JPS6024093A - セラミツク配線基板の製造法 - Google Patents
セラミツク配線基板の製造法Info
- Publication number
- JPS6024093A JPS6024093A JP11297784A JP11297784A JPS6024093A JP S6024093 A JPS6024093 A JP S6024093A JP 11297784 A JP11297784 A JP 11297784A JP 11297784 A JP11297784 A JP 11297784A JP S6024093 A JPS6024093 A JP S6024093A
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- ceramic
- layer
- wiring
- hole conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11297784A JPS6024093A (ja) | 1984-06-04 | 1984-06-04 | セラミツク配線基板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11297784A JPS6024093A (ja) | 1984-06-04 | 1984-06-04 | セラミツク配線基板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6024093A true JPS6024093A (ja) | 1985-02-06 |
JPS6155280B2 JPS6155280B2 (enrdf_load_stackoverflow) | 1986-11-27 |
Family
ID=14600301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11297784A Granted JPS6024093A (ja) | 1984-06-04 | 1984-06-04 | セラミツク配線基板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6024093A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62271493A (ja) * | 1986-05-20 | 1987-11-25 | 日立マクセル株式会社 | 半導体装置 |
JP2003017816A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多数個取り配線基板 |
JP2010056513A (ja) * | 2008-07-28 | 2010-03-11 | Kyocera Corp | 多数個取り配線基板の製造方法ならびに多数個取り配線基板および配線基板および電子装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2447284A1 (de) * | 1973-10-04 | 1975-04-17 | Minnesota Mining & Mfg | Verfahren zum aufbringen einer gleichmaessigen goldplattierung an keramischen substraten |
JPS51125865A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Method of manufacturing ceramic wiring substrate |
-
1984
- 1984-06-04 JP JP11297784A patent/JPS6024093A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2447284A1 (de) * | 1973-10-04 | 1975-04-17 | Minnesota Mining & Mfg | Verfahren zum aufbringen einer gleichmaessigen goldplattierung an keramischen substraten |
JPS5062773A (enrdf_load_stackoverflow) * | 1973-10-04 | 1975-05-28 | ||
JPS51125865A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Method of manufacturing ceramic wiring substrate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62271493A (ja) * | 1986-05-20 | 1987-11-25 | 日立マクセル株式会社 | 半導体装置 |
JP2003017816A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多数個取り配線基板 |
JP2010056513A (ja) * | 2008-07-28 | 2010-03-11 | Kyocera Corp | 多数個取り配線基板の製造方法ならびに多数個取り配線基板および配線基板および電子装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6155280B2 (enrdf_load_stackoverflow) | 1986-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4328530A (en) | Multiple layer, ceramic carrier for high switching speed VLSI chips | |
US3926746A (en) | Electrical interconnection for metallized ceramic arrays | |
US4525597A (en) | Ceramic leadless packages and a process for manufacturing the same | |
US5700549A (en) | Structure to reduce stress in multilayer ceramic substrates | |
KR100489820B1 (ko) | 세라믹 다층기판 및 그 제조방법 | |
JPS58114498A (ja) | 基板 | |
JPS5842639B2 (ja) | セラミツク配線基板の製造法 | |
JPH10270819A (ja) | 表面実装用電子部品とその製造方法 | |
JPH01261849A (ja) | 半導体装置の製造方法 | |
JPH10313157A (ja) | プリント基板 | |
US5790386A (en) | High I/O density MLC flat pack electronic component | |
JP2010182981A (ja) | 配線基板多数個取り用の母基板 | |
JPS6024093A (ja) | セラミツク配線基板の製造法 | |
EP0098114B1 (en) | Leadless chip carrier semiconductor integrated circuit device | |
JPH05102621A (ja) | 導電パターン | |
JP2943773B2 (ja) | Icパッケージ | |
JP3064751B2 (ja) | 多層型ジャンパーチップの製造方法 | |
JP2000068149A (ja) | 積層電子部品及びその製造方法 | |
JP3994312B2 (ja) | プリント配線板およびその製造方法およびインターポーザ基板 | |
JP2009194000A (ja) | 多数個取り配線基板 | |
JPH03215995A (ja) | 多層配線モジュール | |
JPH025027B2 (enrdf_load_stackoverflow) | ||
JPH0727989B2 (ja) | セラミックパッケージ型半導体装置の製造方法 | |
JP4303539B2 (ja) | 多数個取り配線基板 | |
JP2743524B2 (ja) | 混成集積回路装置 |