JPS6148800B2 - - Google Patents
Info
- Publication number
- JPS6148800B2 JPS6148800B2 JP54032754A JP3275479A JPS6148800B2 JP S6148800 B2 JPS6148800 B2 JP S6148800B2 JP 54032754 A JP54032754 A JP 54032754A JP 3275479 A JP3275479 A JP 3275479A JP S6148800 B2 JPS6148800 B2 JP S6148800B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- type epoxy
- acrylate
- type
- low molecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 229920003986 novolac Polymers 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- -1 methacryloyl group Chemical group 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 7
- 229920001225 polyester resin Polymers 0.000 claims description 7
- 239000004645 polyester resin Substances 0.000 claims description 7
- 229920003987 resole Polymers 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 5
- 239000003504 photosensitizing agent Substances 0.000 claims description 4
- 239000000049 pigment Substances 0.000 claims description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 239000004606 Fillers/Extenders Substances 0.000 claims description 2
- 238000004040 coloring Methods 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 2
- 239000005977 Ethylene Substances 0.000 claims 2
- 239000000976 ink Substances 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
【発明の詳細な説明】
本発明は、印刷配線板製造、金属精密加工等に
使用する光重合性不飽和化合物を主成分とした光
硬化型保護膜形成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photocurable protective film-forming product containing a photopolymerizable unsaturated compound as a main component and used in printed wiring board manufacturing, metal precision processing, and the like.
特に、従来、印刷配線板業界において、回路の
永久保護および部品はんだ付け時のはんだブリツ
ジ防止などのために用いられるソルダーレジスト
インキは、エポキシ樹脂、メラミン樹脂、尿素樹
脂、アルキツド樹脂あるいはこれらの変性樹脂を
主成分とし、加熱反応により硬化皮膜を形成する
ものであつた。 In particular, solder resist inks conventionally used in the printed wiring board industry to permanently protect circuits and prevent solder bridging during soldering of components are made of epoxy resins, melamine resins, urea resins, alkyd resins, or modified resins of these. was the main component and formed a cured film by heating reaction.
しかし、前記ソルダーレジストインキは、硬化
時間に、10〜20分間要するため生産性が悪く、し
かも有機溶剤を含有しているため、印刷時の溶剤
臭、硬化反応に共なうホルムアルデヒドの生成に
よるホルマリン臭の発生、大気汚染の問題があ
る。また、不揮発分含量が60〜80％程度であるた
め耐薬品性、耐熱性、電気特性などを得るのに比
較的厚塗りしなければならない。そのため、塗布
寸法精度が低い等の欠点がある。また、こうした
加熱は、プリント回路基板の特性の低下、さらに
次工程に移る前に冷却工程を必要とするので作業
性、生産性を低下せしめるのが実情であつた。 However, the solder resist ink has poor productivity because it takes 10 to 20 minutes to harden, and since it contains an organic solvent, there is a solvent odor during printing, and formalin due to the formation of formaldehyde during the curing reaction. There are problems with odor generation and air pollution. Furthermore, since the nonvolatile content is approximately 60 to 80%, it must be applied relatively thickly to obtain chemical resistance, heat resistance, electrical properties, etc. Therefore, there are drawbacks such as low coating dimensional accuracy. In addition, such heating deteriorates the characteristics of the printed circuit board and requires a cooling step before proceeding to the next step, which reduces workability and productivity.
かかる、問題を解消するため、ラジカル架橋性
のエチレン性不飽和二重結合を有する単量体、お
よびプレポリマー並びに光重合開始剤を主成分と
し、紫外線照射により高速に硬化し、かつ、無溶
剤のため安全性の高いソルダーレジストインキが
提案され、リジツド基板用に応用されている。 In order to solve this problem, we developed a new material that is mainly composed of a monomer having a radically crosslinkable ethylenically unsaturated double bond, a prepolymer, and a photopolymerization initiator, which cures rapidly by ultraviolet irradiation, and is solvent-free. Therefore, highly safe solder resist inks have been proposed and are being applied to rigid substrates.
しかし、前記ソルダーレジストは、半田耐熱性
にすぐれているが、可とう性に劣つており、ま
た、可とう性にすぐれている材料は、半田耐熱性
に劣り、フレキシブルプリント基板に適用出来な
い。基板の厚さが薄く熱容量が小さくフレキシブ
ルであるため、きびしい半田耐熱性と同時に、銅
表面への密着性、ポリイミド、ポリエステル、エ
ポキシなどの樹脂フイルムとの密着性、さらに可
とう性が要求される。フレキシブルプリント基板
は軽量、薄形、屈曲性という特徴を有し、１ 機
器内の空間を有効に利用した配線レイアウトがで
きる、２ 柔軟性を利用した新しい部品設計がで
きる、３ 加工工程、実装工程が簡素化されコス
トダウンができる、などの利点があり、広い応用
が期待されているが、ソルダーレジストはその特
性を充分満足するに至つていない。 However, the solder resist has excellent soldering heat resistance but poor flexibility, and materials with excellent flexibility have poor soldering heat resistance and cannot be applied to flexible printed circuit boards. Because the board is thin, has a small heat capacity, and is flexible, it requires not only severe soldering heat resistance, but also adhesion to copper surfaces, adhesion to resin films such as polyimide, polyester, and epoxy, and flexibility. . Flexible printed circuit boards have the characteristics of being lightweight, thin, and flexible. 1. Wiring layouts that make effective use of the space inside the device are possible. 2. New component designs that take advantage of flexibility are possible. 3. Processing and mounting processes. It has the advantage of simplifying the process and reducing costs, and is expected to be widely applied, but solder resists have not yet fully satisfied these characteristics.
本発明は、かかる欠点を解消し、耐熱性、可と
う性にすぐれ、特にフレキシブルプリント基板に
適用して効果のある光硬化型ソルダーレジストイ
ンキを提供することを目的とするものである。 The object of the present invention is to eliminate such drawbacks and provide a photocurable solder resist ink that has excellent heat resistance and flexibility and is particularly effective when applied to flexible printed circuit boards.
本発明に用いるレゾール型またはノボラツク型
エポキシアクリレート系またはメタクリレート系
樹脂は、エポキシ基を２個以上有するレゾール型
フエノールあるいはレゾール型クレゾールまたは
フエノールノボラツクあるいはクレゾールノボラ
ツクからのグリシジルエーテル化合物たとえば、
シエル化学社製「エピコート152、エピコート
154」、ダウ、ケミカル社製「DER431」日本チバ
ガイギー社製「CIBA EPN 1138、1139」など
と、アクリル酸またはメタクリル酸とを反応させ
て得られる。 The resol type or novolac type epoxy acrylate type or methacrylate type resin used in the present invention is a glycidyl ether compound derived from resol type phenol or resol type cresol or phenol novolac or cresol novolac having two or more epoxy groups, for example,
Manufactured by Ciel Chemical Co., Ltd. “Epicoat 152, Epicoat
It is obtained by reacting acrylic acid or methacrylic acid with ``154'', ``DER431'' manufactured by Dow Chemical Co., Ltd., ``CIBA EPN 1138, 1139'' manufactured by Ciba Geigy Japan, etc.
また、アクリロイル基またはメタクリロイル基
含有の低分子量ポリエステル樹脂は、（メタ）ア
クリル酸、２−ヒドロキシエチル（メタ）アクリ
レート、２−ヒドロキシプロピル（メタ）アクリ
レート、２−ヒドロキシエチル（メタ）アクリレ
ート、ジメチルアミノエチル（メタ）アクリレー
ト、ジエチレングリコールジ（メタ）アクリレー
ト、ネオペンチルグリコールジ（メタ）アクリレ
ート、トリエチレングリコールジ（メタ）アクリ
レート、トリメチロールプロパントリ（メタ）ア
クリレート、ペンタエリスリトールテトラ（メ
タ）アクリレート、テトラエチレングリコールジ
（メタ）アクリレートなどがあげられる。 In addition, low molecular weight polyester resins containing acryloyl or methacryloyl groups include (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, dimethylamino Ethyl (meth)acrylate, diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, tetraethylene Examples include glycol di(meth)acrylate.
また、光増感剤としては、ベンゾイン、ベンゾ
インメチルエーテル、ベンゾインイソプロピルエ
ーテル、ベンゾインブチルエーテル、ベンジル、
ベンゾフエノン等、通常の光硬化性組成物に使用
されるものである。 In addition, as photosensitizers, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin butyl ether, benzyl,
These include benzophenone and the like, which are commonly used in photocurable compositions.
本発明組成物は以上の構成を必須成分とし、こ
れに、通常、光硬化性の塗料、インキなどに使用
する体質顔料、着色顔料、チキソ性付与剤、安定
剤などを均一に分散させ、塗膜性状の改良、適性
な印刷性を確保するものである。また、要求特性
から必要に応じて、ビスフエノールＡ型エポキシ
アクリレート系、ビスフエノールＦ型エポキシア
クリレート系、ウレタンアクリレート系、シリコ
ーンアクリレート系などの種々のレジンを加える
ことがあり、前記、必須成分のみに限定するもの
ではない。 The composition of the present invention has the above-mentioned composition as an essential component, and in this, extender pigments, coloring pigments, thixotropic agents, stabilizers, etc., which are usually used in photocurable paints and inks, are uniformly dispersed. This improves film properties and ensures appropriate printability. In addition, various resins such as bisphenol A type epoxy acrylate type, bisphenol F type epoxy acrylate type, urethane acrylate type, and silicone acrylate type may be added depending on the required properties. It is not limited.
また、本発明組成物は通常の光硬化性組成物を
硬化させる際に使用される光発生源、たとえば、
通常の超高圧水銀灯、高圧水銀灯、低圧水銀灯、
メタルハライドランプ、キセノン灯、ケミカルラ
ンプ等があげられる。 The composition of the present invention can also be used with light sources used in curing conventional photocurable compositions, such as
Regular ultra-high pressure mercury lamps, high pressure mercury lamps, low pressure mercury lamps,
Examples include metal halide lamps, xenon lamps, and chemical lamps.
次に、実施例をあげ、本発明を具体的に説明す
る。 Next, the present invention will be specifically explained with reference to Examples.
実施例 １
(1) フエノールノボラツク型エポキシアクリレー
ト 12重量％
(2) ２−ヒドロキシエチルメタクリレート
35重量％
(3) ２官能ポリエステルアクリレート 12重量％
(4) ２−エチルアントラキノン １重量％
(5) モダフロー １重量％
(6) タルク 35重量％
(7) アエロジル ２重量％
(8) フタロシアニングリーン ２重量％
これらの成分を均一に混合し、本発明のソルダ
ーレジストインキ用光硬化性樹脂組成物を得た。
なお、本組成物は100％不揮発分である。Example 1 (1) Phenol novolac type epoxy acrylate 12% by weight (2) 2-hydroxyethyl methacrylate
35% by weight (3) Bifunctional polyester acrylate 12% by weight (4) 2-ethylanthraquinone 1% by weight (5) Modaflow 1% by weight (6) Talc 35% by weight (7) Aerosil 2% by weight (8) Phthalocyanine Green 2 Weight % These components were mixed uniformly to obtain a photocurable resin composition for solder resist ink of the present invention.
Note that this composition is 100% non-volatile.
次に、250〜300メツシユスクリーンを用い、ポ
リイミド製フレキシブルプリント基板上に印刷塗
布し、80W/cmの高圧水銀灯により、15秒間照射
（照射距離10cm）して、保護皮膜を形成させた。 Next, using a 250 to 300 mesh screen, the film was printed onto a polyimide flexible printed circuit board, and irradiated for 15 seconds (irradiation distance: 10 cm) with an 80 W/cm high-pressure mercury lamp to form a protective film.
上記、印刷物の諸特性は、
(1) 半田耐熱性（JIS Ｃ−6481）：260±５ 10
秒、異常なし
(2) 可とう性（JIS Ｐ−8115）：0.38R 180度折
曲げ、異常なし
(3) 密着性（JIS Ｄ−0202）：ゴバン目セロテー
プはくりテスト100／100
(4) 鉛筆硬度（JIS Ｄ−0202）：3H
また、この組成物は貯蔵安定性にすぐれ、常温
で６カ月以上安定であつた。 The properties of the printed matter listed above are: (1) Solder heat resistance (JIS C-6481): 260±5 10
Seconds, no abnormalities (2) Flexibility (JIS P-8115): 0.38R 180 degree bending, no abnormalities (3) Adhesion (JIS D-0202): Goban cellotape peeling test 100/100 (4) Pencil hardness (JIS D-0202): 3H In addition, this composition had excellent storage stability and was stable for more than 6 months at room temperature.
実施例 ２
(1) クレゾールノボラツク型エポキシアクリレー
ト 20重量％
(2) ２−ヒドロキシプロピルアクリレート
25重量％
(3) ２官能ポリエステルアクリレート 20重量％
(4) ベンゾインイソプロピルエーテル １重量％
(5) モダフロー １重量％
(6) 炭酸カルシウム 30重量％
(7) アエロジル １重量％
(8) フタロシアニングリーン ２重量％
これらの成分を均一に混合し、100％不揮発分
の光硬化性樹脂組成物を得た。Example 2 (1) Cresol novolac type epoxy acrylate 20% by weight (2) 2-hydroxypropyl acrylate
25% by weight (3) Bifunctional polyester acrylate 20% by weight (4) Benzoin isopropyl ether 1% by weight (5) Modaflow 1% by weight (6) Calcium carbonate 30% by weight (7) Aerosil 1% by weight (8) Phthalocyanine Green 2 Weight % These components were mixed uniformly to obtain a photocurable resin composition containing 100% non-volatile content.
次に、実施例１と同じ方法で印刷処理し、同様
の印刷物特性を得た。以上の如く、本発明の光硬
化性樹脂組成物およびソルダーレジストはレゾー
ル型エポキシ樹脂のアクリレート系、ノボラツク
型エポキシ樹脂のアクリレート系、レゾール型エ
ポキシ樹脂のメタクリレート系、ノボラツク型エ
ポキシ樹脂のメタクリレート系、以上の樹脂群の
単独あるいは複数の組合せよりなる樹脂を12〜20
重量％と、当該樹脂より末端エチレン基数の少な
い不飽和化合物を12〜47重量％と、光増感剤とを
含有していることを特徴としているものであるた
め、耐熱性、可とう性及び密着性がバランス良く
得られ、各種フレキシブルプリント基板用ソルダ
ーレジストインキとして充分実用に供せられるも
のであり、また本発明の光硬化性樹脂組成物は、
すぐれた耐熱性、可とう性、耐薬品性、感光性を
バランスよく兼ねそなえていることから、光硬化
性接着剤、注型剤、塗料、印刷版材料としても用
い得る。 Next, printing was carried out in the same manner as in Example 1 to obtain similar print characteristics. As described above, the photocurable resin composition and solder resist of the present invention include acrylate-based resol-type epoxy resins, acrylate-based novolak-type epoxy resins, methacrylate-based resol-type epoxy resins, methacrylate-based novolak-type epoxy resins, and more. 12 to 20 resins consisting of a single resin group or a combination of multiple resins.
% by weight, 12 to 47% by weight of an unsaturated compound with a lower number of terminal ethylene groups than the resin, and a photosensitizer, so it has excellent heat resistance, flexibility and The photocurable resin composition of the present invention provides well-balanced adhesion and can be put to practical use as a solder resist ink for various flexible printed circuit boards.
Because it has excellent heat resistance, flexibility, chemical resistance, and photosensitivity in a well-balanced manner, it can also be used as a photocurable adhesive, casting agent, paint, and printing plate material.
