JPH0152902B2 - - Google Patents

Info

Publication number
JPH0152902B2
JPH0152902B2 JP59168557A JP16855784A JPH0152902B2 JP H0152902 B2 JPH0152902 B2 JP H0152902B2 JP 59168557 A JP59168557 A JP 59168557A JP 16855784 A JP16855784 A JP 16855784A JP H0152902 B2 JPH0152902 B2 JP H0152902B2
Authority
JP
Japan
Prior art keywords
meth
resin composition
compound
epoxy
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59168557A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146054A (ja
Inventor
Junichi Sakamoto
Hideo Myake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP59168557A priority Critical patent/JPS6146054A/ja
Publication of JPS6146054A publication Critical patent/JPS6146054A/ja
Publication of JPH0152902B2 publication Critical patent/JPH0152902B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59168557A 1984-08-10 1984-08-10 封止ｉｃモジユ−ルまたは素子 Granted JPS6146054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168557A JPS6146054A (ja) 1984-08-10 1984-08-10 封止ｉｃモジユ−ルまたは素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168557A JPS6146054A (ja) 1984-08-10 1984-08-10 封止ｉｃモジユ−ルまたは素子

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP22716484A Division JPS6147727A (ja) 1984-10-29 1984-10-29 硬化型樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6146054A JPS6146054A (ja) 1986-03-06
JPH0152902B2 true JPH0152902B2 (enrdf_load_stackoverflow) 1989-11-10

Family

ID=15870230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168557A Granted JPS6146054A (ja) 1984-08-10 1984-08-10 封止ｉｃモジユ−ルまたは素子

Country Status (1)

Country Link
JP (1) JPS6146054A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0313574B1 (en) * 1986-07-07 1993-03-24 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
JPH01188517A (ja) * 1988-01-25 1989-07-27 Toagosei Chem Ind Co Ltd 硬化用組成物の製造方法および光硬化用組成物
DE4237132C1 (de) * 1992-11-03 1994-07-07 Siemens Ag UV-aktiviert thermisch härtendes einkomponentiges Reaktionsharzsystem
JP5427374B2 (ja) * 2008-06-25 2014-02-26 協立化学産業株式会社 電子部品モジュールおよび電子部品モジュールの製造方法
WO2010007859A1 (ja) * 2008-07-18 2010-01-21 Dic株式会社 エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止材、及び光半導体装置
JP2015002237A (ja) * 2013-06-14 2015-01-05 三菱電機株式会社 電子基板及びそれを用いた制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047732B2 (ja) * 1977-06-08 1985-10-23 ソニー株式会社 電子部品の被覆方法
JPS60263415A (ja) * 1984-06-12 1985-12-26 ダイセル化学工業株式会社 樹脂封止型電子部品

Also Published As

Publication number Publication date
JPS6146054A (ja) 1986-03-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees