Ｂ）と他の不飽和基含有化合
物（Ｃ）を含むことを特徴とする樹脂組成物。(1) Epoxy poly(meth)acrylate (A) having two or more (meth)acryloyl groups in one molecule obtained by reacting an epoxy resin and (meth)acrylic acid, acryloylmorpholine (B), and others A resin composition comprising an unsaturated group-containing compound (C).
て得られる１分子中に２個以上の（メタ）アクリロイル
基を有するエポキシポリ（メタ）アクリレート（Ａ）と
アクリロイルモルホリン（Ｂ）と他の不飽相基含有化合
分（Ｃ）を含むことを特徴とするソルダーレジストイン
キ組成物。(2) Epoxy poly(meth)acrylate (A) having two or more (meth)acryloyl groups in one molecule obtained by reacting an epoxy resin and (meth)acrylic acid, acryloylmorpholine (B), and others A solder resist ink composition comprising an unsaturated phase group-containing compound (C).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61266604A JPH0623325B2 (en) | 1986-11-11 | 1986-11-11 | Solder resist ink composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61266604A JPH0623325B2 (en) | 1986-11-11 | 1986-11-11 | Solder resist ink composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63120715A true JPS63120715A (en) | 1988-05-25 |
| JPH0623325B2 JPH0623325B2 (en) | 1994-03-30 |
Family
ID=17433119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61266604A Expired - Fee Related JPH0623325B2 (en) | 1986-11-11 | 1986-11-11 | Solder resist ink composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623325B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150355A (en) * | 1986-12-12 | 1988-06-23 | Nippon Kayaku Co Ltd | Coating composition |
| JP2010043150A (en) * | 2008-08-11 | 2010-02-25 | Nippon Carbide Ind Co Inc | Curable resin composition |
| JP2017537986A (en) * | 2014-09-29 | 2017-12-21 | アグフア−ゲヴエルト | Etch-resistant inkjet ink for manufacturing conductive patterns |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195171A (en) * | 1984-03-19 | 1985-10-03 | Mitsubishi Rayon Co Ltd | Ultraviolet-curing ink composition |
| JPS61243869A (en) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | Resist ink composition |
| JPS62199608A (en) * | 1986-02-27 | 1987-09-03 | Kohjin Co Ltd | Diluent for ultraviolet-cured resin and electron radiation-cured resin |
-
1986
- 1986-11-11 JP JP61266604A patent/JPH0623325B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195171A (en) * | 1984-03-19 | 1985-10-03 | Mitsubishi Rayon Co Ltd | Ultraviolet-curing ink composition |
| JPS61243869A (en) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | Resist ink composition |
| JPS62199608A (en) * | 1986-02-27 | 1987-09-03 | Kohjin Co Ltd | Diluent for ultraviolet-cured resin and electron radiation-cured resin |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150355A (en) * | 1986-12-12 | 1988-06-23 | Nippon Kayaku Co Ltd | Coating composition |
| JP2010043150A (en) * | 2008-08-11 | 2010-02-25 | Nippon Carbide Ind Co Inc | Curable resin composition |
| JP2017537986A (en) * | 2014-09-29 | 2017-12-21 | アグフア−ゲヴエルト | Etch-resistant inkjet ink for manufacturing conductive patterns |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623325B2 (en) | 1994-03-30 |
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