Claims (1)
ノボラツク型エポキシ樹脂のアクリレート系、レ
ゾール型エポキシ樹脂のメタクリレート系、ノボ
ラツク型エポキシ樹脂のメタクリレート系、以上
の樹脂群の単独あるいは複数の組合せよりなる樹
脂を10〜20重量％と、当該樹脂より末端エチレン
基数の少ない不飽和化合物を12〜47重量％と、光
増感剤とを含有してなる光硬化性樹脂組成物。 ２ 不飽和化合物は、アクリロイル基、メタクリ
ロイル基の少なくとも一方を有する低分子量ポリ
エステル樹脂である特許請求の範囲第１項記載の
光硬化性樹脂組成物。 ３ 不飽和化合物をアクリロイル基含有低分子量
ポリエステル樹脂と、当該樹脂よりも末端エチレ
ン基数の少ないメタクリロイル基含有低分子量ポ
リエステル樹脂としたことを特徴とする特許請求
の範囲第１項記載の光硬化性樹脂組成物。 ４ レゾール型エポキシ樹脂のアクリレート系、
ノボラツク型エポキシ樹脂のアクリレート系、レ
ゾール型エポキシ樹脂のメタクリレート系、ノボ
ラツク型エポキシ樹脂のメタクリレート系、以上
の樹脂群の単独あるいは複数の組合せよりなる樹
脂を10〜20重量％と、当該樹脂より末端エチレン
基数の少ない不飽和化合物を12〜47重量％と光増
感剤と体質顔料と着色顔料を含有してなるソルダ
ーレジスト。 ５ 不飽和化合物をアクリロイル基、メタクリロ
イル基の少なくとも一方を有する低分子量ポリエ
ステル樹脂とした特許請求の範囲第４項記載のソ
ルダーレジスト。 ６ 不飽和化合物をアクリロイル基含有低分子量
ポリエステル樹脂と、当該樹脂よりも末端エチレ
ン基数の少ないメタクリロイル基含有低分子量ポ
リエステル樹脂とした特許請求の範囲第４項記載
のソルダーレジスト。[Claims] 1. Acrylate type resol type epoxy resin,
Acrylate type novolak type epoxy resin, methacrylate type resol type epoxy resin, methacrylate type novolac type epoxy resin, 10 to 20% by weight of a resin consisting of a single or a combination of the above resin groups, and terminal ethylene from the resin. A photocurable resin composition containing 12 to 47% by weight of an unsaturated compound with a small number of groups and a photosensitizer. 2. The photocurable resin composition according to claim 1, wherein the unsaturated compound is a low molecular weight polyester resin having at least one of an acryloyl group and a methacryloyl group. 3. The photocurable resin according to claim 1, wherein the unsaturated compound is an acryloyl group-containing low molecular weight polyester resin and a methacryloyl group-containing low molecular weight polyester resin having a smaller number of terminal ethylene groups than the resin. Composition. 4 Acrylate type resol type epoxy resin,
Acrylate type novolak type epoxy resin, methacrylate type resol type epoxy resin, methacrylate type novolac type epoxy resin, 10 to 20% by weight of a resin consisting of a single or a combination of the above resin groups, and terminal ethylene from the resin. A solder resist containing 12 to 47% by weight of an unsaturated compound with a small number of groups, a photosensitizer, an extender pigment, and a coloring pigment. 5. The solder resist according to claim 4, wherein the unsaturated compound is a low molecular weight polyester resin having at least one of an acryloyl group and a methacryloyl group. 6. The solder resist according to claim 4, wherein the unsaturated compound is an acryloyl group-containing low molecular weight polyester resin and a methacryloyl group-containing low molecular weight polyester resin having a smaller number of terminal ethylene groups than the resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
| CA000347923A CA1151789A (en) | 1979-03-20 | 1980-03-19 | Photopolymerization type resin composition and solder resist containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55127097A JPS55127097A (en) | 1980-10-01 |
| JPS6148800B2 true JPS6148800B2 (en) | 1986-10-25 |
Family
ID=12367623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3275479A Granted JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55127097A (en) |
| CA (1) | CA1151789A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018081985A (en) * | 2016-11-15 | 2018-05-24 | 株式会社京写 | Printed Wiring Board |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825371A (en) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | Ultraviolet-curing ink composition for printed circuit |
