JPS6015160B2 - 電気回路を形成する方法およびその装置 - Google Patents
電気回路を形成する方法およびその装置Info
- Publication number
- JPS6015160B2 JPS6015160B2 JP51027036A JP2703676A JPS6015160B2 JP S6015160 B2 JPS6015160 B2 JP S6015160B2 JP 51027036 A JP51027036 A JP 51027036A JP 2703676 A JP2703676 A JP 2703676A JP S6015160 B2 JPS6015160 B2 JP S6015160B2
- Authority
- JP
- Japan
- Prior art keywords
- insulated wire
- insulated
- wire
- electric circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 54
- 238000005476 soldering Methods 0.000 claims description 41
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 38
- 229910052742 iron Inorganic materials 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- 241000287127 Passeridae Species 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 229920006223 adhesive resin Polymers 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 4
- 239000004840 adhesive resin Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- XEEYBQQBJWHFJM-FTXFMUIASA-N iron-51 Chemical compound [51Fe] XEEYBQQBJWHFJM-FTXFMUIASA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7507726 | 1975-03-12 | ||
| FR7507726A FR2304247A1 (fr) | 1975-03-12 | 1975-03-12 | Procede et dispositif d'interconnexion de composants electroniques |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51115659A JPS51115659A (en) | 1976-10-12 |
| JPS6015160B2 true JPS6015160B2 (ja) | 1985-04-17 |
Family
ID=9152470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51027036A Expired JPS6015160B2 (ja) | 1975-03-12 | 1976-03-12 | 電気回路を形成する方法およびその装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS6015160B2 (enrdf_load_stackoverflow) |
| DE (1) | DE2610283C2 (enrdf_load_stackoverflow) |
| FR (1) | FR2304247A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1504252A (enrdf_load_stackoverflow) |
| IT (1) | IT1057575B (enrdf_load_stackoverflow) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ZA775455B (en) * | 1977-08-09 | 1978-07-26 | Kollmorgen Tech Corp | Improved methods and apparatus for making scribed circuit boards |
| JPS5558573A (en) * | 1978-10-25 | 1980-05-01 | Hitachi Ltd | Manufacture of mis semiconductor device |
| DE3035090C2 (de) * | 1979-09-28 | 1995-01-26 | Cii Honeywell Bull | Vorrichtung zur Verdrahtung von Substratoberflächen |
| DE3051232C2 (de) * | 1979-09-28 | 1995-02-23 | Cii Honeywell Bull | Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen |
| FR2466936A1 (fr) * | 1979-09-28 | 1981-04-10 | Cii Honeywell Bull | Appareil de cablage a la surface d'un substrat d'interconnexion |
| JPS57162387A (en) * | 1981-03-30 | 1982-10-06 | Fujitsu Ltd | Wire bonding device |
| US4450623A (en) * | 1981-12-18 | 1984-05-29 | Kollmorgen Technologies Corporation | Process for the manufacture of circuit boards |
| DE3313456C2 (de) * | 1982-05-10 | 1984-02-16 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Impuls-Lötverfahren |
| DD216357A1 (de) * | 1983-06-29 | 1984-12-05 | Mikroelektronik Zt Forsch Tech | Vorrichtung zum automatischen kontaktieren und schneiden elektrischer leiter |
| DE3408338A1 (de) * | 1984-03-07 | 1985-09-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte |
| GB8517703D0 (en) * | 1985-07-12 | 1985-08-21 | Golten D | Surface mounted assemblies |
| FR2585210B1 (fr) * | 1985-07-19 | 1994-05-06 | Kollmorgen Technologies Corp | Procede de fabrication de plaquettes a circuits d'interconnexion |
| US4642321A (en) * | 1985-07-19 | 1987-02-10 | Kollmorgen Technologies Corporation | Heat activatable adhesive for wire scribed circuits |
| US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
| US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
| US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
| US4693778A (en) * | 1985-07-19 | 1987-09-15 | Kollmorgen Technologies Corporation | Apparatus for making scribed circuit boards and circuit board modifications |
| CA1260157A (en) * | 1985-07-26 | 1989-09-26 | Preleg, Inc. | Electrical circuit fabrication apparatus and method |
| US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
| US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
| US5340946A (en) * | 1985-12-20 | 1994-08-23 | Advanced Interconnection Technology, Inc. | Heat activatable adhesive for wire scribed circuits |
| JPS6398919A (ja) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | ワイヤハ−ネス製造装置 |
| JPS6398920A (ja) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | ワイヤハ−ネス製造装置 |
| JPS63136420A (ja) * | 1986-11-28 | 1988-06-08 | 文化自動車工業株式会社 | 布線装置 |
| ES2004620A6 (es) * | 1987-05-25 | 1989-01-16 | C G Sistemas Electronicos S A | Boquilla para implantacion o reposicion de pistas en placas de circuitos impreso |
| DE102006037093B3 (de) * | 2006-08-07 | 2008-03-13 | Reinhard Ulrich | Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht |
| DE102007037165A1 (de) | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Verfahren und Vorrichtung zum Verlegen von dünnem Draht |
| CN114012269B (zh) * | 2020-07-16 | 2024-05-14 | 绵阳伟成科技有限公司 | 一种装夹机构、激光破皮机及破皮方法 |
| CN118336405B (zh) * | 2024-05-27 | 2024-09-03 | 中国水利水电第四工程局有限公司 | 一种自然接地体连接接头及其加工装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3353263A (en) * | 1964-08-17 | 1967-11-21 | Texas Instruments Inc | Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor |
| JPS5550399B1 (enrdf_load_stackoverflow) * | 1970-03-05 | 1980-12-17 |
-
1975
- 1975-03-12 FR FR7507726A patent/FR2304247A1/fr active Granted
-
1976
- 1976-03-02 GB GB833676A patent/GB1504252A/en not_active Expired
- 1976-03-11 DE DE19762610283 patent/DE2610283C2/de not_active Expired
- 1976-03-12 JP JP51027036A patent/JPS6015160B2/ja not_active Expired
- 1976-03-12 IT IT2115976A patent/IT1057575B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| IT1057575B (it) | 1982-03-30 |
| DE2610283A1 (de) | 1976-09-23 |
| FR2304247A1 (fr) | 1976-10-08 |
| GB1504252A (en) | 1978-03-15 |
| JPS51115659A (en) | 1976-10-12 |
| DE2610283C2 (de) | 1986-05-07 |
| FR2304247B1 (enrdf_load_stackoverflow) | 1979-06-08 |
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