FR2304247B1 - - Google Patents
Info
- Publication number
- FR2304247B1 FR2304247B1 FR7507726A FR7507726A FR2304247B1 FR 2304247 B1 FR2304247 B1 FR 2304247B1 FR 7507726 A FR7507726 A FR 7507726A FR 7507726 A FR7507726 A FR 7507726A FR 2304247 B1 FR2304247 B1 FR 2304247B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7507726A FR2304247A1 (fr) | 1975-03-12 | 1975-03-12 | Procede et dispositif d'interconnexion de composants electroniques |
GB833676A GB1504252A (en) | 1975-03-12 | 1976-03-02 | Method and apparatus for obtaining electric interconnections of electric components on a base support |
DE19762610283 DE2610283C2 (de) | 1975-03-12 | 1976-03-11 | Vorrichtung zum Herstellen elektrischer Leitungsverbindungen auf einer Trägerplatte |
IT2115976A IT1057575B (it) | 1975-03-12 | 1976-03-12 | Procedimento e dispositivo per il collegamento di componenti elettronici |
JP51027036A JPS6015160B2 (ja) | 1975-03-12 | 1976-03-12 | 電気回路を形成する方法およびその装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7507726A FR2304247A1 (fr) | 1975-03-12 | 1975-03-12 | Procede et dispositif d'interconnexion de composants electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2304247A1 FR2304247A1 (fr) | 1976-10-08 |
FR2304247B1 true FR2304247B1 (enrdf_load_stackoverflow) | 1979-06-08 |
Family
ID=9152470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7507726A Granted FR2304247A1 (fr) | 1975-03-12 | 1975-03-12 | Procede et dispositif d'interconnexion de composants electroniques |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS6015160B2 (enrdf_load_stackoverflow) |
DE (1) | DE2610283C2 (enrdf_load_stackoverflow) |
FR (1) | FR2304247A1 (enrdf_load_stackoverflow) |
GB (1) | GB1504252A (enrdf_load_stackoverflow) |
IT (1) | IT1057575B (enrdf_load_stackoverflow) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ZA775455B (en) * | 1977-08-09 | 1978-07-26 | Kollmorgen Tech Corp | Improved methods and apparatus for making scribed circuit boards |
JPS5558573A (en) * | 1978-10-25 | 1980-05-01 | Hitachi Ltd | Manufacture of mis semiconductor device |
DE3035090C2 (de) * | 1979-09-28 | 1995-01-26 | Cii Honeywell Bull | Vorrichtung zur Verdrahtung von Substratoberflächen |
DE3051232C2 (de) * | 1979-09-28 | 1995-02-23 | Cii Honeywell Bull | Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen |
FR2466936A1 (fr) * | 1979-09-28 | 1981-04-10 | Cii Honeywell Bull | Appareil de cablage a la surface d'un substrat d'interconnexion |
JPS57162387A (en) * | 1981-03-30 | 1982-10-06 | Fujitsu Ltd | Wire bonding device |
US4450623A (en) * | 1981-12-18 | 1984-05-29 | Kollmorgen Technologies Corporation | Process for the manufacture of circuit boards |
DE3313456C2 (de) * | 1982-05-10 | 1984-02-16 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Impuls-Lötverfahren |
DD216357A1 (de) * | 1983-06-29 | 1984-12-05 | Mikroelektronik Zt Forsch Tech | Vorrichtung zum automatischen kontaktieren und schneiden elektrischer leiter |
DE3408338A1 (de) * | 1984-03-07 | 1985-09-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte |
GB8517703D0 (en) * | 1985-07-12 | 1985-08-21 | Golten D | Surface mounted assemblies |
FR2585210B1 (fr) * | 1985-07-19 | 1994-05-06 | Kollmorgen Technologies Corp | Procede de fabrication de plaquettes a circuits d'interconnexion |
US4642321A (en) * | 1985-07-19 | 1987-02-10 | Kollmorgen Technologies Corporation | Heat activatable adhesive for wire scribed circuits |
US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
US4693778A (en) * | 1985-07-19 | 1987-09-15 | Kollmorgen Technologies Corporation | Apparatus for making scribed circuit boards and circuit board modifications |
CA1260157A (en) * | 1985-07-26 | 1989-09-26 | Preleg, Inc. | Electrical circuit fabrication apparatus and method |
US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
US5340946A (en) * | 1985-12-20 | 1994-08-23 | Advanced Interconnection Technology, Inc. | Heat activatable adhesive for wire scribed circuits |
JPS6398919A (ja) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | ワイヤハ−ネス製造装置 |
JPS6398920A (ja) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | ワイヤハ−ネス製造装置 |
JPS63136420A (ja) * | 1986-11-28 | 1988-06-08 | 文化自動車工業株式会社 | 布線装置 |
ES2004620A6 (es) * | 1987-05-25 | 1989-01-16 | C G Sistemas Electronicos S A | Boquilla para implantacion o reposicion de pistas en placas de circuitos impreso |
DE102006037093B3 (de) * | 2006-08-07 | 2008-03-13 | Reinhard Ulrich | Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht |
DE102007037165A1 (de) | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Verfahren und Vorrichtung zum Verlegen von dünnem Draht |
CN114012269B (zh) * | 2020-07-16 | 2024-05-14 | 绵阳伟成科技有限公司 | 一种装夹机构、激光破皮机及破皮方法 |
CN118336405B (zh) * | 2024-05-27 | 2024-09-03 | 中国水利水电第四工程局有限公司 | 一种自然接地体连接接头及其加工装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3353263A (en) * | 1964-08-17 | 1967-11-21 | Texas Instruments Inc | Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor |
JPS5550399B1 (enrdf_load_stackoverflow) * | 1970-03-05 | 1980-12-17 |
-
1975
- 1975-03-12 FR FR7507726A patent/FR2304247A1/fr active Granted
-
1976
- 1976-03-02 GB GB833676A patent/GB1504252A/en not_active Expired
- 1976-03-11 DE DE19762610283 patent/DE2610283C2/de not_active Expired
- 1976-03-12 JP JP51027036A patent/JPS6015160B2/ja not_active Expired
- 1976-03-12 IT IT2115976A patent/IT1057575B/it active
Also Published As
Publication number | Publication date |
---|---|
IT1057575B (it) | 1982-03-30 |
JPS6015160B2 (ja) | 1985-04-17 |
DE2610283A1 (de) | 1976-09-23 |
FR2304247A1 (fr) | 1976-10-08 |
GB1504252A (en) | 1978-03-15 |
JPS51115659A (en) | 1976-10-12 |
DE2610283C2 (de) | 1986-05-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |