JPS60201651A - 半導体用リ−ドフレ−ム - Google Patents

半導体用リ−ドフレ−ム

Info

Publication number
JPS60201651A
JPS60201651A JP5889884A JP5889884A JPS60201651A JP S60201651 A JPS60201651 A JP S60201651A JP 5889884 A JP5889884 A JP 5889884A JP 5889884 A JP5889884 A JP 5889884A JP S60201651 A JPS60201651 A JP S60201651A
Authority
JP
Japan
Prior art keywords
copper
lead frame
iron
alloy
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5889884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512858B2 (enrdf_load_stackoverflow
Inventor
Osamu Yoshioka
修 吉岡
Ryozo Yamagishi
山岸　良三
Yoshiaki Wakashima
若島　喜昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Priority to JP5889884A priority Critical patent/JPS60201651A/ja
Publication of JPS60201651A publication Critical patent/JPS60201651A/ja
Publication of JPH0512858B2 publication Critical patent/JPH0512858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5889884A 1984-03-26 1984-03-26 半導体用リ−ドフレ−ム Granted JPS60201651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5889884A JPS60201651A (ja) 1984-03-26 1984-03-26 半導体用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5889884A JPS60201651A (ja) 1984-03-26 1984-03-26 半導体用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS60201651A true JPS60201651A (ja) 1985-10-12
JPH0512858B2 JPH0512858B2 (enrdf_load_stackoverflow) 1993-02-19

Family

ID=13097611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5889884A Granted JPS60201651A (ja) 1984-03-26 1984-03-26 半導体用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS60201651A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166553A (ja) * 1986-01-18 1987-07-23 Mitsubishi Electric Corp 樹脂封止型半導体装置
KR100286631B1 (ko) * 1992-01-17 2001-04-16 웨인스테인 폴 접착력을 향상시킨 전자 패키지용 리드 프레임
EP1469514A3 (en) * 2003-04-16 2005-07-13 Shinko Electric Industries Co., Ltd. Conductor substrate, semiconductor device and production method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817275A (ja) * 1981-07-24 1983-02-01 Toshiba Corp パイロツト弁装置
JPS58181888A (ja) * 1982-04-02 1983-10-24 Furukawa Electric Co Ltd:The 銀被覆材料とその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817275A (ja) * 1981-07-24 1983-02-01 Toshiba Corp パイロツト弁装置
JPS58181888A (ja) * 1982-04-02 1983-10-24 Furukawa Electric Co Ltd:The 銀被覆材料とその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166553A (ja) * 1986-01-18 1987-07-23 Mitsubishi Electric Corp 樹脂封止型半導体装置
KR100286631B1 (ko) * 1992-01-17 2001-04-16 웨인스테인 폴 접착력을 향상시킨 전자 패키지용 리드 프레임
EP1469514A3 (en) * 2003-04-16 2005-07-13 Shinko Electric Industries Co., Ltd. Conductor substrate, semiconductor device and production method thereof
US7301226B2 (en) 2003-04-16 2007-11-27 Shinko Electric Industries Co., Ltd. Conductor substrate, semiconductor device and production method thereof
US7524702B2 (en) 2003-04-16 2009-04-28 Shinko Electric Industries Co., Ltd. Conductor substrate, semiconductor device and production method thereof
EP1833089A3 (en) * 2003-04-16 2010-04-14 Shinko Electric Industries Co., Ltd. Method of producing a conductor substrate for mounting a semiconductor element

Also Published As

Publication number Publication date
JPH0512858B2 (enrdf_load_stackoverflow) 1993-02-19

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