JPS60238134A - 真空処理装置 - Google Patents

真空処理装置

Info

Publication number
JPS60238134A
JPS60238134A JP59076271A JP7627184A JPS60238134A JP S60238134 A JPS60238134 A JP S60238134A JP 59076271 A JP59076271 A JP 59076271A JP 7627184 A JP7627184 A JP 7627184A JP S60238134 A JPS60238134 A JP S60238134A
Authority
JP
Japan
Prior art keywords
container
vacuum processing
feed
containers
air cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59076271A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257378B2 (enrdf_load_stackoverflow
Inventor
Shigeki Taniguchi
硲野　重喜
Makoto Sotozono
外園　誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd filed Critical Toshiba Corp
Priority to JP59076271A priority Critical patent/JPS60238134A/ja
Publication of JPS60238134A publication Critical patent/JPS60238134A/ja
Publication of JPS6257378B2 publication Critical patent/JPS6257378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP59076271A 1984-04-16 1984-04-16 真空処理装置 Granted JPS60238134A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59076271A JPS60238134A (ja) 1984-04-16 1984-04-16 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59076271A JPS60238134A (ja) 1984-04-16 1984-04-16 真空処理装置

Publications (2)

Publication Number Publication Date
JPS60238134A true JPS60238134A (ja) 1985-11-27
JPS6257378B2 JPS6257378B2 (enrdf_load_stackoverflow) 1987-12-01

Family

ID=13600572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59076271A Granted JPS60238134A (ja) 1984-04-16 1984-04-16 真空処理装置

Country Status (1)

Country Link
JP (1) JPS60238134A (enrdf_load_stackoverflow)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01209737A (ja) * 1988-02-17 1989-08-23 Teru Kyushu Kk 基板処理装置及び基板処理方法
JPH022605A (ja) * 1987-12-23 1990-01-08 Texas Instr Inc <Ti> 自動化フォトリソグラフィック・ワーク・セル
JPH0297035A (ja) * 1988-05-24 1990-04-09 Balzers Ag 真空処理装置及びそれによるワーク処理方法
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPH0338051A (ja) * 1989-06-29 1991-02-19 Applied Materials Inc 半導体ウェーハのハンドリング方法及び装置
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
JPH03184331A (ja) * 1989-12-13 1991-08-12 Hitachi Ltd 複数真空処理装置
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5344542A (en) * 1986-04-18 1994-09-06 General Signal Corporation Multiple-processing and contamination-free plasma etching system
JPH07142355A (ja) * 1993-11-19 1995-06-02 Sony Corp レジスト処理方法およびレジスト処理装置
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
JP2007520820A (ja) * 2004-02-03 2007-07-26 エクセラーエックス， エルエルシー 製造のためのシステムおよび方法
JP2008028036A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置
EP1146548A4 (en) * 1998-11-17 2009-04-15 Tokyo Electron Ltd VACUUM TREATMENT SYSTEM
JP2011023743A (ja) * 2010-10-01 2011-02-03 Hitachi High-Technologies Corp 真空処理装置
WO2023054044A1 (ja) * 2021-09-28 2023-04-06 芝浦機械株式会社 表面処理装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5344542A (en) * 1986-04-18 1994-09-06 General Signal Corporation Multiple-processing and contamination-free plasma etching system
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPH022605A (ja) * 1987-12-23 1990-01-08 Texas Instr Inc <Ti> 自動化フォトリソグラフィック・ワーク・セル
JPH01209737A (ja) * 1988-02-17 1989-08-23 Teru Kyushu Kk 基板処理装置及び基板処理方法
JPH0297035A (ja) * 1988-05-24 1990-04-09 Balzers Ag 真空処理装置及びそれによるワーク処理方法
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
JPH0338051A (ja) * 1989-06-29 1991-02-19 Applied Materials Inc 半導体ウェーハのハンドリング方法及び装置
JPH03184331A (ja) * 1989-12-13 1991-08-12 Hitachi Ltd 複数真空処理装置
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
JPH07142355A (ja) * 1993-11-19 1995-06-02 Sony Corp レジスト処理方法およびレジスト処理装置
EP1146548A4 (en) * 1998-11-17 2009-04-15 Tokyo Electron Ltd VACUUM TREATMENT SYSTEM
JP2007520820A (ja) * 2004-02-03 2007-07-26 エクセラーエックス， エルエルシー 製造のためのシステムおよび方法
US8298054B2 (en) 2004-02-03 2012-10-30 Xcellerex, Inc. System and method for manufacturing
US9671798B2 (en) 2004-02-03 2017-06-06 Ge Healthcare Bio-Sciences Corp. System and method for manufacturing
JP2008028036A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置
JP2011023743A (ja) * 2010-10-01 2011-02-03 Hitachi High-Technologies Corp 真空処理装置
WO2023054044A1 (ja) * 2021-09-28 2023-04-06 芝浦機械株式会社 表面処理装置
TWI831391B (zh) * 2021-09-28 2024-02-01 日商芝浦機械股份有限公司 表面處理裝置

Also Published As

Publication number Publication date
JPS6257378B2 (enrdf_load_stackoverflow) 1987-12-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term