JPS60206139A - 半導体材料の水切乾燥装置 - Google Patents

半導体材料の水切乾燥装置

Info

Publication number
JPS60206139A
JPS60206139A JP6385784A JP6385784A JPS60206139A JP S60206139 A JPS60206139 A JP S60206139A JP 6385784 A JP6385784 A JP 6385784A JP 6385784 A JP6385784 A JP 6385784A JP S60206139 A JPS60206139 A JP S60206139A
Authority
JP
Japan
Prior art keywords
semiconductor material
main shaft
gripper
sliding ring
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6385784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458687B2 (US06521211-20030218-C00004.png
Inventor
Seiichiro Sogo
相合　征一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP6385784A priority Critical patent/JPS60206139A/ja
Publication of JPS60206139A publication Critical patent/JPS60206139A/ja
Publication of JPH0458687B2 publication Critical patent/JPH0458687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Centrifugal Separators (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP6385784A 1984-03-30 1984-03-30 半導体材料の水切乾燥装置 Granted JPS60206139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6385784A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6385784A JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS60206139A true JPS60206139A (ja) 1985-10-17
JPH0458687B2 JPH0458687B2 (US06521211-20030218-C00004.png) 1992-09-18

Family

ID=13241424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6385784A Granted JPS60206139A (ja) 1984-03-30 1984-03-30 半導体材料の水切乾燥装置

Country Status (1)

Country Link
JP (1) JPS60206139A (US06521211-20030218-C00004.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (US06521211-20030218-C00004.png) * 1972-06-10 1974-03-02
JPS5737837A (en) * 1980-08-20 1982-03-02 Toshiba Corp Drying device for semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924852U (US06521211-20030218-C00004.png) * 1972-06-10 1974-03-02
JPS5737837A (en) * 1980-08-20 1982-03-02 Toshiba Corp Drying device for semiconductor wafer

Also Published As

Publication number Publication date
JPH0458687B2 (US06521211-20030218-C00004.png) 1992-09-18

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