GB1504252A - Method and apparatus for obtaining electric interconnections of electric components on a base support - Google Patents

Method and apparatus for obtaining electric interconnections of electric components on a base support

Info

Publication number
GB1504252A
GB1504252A GB833676A GB833676A GB1504252A GB 1504252 A GB1504252 A GB 1504252A GB 833676 A GB833676 A GB 833676A GB 833676 A GB833676 A GB 833676A GB 1504252 A GB1504252 A GB 1504252A
Authority
GB
United Kingdom
Prior art keywords
wire
bit
studs
solder
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB833676A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of GB1504252A publication Critical patent/GB1504252A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB833676A 1975-03-12 1976-03-02 Method and apparatus for obtaining electric interconnections of electric components on a base support Expired GB1504252A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques

Publications (1)

Publication Number Publication Date
GB1504252A true GB1504252A (en) 1978-03-15

Family

ID=9152470

Family Applications (1)

Application Number Title Priority Date Filing Date
GB833676A Expired GB1504252A (en) 1975-03-12 1976-03-02 Method and apparatus for obtaining electric interconnections of electric components on a base support

Country Status (5)

Country Link
JP (1) JPS6015160B2 (enrdf_load_stackoverflow)
DE (1) DE2610283C2 (enrdf_load_stackoverflow)
FR (1) FR2304247A1 (enrdf_load_stackoverflow)
GB (1) GB1504252A (enrdf_load_stackoverflow)
IT (1) IT1057575B (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120152A (en) * 1982-05-10 1983-11-30 Kollmorgen Tech Corp Rapid soldering of wire to terminal pads
GB2142259A (en) * 1983-06-29 1985-01-16 Mikroelektronik Zt Forsch Tech A cable laying machine
GB2177640A (en) * 1985-07-12 1987-01-28 Electronic Components Ltd Assembly of surface-mounted components
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
GB2180175A (en) * 1985-07-19 1987-03-25 Kollmorgen Tech Corp Apparatus for making scribed circuit boards
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
CN118336405A (zh) * 2024-05-27 2024-07-12 中国水利水电第四工程局有限公司 一种新型自然接地体连接接头及其加工装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
DE3051232C2 (de) * 1979-09-28 1995-02-23 Cii Honeywell Bull Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
DE3408338A1 (de) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
CA1260157A (en) * 1985-07-26 1989-09-26 Preleg, Inc. Electrical circuit fabrication apparatus and method
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置
ES2004620A6 (es) * 1987-05-25 1989-01-16 C G Sistemas Electronicos S A Boquilla para implantacion o reposicion de pistas en placas de circuitos impreso
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht
CN114012269B (zh) * 2020-07-16 2024-05-14 绵阳伟成科技有限公司 一种装夹机构、激光破皮机及破皮方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
JPS5550399B1 (enrdf_load_stackoverflow) * 1970-03-05 1980-12-17

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120152A (en) * 1982-05-10 1983-11-30 Kollmorgen Tech Corp Rapid soldering of wire to terminal pads
GB2142259A (en) * 1983-06-29 1985-01-16 Mikroelektronik Zt Forsch Tech A cable laying machine
GB2177640A (en) * 1985-07-12 1987-01-28 Electronic Components Ltd Assembly of surface-mounted components
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
GB2180175A (en) * 1985-07-19 1987-03-25 Kollmorgen Tech Corp Apparatus for making scribed circuit boards
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
GB2180175B (en) * 1985-07-19 1989-07-19 Kollmorgen Tech Corp Apparatus for making scribed circuit boards and circuit board modifications
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
CN118336405A (zh) * 2024-05-27 2024-07-12 中国水利水电第四工程局有限公司 一种新型自然接地体连接接头及其加工装置

Also Published As

Publication number Publication date
IT1057575B (it) 1982-03-30
JPS6015160B2 (ja) 1985-04-17
DE2610283A1 (de) 1976-09-23
FR2304247A1 (fr) 1976-10-08
JPS51115659A (en) 1976-10-12
DE2610283C2 (de) 1986-05-07
FR2304247B1 (enrdf_load_stackoverflow) 1979-06-08

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee