JPS60238497A - 部分メツキなどの部分処理方法 - Google Patents

部分メツキなどの部分処理方法

Info

Publication number
JPS60238497A
JPS60238497A JP9336384A JP9336384A JPS60238497A JP S60238497 A JPS60238497 A JP S60238497A JP 9336384 A JP9336384 A JP 9336384A JP 9336384 A JP9336384 A JP 9336384A JP S60238497 A JPS60238497 A JP S60238497A
Authority
JP
Japan
Prior art keywords
masking tape
plating
treatment
light
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9336384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6152237B2 (enExample
Inventor
Gi Iohara
庵原　議
Takemasa Uemura
植村　剛正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9336384A priority Critical patent/JPS60238497A/ja
Publication of JPS60238497A publication Critical patent/JPS60238497A/ja
Publication of JPS6152237B2 publication Critical patent/JPS6152237B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP9336384A 1984-05-09 1984-05-09 部分メツキなどの部分処理方法 Granted JPS60238497A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9336384A JPS60238497A (ja) 1984-05-09 1984-05-09 部分メツキなどの部分処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9336384A JPS60238497A (ja) 1984-05-09 1984-05-09 部分メツキなどの部分処理方法

Publications (2)

Publication Number Publication Date
JPS60238497A true JPS60238497A (ja) 1985-11-27
JPS6152237B2 JPS6152237B2 (enExample) 1986-11-12

Family

ID=14080204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9336384A Granted JPS60238497A (ja) 1984-05-09 1984-05-09 部分メツキなどの部分処理方法

Country Status (1)

Country Link
JP (1) JPS60238497A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033335A (ja) * 2000-07-17 2002-01-31 Dainippon Printing Co Ltd 短冊状リードフレームの搬送方法
WO2008001611A1 (en) * 2006-06-28 2008-01-03 Omron Corporation Method for producing metal film, foundation composition, metal film and use thereof
US8273462B2 (en) 2007-12-27 2012-09-25 Omron Corporation Process for producing metal film
US8361628B2 (en) 2007-12-27 2013-01-29 Omron Corporation Process for producing metal film
US8361629B2 (en) 2008-09-26 2013-01-29 Omron Corporation Half mirror and process for producing same
WO2016056467A1 (ja) * 2014-10-06 2016-04-14 日東電工株式会社 アノダイズ処理用マスキングシート
US9711666B2 (en) 2011-03-15 2017-07-18 Omron Corporation Sensor provided with metal oxide film and use thereof
CN110121540A (zh) * 2016-12-30 2019-08-13 3M创新有限公司 用于在铬酸阳极化中掩蔽铝表面的带材和方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3778672B1 (en) 2018-03-30 2023-09-20 Zeon Corporation Hollow resin particle and sheet

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033335A (ja) * 2000-07-17 2002-01-31 Dainippon Printing Co Ltd 短冊状リードフレームの搬送方法
WO2008001611A1 (en) * 2006-06-28 2008-01-03 Omron Corporation Method for producing metal film, foundation composition, metal film and use thereof
US8273461B2 (en) 2006-06-28 2012-09-25 Omron Corporation Method of producing metal film
US8273462B2 (en) 2007-12-27 2012-09-25 Omron Corporation Process for producing metal film
US8361628B2 (en) 2007-12-27 2013-01-29 Omron Corporation Process for producing metal film
US8361629B2 (en) 2008-09-26 2013-01-29 Omron Corporation Half mirror and process for producing same
US9711666B2 (en) 2011-03-15 2017-07-18 Omron Corporation Sensor provided with metal oxide film and use thereof
WO2016056467A1 (ja) * 2014-10-06 2016-04-14 日東電工株式会社 アノダイズ処理用マスキングシート
WO2016056470A1 (ja) * 2014-10-06 2016-04-14 日東電工株式会社 薬液処理された金属部材の製造方法
JPWO2016056470A1 (ja) * 2014-10-06 2017-08-31 日東電工株式会社 薬液処理された金属部材の製造方法
CN110121540A (zh) * 2016-12-30 2019-08-13 3M创新有限公司 用于在铬酸阳极化中掩蔽铝表面的带材和方法

Also Published As

Publication number Publication date
JPS6152237B2 (enExample) 1986-11-12

Similar Documents

Publication Publication Date Title
EP0157508B1 (en) Thin adhesive sheet for use in working semiconductor wafers
JPS60223139A (ja) 半導体ウエハ固定用接着薄板
US5637395A (en) Thin adhesive sheet for working semiconductor wafers
JP5953337B2 (ja) マスキングテープ及びウエハの表面処理方法
US6126772A (en) Method for resist removal, and adhesive or adhesive sheet for use in the same
JPS62153376A (ja) ウェハダイシング用粘着シート
JPS60238497A (ja) 部分メツキなどの部分処理方法
JPS5850164B2 (ja) 表面保護方法
JP3394625B2 (ja) 半導体ウエハに付着した異物の除去用粘着テ―プ
KR20020063818A (ko) 레지스트 제거를 위한 접착 테이프 및 방법
JPH08139067A (ja) 半導体ウエハに付着した異物の除去用粘着テ―プと除去方法
JP3581190B2 (ja) レジスト剥離用接着シ―ト類と剥離方法
JP2011026595A (ja) めっき保護テープ
JPS60201647A (ja) 半導体ウエハの固定方法
JPS60201646A (ja) 半導体ウエハの固定方法
JPH0472386B2 (enExample)
JP2824784B2 (ja) 半導体ウェハ加工用シート
JP2006229076A (ja) Ｉｃチップの製造方法
JP2868720B2 (ja) レジストの除去方法、およびこれに用いる接着剤もしくは接着シート類
JPS60201643A (ja) 半導体ウエハの処理方法
JPH0637010A (ja) レジスト除去方法および硬化型感圧接着シ―ト類
JPS62153375A (ja) ウエハダイシング用粘着シート
JPS6197848A (ja) 半導体チツプの製造法
JP4099221B2 (ja) レジスト除去方法
JPH0582868B2 (enExample)