| JPS59213779A (en) * | 1983-04-22 | 1984-12-03 | Meidensha Electric Mfg Co Ltd | Ultraviolet-curing solder resist ink |
| JPS603624A (en) * | 1983-06-22 | 1985-01-10 | Takao Ono | Photosensitive composition |
| JPS6049071A (en) * | 1983-08-30 | 1985-03-18 | Toshiba Chem Corp | Marking ink |
| JPS61252546A (en) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | Photosensitive resist ink and manufacture of ps plate by using it and method for etching this ps plate |
| JPH0689284B2 (en) * | 1985-06-29 | 1994-11-09 | 株式会社アサヒ化学研究所 | Curable resin composition for solder-resist ink |
| US4650743A (en) * | 1985-07-31 | 1987-03-17 | E. I. Du Pont De Nemours And Company | Optical coating composition |
| JPS62157029A (en) * | 1985-12-28 | 1987-07-13 | Unitika Ltd | Photosensitive resin composition |
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| JP2571800B2 (en) * | 1987-11-27 | 1997-01-16 | イビデン株式会社 | Photosensitive adhesive for electroless plating and printed wiring board |
| JP2700245B2 (en) * | 1988-02-20 | 1998-01-19 | ソマール株式会社 | Curable adhesive composition |
| JPH0748109B2 (en) * | 1988-04-01 | 1995-05-24 | イビデン株式会社 | Photosensitive resin composition |
| US5196296A (en) * | 1989-10-06 | 1993-03-23 | Nippon Steel Corporation | Epoxy acrylate resins and photosensitive resin compositions therefrom |
| JP2772227B2 (en) * | 1993-11-15 | 1998-07-02 | イビデン株式会社 | Printed wiring board |
| JP3254572B2 (en) | 1996-06-28 | 2002-02-12 | バンティコ株式会社 | Photopolymerizable thermosetting resin composition |
| JP4523679B2 (en) * | 1998-06-22 | 2010-08-11 | 太陽インキ製造株式会社 | Green resist ink composition for printed wiring board using halogen-free color pigment |
| JP5245099B2 (en) * | 2008-04-25 | 2013-07-24 | 独立行政法人 国立印刷局 | Authenticity discriminating resin composition, authenticity discriminating ink composition and its authenticity discrimination printed matter |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888197A (en) * | 1972-02-25 | 1973-11-19 | ||
| JPS5012567A (en) * | 1973-06-07 | 1975-02-08 | ||
| JPS5083760A (en) * | 1973-11-28 | 1975-07-07 | ||
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (en) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | TORANJISUTAZO FUKUKI |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
| US4064287A (en) * | 1974-05-24 | 1977-12-20 | Dynachem Corporation | Process for treating selected areas of a surface with solder |
-
1979
- 1979-03-20 JP JP3275479A patent/JPS55127097A/en active Granted
-
1980
- 1980-03-19 CA CA000347923A patent/CA1151789A/en not_active Expired
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888197A (en) * | 1972-02-25 | 1973-11-19 | ||
| JPS5012567A (en) * | 1973-06-07 | 1975-02-08 | ||
| JPS5083760A (en) * | 1973-11-28 | 1975-07-07 | ||
| US4064287A (en) * | 1974-05-24 | 1977-12-20 | Dynachem Corporation | Process for treating selected areas of a surface with solder |
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (en) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | TORANJISUTAZO FUKUKI |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018081985A (en) * | 2016-11-15 | 2018-05-24 | 株式会社京写 | Printed Wiring Board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55127097A (en) | 1980-10-01 |
| CA1151789A (en) | 1983-08-09 |
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