FR2304247A1 - Procede et dispositif d'interconnexion de composants electroniques - Google Patents

Procede et dispositif d'interconnexion de composants electroniques

Info

Publication number
FR2304247A1
FR2304247A1 FR7507726A FR7507726A FR2304247A1 FR 2304247 A1 FR2304247 A1 FR 2304247A1 FR 7507726 A FR7507726 A FR 7507726A FR 7507726 A FR7507726 A FR 7507726A FR 2304247 A1 FR2304247 A1 FR 2304247A1
Authority
FR
France
Prior art keywords
electronic components
interconnecting electronic
interconnecting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7507726A
Other languages
English (en)
French (fr)
Other versions
FR2304247B1 (enrdf_load_stackoverflow
Inventor
Gerard Nicolas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR7507726A priority Critical patent/FR2304247A1/fr
Priority to GB833676A priority patent/GB1504252A/en
Priority to DE19762610283 priority patent/DE2610283C2/de
Priority to IT2115976A priority patent/IT1057575B/it
Priority to JP51027036A priority patent/JPS6015160B2/ja
Publication of FR2304247A1 publication Critical patent/FR2304247A1/fr
Application granted granted Critical
Publication of FR2304247B1 publication Critical patent/FR2304247B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7507726A 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques Granted FR2304247A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques
GB833676A GB1504252A (en) 1975-03-12 1976-03-02 Method and apparatus for obtaining electric interconnections of electric components on a base support
DE19762610283 DE2610283C2 (de) 1975-03-12 1976-03-11 Vorrichtung zum Herstellen elektrischer Leitungsverbindungen auf einer Trägerplatte
IT2115976A IT1057575B (it) 1975-03-12 1976-03-12 Procedimento e dispositivo per il collegamento di componenti elettronici
JP51027036A JPS6015160B2 (ja) 1975-03-12 1976-03-12 電気回路を形成する方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques

Publications (2)

Publication Number Publication Date
FR2304247A1 true FR2304247A1 (fr) 1976-10-08
FR2304247B1 FR2304247B1 (enrdf_load_stackoverflow) 1979-06-08

Family

ID=9152470

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7507726A Granted FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques

Country Status (5)

Country Link
JP (1) JPS6015160B2 (enrdf_load_stackoverflow)
DE (1) DE2610283C2 (enrdf_load_stackoverflow)
FR (1) FR2304247A1 (enrdf_load_stackoverflow)
GB (1) GB1504252A (enrdf_load_stackoverflow)
IT (1) IT1057575B (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2400304A1 (fr) * 1977-08-09 1979-03-09 Kollmorgen Tech Corp Procedes et appareils perfectionnes pour la realisation de circuits a conducteurs filaires
FR2518863A1 (fr) * 1981-12-18 1983-06-24 Kollmorgen Tech Corp Procede de fabrication de plaquettes de circuits pour montages electroniques
FR2526624A1 (fr) * 1982-05-10 1983-11-10 Kollmorgen Tech Corp Procede de soudage a grande vitesse pour cablage
FR2585209A1 (fr) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp Plaquettes a circuits traces par fil et leur procede de fabrication
FR2585210A1 (fr) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp Procede de fabrication de plaquettes a circuits d'interconnexion
EP0231363A4 (en) * 1985-07-26 1988-08-23 Preleg Inc METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUITS.
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
EP0297018A3 (en) * 1987-05-25 1990-05-30 Circuitgraph, S.L. Device tip to mount or replace printed circuit board wiring

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
DE3051232C2 (de) * 1979-09-28 1995-02-23 Cii Honeywell Bull Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
DD216357A1 (de) * 1983-06-29 1984-12-05 Mikroelektronik Zt Forsch Tech Vorrichtung zum automatischen kontaktieren und schneiden elektrischer leiter
DE3408338A1 (de) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte
GB8517703D0 (en) * 1985-07-12 1985-08-21 Golten D Surface mounted assemblies
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht
CN114012269B (zh) * 2020-07-16 2024-05-14 绵阳伟成科技有限公司 一种装夹机构、激光破皮机及破皮方法
CN118336405B (zh) * 2024-05-27 2024-09-03 中国水利水电第四工程局有限公司 一种自然接地体连接接头及其加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
JPS5550399B1 (enrdf_load_stackoverflow) * 1970-03-05 1980-12-17

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2400304A1 (fr) * 1977-08-09 1979-03-09 Kollmorgen Tech Corp Procedes et appareils perfectionnes pour la realisation de circuits a conducteurs filaires
FR2518863A1 (fr) * 1981-12-18 1983-06-24 Kollmorgen Tech Corp Procede de fabrication de plaquettes de circuits pour montages electroniques
FR2526624A1 (fr) * 1982-05-10 1983-11-10 Kollmorgen Tech Corp Procede de soudage a grande vitesse pour cablage
FR2585209A1 (fr) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp Plaquettes a circuits traces par fil et leur procede de fabrication
FR2585210A1 (fr) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp Procede de fabrication de plaquettes a circuits d'interconnexion
EP0212227A3 (en) * 1985-07-19 1987-05-13 Kollmorgen Technologies Corporation Process for the manufacture of wire scribed circuit boards and articles produced thereby
EP0217019A3 (en) * 1985-07-19 1988-08-10 Kollmorgen Technologies Corporation Method of manufacturing interconnection circuit boards
EP0231363A4 (en) * 1985-07-26 1988-08-23 Preleg Inc METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUITS.
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
EP0297018A3 (en) * 1987-05-25 1990-05-30 Circuitgraph, S.L. Device tip to mount or replace printed circuit board wiring

Also Published As

Publication number Publication date
IT1057575B (it) 1982-03-30
JPS6015160B2 (ja) 1985-04-17
DE2610283A1 (de) 1976-09-23
GB1504252A (en) 1978-03-15
JPS51115659A (en) 1976-10-12
DE2610283C2 (de) 1986-05-07
FR2304247B1 (enrdf_load_stackoverflow) 1979-06-08

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Legal Events

Date Code Title Description
ST Notification of lapse