JPS60178688A - 高熱伝導性回路基板 - Google Patents

高熱伝導性回路基板

Info

Publication number
JPS60178688A
JPS60178688A JP3416584A JP3416584A JPS60178688A JP S60178688 A JPS60178688 A JP S60178688A JP 3416584 A JP3416584 A JP 3416584A JP 3416584 A JP3416584 A JP 3416584A JP S60178688 A JPS60178688 A JP S60178688A
Authority
JP
Japan
Prior art keywords
thermal conductivity
substrate
circuit board
paste
high thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3416584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576795B2 (cs
Inventor
安斎　和雄
和夫 篠崎
加曽利　光男
柘植　章彦
岩瀬　暢男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3416584A priority Critical patent/JPS60178688A/ja
Priority to EP85102159A priority patent/EP0153737B1/en
Priority to US06/706,280 priority patent/US4659611A/en
Priority to DE85102159T priority patent/DE3587481T2/de
Publication of JPS60178688A publication Critical patent/JPS60178688A/ja
Publication of JPH0576795B2 publication Critical patent/JPH0576795B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP3416584A 1984-02-27 1984-02-27 高熱伝導性回路基板 Granted JPS60178688A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3416584A JPS60178688A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板
EP85102159A EP0153737B1 (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
US06/706,280 US4659611A (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
DE85102159T DE3587481T2 (de) 1984-02-27 1985-02-27 Schaltungssubstrat mit hoher Wärmeleitfähigkeit.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3416584A JPS60178688A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5041768A Division JPH0716088B2 (ja) 1993-02-08 1993-02-08 高熱伝導性回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60178688A true JPS60178688A (ja) 1985-09-12
JPH0576795B2 JPH0576795B2 (cs) 1993-10-25

Family

ID=12406594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3416584A Granted JPS60178688A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板

Country Status (1)

Country Link
JP (1) JPS60178688A (cs)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60253294A (ja) * 1984-05-29 1985-12-13 日本電気株式会社 多層セラミツク基板
JPS6135555A (ja) * 1984-07-27 1986-02-20 Nec Corp 厚膜混成集積回路装置
JPS6284595A (ja) * 1985-10-08 1987-04-18 日本電気株式会社 多層セラミック配線基板
JPS6329991A (ja) * 1986-07-23 1988-02-08 株式会社東芝 回路基板の製造方法及び回路基板
JPH01117093A (ja) * 1987-10-29 1989-05-09 Ibiden Co Ltd 窒化アルミニウム質多層基板
JPH01278001A (ja) * 1988-04-28 1989-11-08 Tokin Corp サーミスタ感温構造体
JPH025596A (ja) * 1988-06-24 1990-01-10 Nec Corp 多層配線基板の製造方法
JPH02197189A (ja) * 1988-11-14 1990-08-03 Shinko Electric Ind Co Ltd 窒化アルミニウム回路基板及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (cs) * 1973-11-07 1975-06-20
JPS5855377A (ja) * 1981-09-28 1983-04-01 株式会社東芝 窒化アルミニウム焼結体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (cs) * 1973-11-07 1975-06-20
JPS5855377A (ja) * 1981-09-28 1983-04-01 株式会社東芝 窒化アルミニウム焼結体の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60253294A (ja) * 1984-05-29 1985-12-13 日本電気株式会社 多層セラミツク基板
JPS6135555A (ja) * 1984-07-27 1986-02-20 Nec Corp 厚膜混成集積回路装置
JPS6284595A (ja) * 1985-10-08 1987-04-18 日本電気株式会社 多層セラミック配線基板
JPS6329991A (ja) * 1986-07-23 1988-02-08 株式会社東芝 回路基板の製造方法及び回路基板
JPH01117093A (ja) * 1987-10-29 1989-05-09 Ibiden Co Ltd 窒化アルミニウム質多層基板
JPH01278001A (ja) * 1988-04-28 1989-11-08 Tokin Corp サーミスタ感温構造体
JPH025596A (ja) * 1988-06-24 1990-01-10 Nec Corp 多層配線基板の製造方法
JPH02197189A (ja) * 1988-11-14 1990-08-03 Shinko Electric Ind Co Ltd 窒化アルミニウム回路基板及びその製造方法

Also Published As

Publication number Publication date
JPH0576795B2 (cs) 1993-10-25

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term