JPS60160186A - 超電導集積回路の端子電極 - Google Patents

超電導集積回路の端子電極

Info

Publication number
JPS60160186A
JPS60160186A JP59013477A JP1347784A JPS60160186A JP S60160186 A JPS60160186 A JP S60160186A JP 59013477 A JP59013477 A JP 59013477A JP 1347784 A JP1347784 A JP 1347784A JP S60160186 A JPS60160186 A JP S60160186A
Authority
JP
Japan
Prior art keywords
electrode
superconducting
film
layer
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59013477A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0114715B2 (enrdf_load_stackoverflow
Inventor
Mikio Hirano
幹夫 平野
Hideaki Nakane
中根　英章
Ushio Kawabe
川辺　潮
Shinichiro Yano
振一郎 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP59013477A priority Critical patent/JPS60160186A/ja
Publication of JPS60160186A publication Critical patent/JPS60160186A/ja
Publication of JPH0114715B2 publication Critical patent/JPH0114715B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/81—Containers; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
JP59013477A 1984-01-30 1984-01-30 超電導集積回路の端子電極 Granted JPS60160186A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59013477A JPS60160186A (ja) 1984-01-30 1984-01-30 超電導集積回路の端子電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59013477A JPS60160186A (ja) 1984-01-30 1984-01-30 超電導集積回路の端子電極

Publications (2)

Publication Number Publication Date
JPS60160186A true JPS60160186A (ja) 1985-08-21
JPH0114715B2 JPH0114715B2 (enrdf_load_stackoverflow) 1989-03-14

Family

ID=11834201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59013477A Granted JPS60160186A (ja) 1984-01-30 1984-01-30 超電導集積回路の端子電極

Country Status (1)

Country Link
JP (1) JPS60160186A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843520A (en) * 1997-01-13 1998-12-01 Vanguard International Semiconductor Corporation Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers
CN111969102A (zh) * 2020-09-11 2020-11-20 中国科学院紫金山天文台 一种改善超导钛-铌薄膜接触电极的制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843520A (en) * 1997-01-13 1998-12-01 Vanguard International Semiconductor Corporation Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers
CN111969102A (zh) * 2020-09-11 2020-11-20 中国科学院紫金山天文台 一种改善超导钛-铌薄膜接触电极的制备方法
CN111969102B (zh) * 2020-09-11 2023-10-27 中国科学院紫金山天文台 一种改善超导钛-铌薄膜接触电极的制备方法

Also Published As

Publication number Publication date
JPH0114715B2 (enrdf_load_stackoverflow) 1989-03-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term