JPS60169196A - 多層回路基板の製造方法 - Google Patents
多層回路基板の製造方法Info
- Publication number
- JPS60169196A JPS60169196A JP2646484A JP2646484A JPS60169196A JP S60169196 A JPS60169196 A JP S60169196A JP 2646484 A JP2646484 A JP 2646484A JP 2646484 A JP2646484 A JP 2646484A JP S60169196 A JPS60169196 A JP S60169196A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- pattern
- insulating resin
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 241001092070 Eriobotrya Species 0.000 claims description 5
- 235000009008 Eriobotrya japonica Nutrition 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 34
- 239000004020 conductor Substances 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000002585 base Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 241000272201 Columbiformes Species 0.000 description 1
- 206010011732 Cyst Diseases 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 235000021398 garlic paste Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2646484A JPS60169196A (ja) | 1984-02-13 | 1984-02-13 | 多層回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2646484A JPS60169196A (ja) | 1984-02-13 | 1984-02-13 | 多層回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60169196A true JPS60169196A (ja) | 1985-09-02 |
| JPH021389B2 JPH021389B2 (enrdf_load_stackoverflow) | 1990-01-11 |
Family
ID=12194233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2646484A Granted JPS60169196A (ja) | 1984-02-13 | 1984-02-13 | 多層回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60169196A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56157053A (en) * | 1980-05-09 | 1981-12-04 | Hitachi Ltd | Manufacture of thick film hybrid ic plate |
-
1984
- 1984-02-13 JP JP2646484A patent/JPS60169196A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56157053A (en) * | 1980-05-09 | 1981-12-04 | Hitachi Ltd | Manufacture of thick film hybrid ic plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021389B2 (enrdf_load_stackoverflow) | 1990-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |