JPS60158735U - 半導体装置製造用樹脂封止金型 - Google Patents

半導体装置製造用樹脂封止金型

Info

Publication number
JPS60158735U
JPS60158735U JP1984047719U JP4771984U JPS60158735U JP S60158735 U JPS60158735 U JP S60158735U JP 1984047719 U JP1984047719 U JP 1984047719U JP 4771984 U JP4771984 U JP 4771984U JP S60158735 U JPS60158735 U JP S60158735U
Authority
JP
Japan
Prior art keywords
mold
resin
semiconductor device
device manufacturing
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984047719U
Other languages
English (en)
Inventor
安藤　省三
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1984047719U priority Critical patent/JPS60158735U/ja
Publication of JPS60158735U publication Critical patent/JPS60158735U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　ｂは、夫々樹脂封止型半導体装置を表側及
び裏側から見た外観形状を示す斜視図、第２図ａ、ｂは
、夫々樹脂封止される前のリードフレームの平面図及び
Ａ−Ａ線から見た断面図、第３図は、リードフレームが
樹脂封止用の上金型及び下金型に挾まれた状態を示す側
断面図、第４図ａｔ　ｂは、夫々樹脂封止後のリードフ
レームの平面図及びＢ−Ｂ線から見た断面図、第５図は
、放熱板用のタイバーがプレス装置のポンチによって切
断される状態を示す従来例である背面図、第６図ａ、　
ｂは、夫々放熱板用のタイバーの切断面形状を示す斜視
図及び断面図、第７図は、樹脂モールド時に放熱板が傾
いた場合の樹脂モールド形状を示す側面図である。第８
図乃至第１１図は、本考案の一実施例を説明する図で、
第８図は、本考案の一実施例の樹脂封止金型にリードフ
レームが挾まれた状態を示す断面図、第９図は、樹脂封
止後の半導体装置のタイバー形状を示す斜視図、第１０
図は、半導体装置の樹脂モールド部から引き出されたタ
イバーが、プレス装置のポンチによって切断される状態
を示す背面図、第１１図ａ、　ｂは、夫々放熱板用のタ
イバーの切断面形状を示す斜視図及び断面図である。第
１２図は、本考案の他の実施例である樹脂封止金型にリ
ードフし−ムを挾んだ状態を示す断面図である。 １・・・樹脂封止型半導体装置、２・・・半導体ペレッ
ト、３・・・放熱板、６ａ・・・タイバー、７・・・リ
ードフレーム、１０・・・キャビティ、１１・・・樹脂
モールド部、１４・・・樹脂封止金型、１４ａ・・・上
金型、１４ｂ・・・下金型、１５・・・くさび。

Claims (1)

    【実用新案登録請求の範囲】
  1. タイバーで接続された放熱板とリードとを、夫々連結さ
    せ、放熱板にペレットを載置固着し、各ペレットとリー
    ドとを金属細線により橋架接続させたリードフレームを
    上金型及び下金型で挾み、上金型及び下金型間に形成さ
    れたキャビティ内に各放熱板を収納させ、このキャビテ
    ィ内にモールド樹脂を注入して硬化させ半導体装置を樹
    脂モールドするものにおいて、樹脂モールド部から外部
    に導出されるタイバーの切断位置に食い込む（さびを、
    上金型及び下金型の少なくとも一方に形成したことを特
    徴とする半導体装置製造用樹脂、封止金型。
JP1984047719U 1984-03-30 1984-03-30 半導体装置製造用樹脂封止金型 Pending JPS60158735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984047719U JPS60158735U (ja) 1984-03-30 1984-03-30 半導体装置製造用樹脂封止金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984047719U JPS60158735U (ja) 1984-03-30 1984-03-30 半導体装置製造用樹脂封止金型

Publications (1)

Publication Number Publication Date
JPS60158735U true JPS60158735U (ja) 1985-10-22

Family

ID=30563300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984047719U Pending JPS60158735U (ja) 1984-03-30 1984-03-30 半導体装置製造用樹脂封止金型

Country Status (1)

Country Link
JP (1) JPS60158735U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134372A (ja) * 1974-04-10 1975-10-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134372A (ja) * 1974-04-10 1975-10-24

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