DE602005017472D1 - Wärmeleitfähige zweikomponentige klebstoffzusammensetzung - Google Patents

Wärmeleitfähige zweikomponentige klebstoffzusammensetzung

Info

Publication number
DE602005017472D1
DE602005017472D1 DE602005017472T DE602005017472T DE602005017472D1 DE 602005017472 D1 DE602005017472 D1 DE 602005017472D1 DE 602005017472 T DE602005017472 T DE 602005017472T DE 602005017472 T DE602005017472 T DE 602005017472T DE 602005017472 D1 DE602005017472 D1 DE 602005017472D1
Authority
DE
Germany
Prior art keywords
component
thermally conductive
filler
adhesive composition
conductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005017472T
Other languages
English (en)
Inventor
James J Earle
Aisling Mary Lakes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Ireland Ltd
Henkel Corp
Original Assignee
Henkel Loctite Ireland Ltd
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Loctite Ireland Ltd, Henkel Corp filed Critical Henkel Loctite Ireland Ltd
Publication of DE602005017472D1 publication Critical patent/DE602005017472D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
DE602005017472T 2004-03-09 2005-03-08 Wärmeleitfähige zweikomponentige klebstoffzusammensetzung Active DE602005017472D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55157704P 2004-03-09 2004-03-09
PCT/US2005/007915 WO2005087850A1 (en) 2004-03-09 2005-03-08 Thermally conductive two-part adhesive composition

Publications (1)

Publication Number Publication Date
DE602005017472D1 true DE602005017472D1 (de) 2009-12-17

Family

ID=34975549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005017472T Active DE602005017472D1 (de) 2004-03-09 2005-03-08 Wärmeleitfähige zweikomponentige klebstoffzusammensetzung

Country Status (8)

Country Link
US (1) US20070023165A1 (de)
EP (1) EP1723197B1 (de)
JP (1) JP2007528437A (de)
KR (1) KR20060126838A (de)
CN (1) CN1946784A (de)
AT (1) ATE447596T1 (de)
DE (1) DE602005017472D1 (de)
WO (1) WO2005087850A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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JP2006111790A (ja) * 2004-10-18 2006-04-27 Seiko Epson Corp 導電性粘着剤
CN101191041B (zh) * 2006-11-29 2010-04-14 上海康达化工有限公司 丙烯酸酯胶粘剂
DE102007026256A1 (de) * 2007-06-04 2008-12-11 Akemi Chemisch Technische Spezialfabrik Gmbh Mehrfarbkomponenten-Klebersystem
CA2689595C (en) * 2007-06-08 2015-11-03 Henkel Corporation Room temperature curing adhesive composition having high temperature properties
GB2482531B (en) * 2010-08-05 2013-11-13 Loctite R & D Ltd Adhesive composition with enhanced cure through volume
US8966758B1 (en) * 2010-09-17 2015-03-03 Jeffrey Skaggs McReynolds System and method of producing scalable heat-sink assembly
KR101192042B1 (ko) 2010-11-01 2012-10-17 삼성에스디아이 주식회사 배터리 팩
WO2013019326A2 (en) 2011-08-03 2013-02-07 Henkel Corporation Electrically conductive structural adhesive
EP2664349B1 (de) * 2012-05-16 2016-02-03 Heraeus Medical GmbH Pastenförmiger Knochenzement
JP6395272B2 (ja) * 2013-04-29 2018-09-26 エルジー・ケム・リミテッド 高分子電解質膜、高分子電解質膜を含む膜電極接合体および膜電極接合体を含む燃料電池
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
CN103725206B (zh) * 2014-01-06 2015-06-24 江苏东禾电声配件有限公司 一种扬声器组装用双组份耐高温胶黏剂及其制备方法
JP6630695B2 (ja) * 2017-03-03 2020-01-15 日本ユピカ株式会社 電気電子部品封止用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品用封止体、及び当該封止体の製造方法
JP6653305B2 (ja) * 2017-11-10 2020-02-26 日本ユピカ株式会社 電気電子部品用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品成形体、及び当該電気電子部品成形体の製造方法
KR20190121778A (ko) * 2017-03-03 2019-10-28 니혼 유피카 가부시키가이샤 전기 전자 부품용 결정성 라디칼 중합성 조성물, 상기 조성물을 사용한 전기 전자 부품 성형체, 및 상기 전기 전자 부품 성형체의 제조 방법
JP6782739B2 (ja) * 2018-07-09 2020-11-11 日本ユピカ株式会社 車載用エレクトロニックコントロールユニット基板封止用熱硬化性樹脂組成物、当該組成物を使用した車載用エレクトロニックコントロールユニット基板封止体、及び当該封止体の製造方法
JP6782741B2 (ja) * 2018-07-18 2020-11-11 日本ユピカ株式会社 車載用イグニッションコイル封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用イグニッションコイル封止体、及び当該封止体の製造方法
JP6782742B2 (ja) * 2018-07-25 2020-11-11 日本ユピカ株式会社 車載用パワー半導体素子封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用パワー半導体素子封止体、及び当該封止体の製造方法
CN113913147B (zh) * 2020-07-08 2023-12-05 3M创新有限公司 双组分导热粘合剂组合物和双组分导热填缝胶
KR102338814B1 (ko) * 2021-09-09 2021-12-14 정상문 아크릴 방열 점착제
WO2023194422A1 (de) * 2022-04-07 2023-10-12 Sika Technology Ag Klebstoff auf (meth)acrylat-basis für eckwinkelverklebung

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US4722960A (en) * 1983-01-18 1988-02-02 Loctite Corporation Aluminum filled compositions
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DE10259549A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
JP2007528437A (ja) 2007-10-11
WO2005087850A1 (en) 2005-09-22
EP1723197A1 (de) 2006-11-22
KR20060126838A (ko) 2006-12-08
CN1946784A (zh) 2007-04-11
US20070023165A1 (en) 2007-02-01
EP1723197A4 (de) 2008-06-04
EP1723197B1 (de) 2009-11-04
ATE447596T1 (de) 2009-11-15

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