JPS60183753A - 固体電子デバイス取付用座板 - Google Patents
固体電子デバイス取付用座板Info
- Publication number
- JPS60183753A JPS60183753A JP60001577A JP157785A JPS60183753A JP S60183753 A JPS60183753 A JP S60183753A JP 60001577 A JP60001577 A JP 60001577A JP 157785 A JP157785 A JP 157785A JP S60183753 A JPS60183753 A JP S60183753A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyimide
- amide
- silicone rubber
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 229920002379 silicone rubber Polymers 0.000 claims description 16
- 239000004945 silicone rubber Substances 0.000 claims description 16
- 150000001408 amides Chemical class 0.000 claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 8
- 241000237503 Pectinidae Species 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000015654 memory Effects 0.000 claims 1
- 235000020637 scallop Nutrition 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- -1 sulfur nitride Chemical class 0.000 claims 1
- 239000008280 blood Substances 0.000 description 7
- 210000004369 blood Anatomy 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 241000208140 Acer Species 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 101150018201 C11L gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000011511 Diospyros Nutrition 0.000 description 1
- 241000723267 Diospyros Species 0.000 description 1
- LNQCUTNLHUQZLR-VNPYQEQNSA-N Iridin Natural products O(C)c1c(O)c2C(=O)C(c3cc(OC)c(OC)c(O)c3)=COc2cc1O[C@H]1[C@@H](O)[C@@H](O)[C@H](O)[C@H](CO)O1 LNQCUTNLHUQZLR-VNPYQEQNSA-N 0.000 description 1
- 235000008708 Morus alba Nutrition 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 101100064373 Swinepox virus (strain Kasza) DUT gene Proteins 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000004262 dental pulp cavity Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002631 hypothermal effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 108010047623 iridine Proteins 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/02—Cellular or porous
- B32B2305/028—Hollow fillers; Syntactic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US584897 | 1984-02-29 | ||
US06/584,897 US4574879A (en) | 1984-02-29 | 1984-02-29 | Mounting pad for solid-state devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60183753A true JPS60183753A (ja) | 1985-09-19 |
JPH0224383B2 JPH0224383B2 (enrdf_load_stackoverflow) | 1990-05-29 |
Family
ID=24339228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60001577A Granted JPS60183753A (ja) | 1984-02-29 | 1985-01-10 | 固体電子デバイス取付用座板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4574879A (enrdf_load_stackoverflow) |
JP (1) | JPS60183753A (enrdf_load_stackoverflow) |
DE (1) | DE3446047A1 (enrdf_load_stackoverflow) |
GB (1) | GB2154939B (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011025676A (ja) * | 2009-06-29 | 2011-02-10 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゴム複合シート |
JP2011098566A (ja) * | 2009-10-08 | 2011-05-19 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゴム複合シート |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142513U (ja) * | 1984-08-23 | 1986-03-19 | 富士写真光機株式会社 | 内視鏡 |
US4664980A (en) * | 1984-09-14 | 1987-05-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Oxidation protection coatings for polymers |
US4781244A (en) * | 1986-02-25 | 1988-11-01 | Nec Corporation | Liquid cooling system for integrated circuit chips |
US4810563A (en) * | 1986-03-14 | 1989-03-07 | The Bergquist Company | Thermally conductive, electrically insulative laminate |
DE3610459A1 (de) * | 1986-03-27 | 1987-10-01 | Siemens Ag | Anordnung zum thermischen kontaktieren von elektrischen bauelementen an kuehlkoerpern |
JPS62238653A (ja) * | 1986-04-09 | 1987-10-19 | Nec Corp | 冷却構造 |
US4852646A (en) * | 1987-06-16 | 1989-08-01 | Raychem Corporation | Thermally conductive gel materials |
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
EP0320198B1 (en) * | 1987-12-07 | 1995-03-01 | Nec Corporation | Cooling system for IC package |
DE68918156T2 (de) * | 1988-05-09 | 1995-01-12 | Nippon Electric Co | Flache Kühlungsstruktur für integrierte Schaltung. |
CA1307355C (en) * | 1988-05-26 | 1992-09-08 | David C. Degree | Soft-faced semiconductor component backing |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
US4907124A (en) * | 1988-09-01 | 1990-03-06 | Kaufman Lance R | Bolted circuit assembly with isolating washer |
JPH06100408B2 (ja) * | 1988-09-09 | 1994-12-12 | 日本電気株式会社 | 冷却装置 |
EP0363687B1 (en) * | 1988-09-20 | 1996-01-10 | Nec Corporation | Cooling structure for electronic components |
JP2507561B2 (ja) * | 1988-10-19 | 1996-06-12 | 株式会社日立製作所 | 半導体の冷却装置 |
US5055967A (en) * | 1988-10-26 | 1991-10-08 | Texas Instruments Incorporated | Substrate for an electrical circuit system and a circuit system using that substrate |
US5028984A (en) * | 1988-11-04 | 1991-07-02 | International Business Machines Corporation | Epoxy composition and use thereof |
US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
US5077633A (en) * | 1989-05-01 | 1991-12-31 | Motorola Inc. | Grounding an ultra high density pad array chip carrier |
US4960634A (en) * | 1990-03-14 | 1990-10-02 | International Business Machines Corporation | Epoxy composition of increased thermal conductivity and use thereof |
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
US5070936A (en) * | 1991-02-15 | 1991-12-10 | United States Of America As Represented By The Secretary Of The Air Force | High intensity heat exchanger system |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
EP0529837B1 (en) * | 1991-08-26 | 1996-05-29 | Sun Microsystems, Inc. | Method and apparatus for cooling multi-chip modules using integral heatpipe technology |
DE4222172A1 (de) * | 1992-07-06 | 1994-01-13 | Siemens Matsushita Components | Elektrisch isolierende Wärmekopplung für zwangsgekühlte elektrische Kondensatoren |
TW238419B (enrdf_load_stackoverflow) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
US5463530A (en) * | 1993-02-05 | 1995-10-31 | The Bergquist Company | Dual sided laminated semiconductor mounting |
US5510174A (en) * | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
DE4336961C2 (de) * | 1993-10-29 | 2000-07-06 | Kerafol Keramische Folien Gmbh | Flexible Wärmeübertragungsvorrichtung |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
US5652055A (en) * | 1994-07-20 | 1997-07-29 | W. L. Gore & Associates, Inc. | Matched low dielectric constant, dimensionally stable adhesive sheet |
US5975201A (en) * | 1994-10-31 | 1999-11-02 | The Johns Hopkins University | Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures |
US6090484A (en) * | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
US5679457A (en) * | 1995-05-19 | 1997-10-21 | The Bergquist Company | Thermally conductive interface for electronic devices |
WO1996037915A1 (en) * | 1995-05-26 | 1996-11-28 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
JP2793559B2 (ja) * | 1996-05-30 | 1998-09-03 | 日東電工株式会社 | 耐熱性および熱伝導性にすぐれた感圧性接着剤とその接着シ―ト類およびこれらを用いた電子部品と放熱部材との固定方法 |
US5738936A (en) * | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
US5889319A (en) * | 1996-07-19 | 1999-03-30 | Ericsson, Inc. | RF power package with a dual ground |
US5929138A (en) * | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
JP2001503471A (ja) | 1997-02-07 | 2001-03-13 | ロックタイト コーポレーション | 伝導性樹脂組成物 |
US6884314B2 (en) * | 1997-02-07 | 2005-04-26 | Henkel Corporation | Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding |
JPH11186003A (ja) * | 1997-12-25 | 1999-07-09 | Yazaki Corp | Ptc素子の放熱構造 |
DE19836229C1 (de) * | 1998-08-04 | 2000-03-23 | Hielscher Gmbh | Anordnung zur Wärmeableitung, insbesondere für Ultraschallwandler mit hoher Leistung |
US6165596A (en) * | 1999-10-14 | 2000-12-26 | Lucent Technologies, Inc. | Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components |
US6496373B1 (en) | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
JP3468420B2 (ja) * | 2000-06-07 | 2003-11-17 | 持田商工株式会社 | 放熱シート及びその製造方法 |
US6799628B1 (en) | 2000-07-20 | 2004-10-05 | Honeywell International Inc. | Heat exchanger having silicon nitride substrate for mounting high power electronic components |
DE10237716A1 (de) * | 2002-08-17 | 2004-02-26 | Robert Bosch Gmbh | Elektronik-Einheit mit wärmeleitender Folie |
JP4572056B2 (ja) | 2002-10-04 | 2010-10-27 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム複合シート |
US20040120129A1 (en) * | 2002-12-24 | 2004-06-24 | Louis Soto | Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures |
US6831835B2 (en) * | 2002-12-24 | 2004-12-14 | Ault, Inc. | Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures |
EP1723197B1 (en) * | 2004-03-09 | 2009-11-04 | Henkel Corporation | Thermally conductive two-part adhesive composition |
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JPS5281052U (enrdf_load_stackoverflow) * | 1975-12-15 | 1977-06-16 | ||
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JPS5595351A (en) * | 1979-01-16 | 1980-07-19 | Toshiba Corp | Semiconductor cooling device |
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JP2011025676A (ja) * | 2009-06-29 | 2011-02-10 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゴム複合シート |
JP2011098566A (ja) * | 2009-10-08 | 2011-05-19 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーンゴム複合シート |
Also Published As
Publication number | Publication date |
---|---|
DE3446047A1 (de) | 1985-09-05 |
JPH0224383B2 (enrdf_load_stackoverflow) | 1990-05-29 |
GB8501107D0 (en) | 1985-02-20 |
GB2154939B (en) | 1987-04-01 |
GB2154939A (en) | 1985-09-18 |
US4574879A (en) | 1986-03-11 |
DE3446047C2 (enrdf_load_stackoverflow) | 1991-01-24 |
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