JPH0242371B2 - - Google Patents

Info

Publication number
JPH0242371B2
JPH0242371B2 JP22716484A JP22716484A JPH0242371B2 JP H0242371 B2 JPH0242371 B2 JP H0242371B2 JP 22716484 A JP22716484 A JP 22716484A JP 22716484 A JP22716484 A JP 22716484A JP H0242371 B2 JPH0242371 B2 JP H0242371B2
Authority
JP
Japan
Prior art keywords
meth
compound
epoxy
curing
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22716484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6147727A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP22716484A priority Critical patent/JPS6147727A/ja
Publication of JPS6147727A publication Critical patent/JPS6147727A/ja
Publication of JPH0242371B2 publication Critical patent/JPH0242371B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP22716484A 1984-10-29 1984-10-29 硬化型樹脂組成物 Granted JPS6147727A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22716484A JPS6147727A (ja) 1984-10-29 1984-10-29 硬化型樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22716484A JPS6147727A (ja) 1984-10-29 1984-10-29 硬化型樹脂組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59168557A Division JPS6146054A (ja) 1984-08-10 1984-08-10 封止icモジユ−ルまたは素子

Publications (2)

Publication Number Publication Date
JPS6147727A JPS6147727A (ja) 1986-03-08
JPH0242371B2 true JPH0242371B2 (enrdf_load_stackoverflow) 1990-09-21

Family

ID=16856492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22716484A Granted JPS6147727A (ja) 1984-10-29 1984-10-29 硬化型樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6147727A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59197401A (ja) * 1983-04-26 1984-11-09 Nippon Oil & Fats Co Ltd 光重合開始剤
JPH04234422A (ja) * 1990-10-31 1992-08-24 Internatl Business Mach Corp <Ibm> 二重硬化エポキシバックシール処方物
WO2010007859A1 (ja) * 2008-07-18 2010-01-21 Dic株式会社 エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止材、及び光半導体装置

Also Published As

Publication number Publication date
JPS6147727A (ja) 1986-03-08

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Legal Events

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