JPS60178641A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60178641A
JPS60178641A JP3345884A JP3345884A JPS60178641A JP S60178641 A JPS60178641 A JP S60178641A JP 3345884 A JP3345884 A JP 3345884A JP 3345884 A JP3345884 A JP 3345884A JP S60178641 A JPS60178641 A JP S60178641A
Authority
JP
Japan
Prior art keywords
wiring
layer
wirings
sections
layer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3345884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519303B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tsutomu Akashi
勉 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3345884A priority Critical patent/JPS60178641A/ja
Publication of JPS60178641A publication Critical patent/JPS60178641A/ja
Publication of JPH0519303B2 publication Critical patent/JPH0519303B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP3345884A 1984-02-24 1984-02-24 半導体装置 Granted JPS60178641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3345884A JPS60178641A (ja) 1984-02-24 1984-02-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3345884A JPS60178641A (ja) 1984-02-24 1984-02-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS60178641A true JPS60178641A (ja) 1985-09-12
JPH0519303B2 JPH0519303B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-16

Family

ID=12387094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3345884A Granted JPS60178641A (ja) 1984-02-24 1984-02-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS60178641A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5523625A (en) * 1993-10-22 1996-06-04 Nec Corporation Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit
US5910684A (en) * 1995-11-03 1999-06-08 Micron Technology, Inc. Integrated circuitry
US6091150A (en) * 1996-09-03 2000-07-18 Micron Technology, Inc. Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138987A (ja) * 1974-09-30 1976-03-31 Hitachi Ltd Haisensonokeiseihoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138987A (ja) * 1974-09-30 1976-03-31 Hitachi Ltd Haisensonokeiseihoho

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5523625A (en) * 1993-10-22 1996-06-04 Nec Corporation Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit
US5910684A (en) * 1995-11-03 1999-06-08 Micron Technology, Inc. Integrated circuitry
US6066553A (en) * 1995-11-03 2000-05-23 Micron Technology, Inc. Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry
US6432813B1 (en) 1995-11-03 2002-08-13 Micron Technology, Inc. Semiconductor processing method of forming insulative material over conductive lines
US6091150A (en) * 1996-09-03 2000-07-18 Micron Technology, Inc. Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms

Also Published As

Publication number Publication date
JPH0519303B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-16

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