JPS60149152A - シ−ム溶接方法 - Google Patents

シ−ム溶接方法

Info

Publication number
JPS60149152A
JPS60149152A JP59005888A JP588884A JPS60149152A JP S60149152 A JPS60149152 A JP S60149152A JP 59005888 A JP59005888 A JP 59005888A JP 588884 A JP588884 A JP 588884A JP S60149152 A JPS60149152 A JP S60149152A
Authority
JP
Japan
Prior art keywords
welding
lid
welding electrode
semiconductor package
seal frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59005888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439778B2 (enrdf_load_stackoverflow
Inventor
Hisashi Watanabe
恒 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59005888A priority Critical patent/JPS60149152A/ja
Publication of JPS60149152A publication Critical patent/JPS60149152A/ja
Publication of JPH0439778B2 publication Critical patent/JPH0439778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/12—Vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59005888A 1984-01-17 1984-01-17 シ−ム溶接方法 Granted JPS60149152A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59005888A JPS60149152A (ja) 1984-01-17 1984-01-17 シ−ム溶接方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59005888A JPS60149152A (ja) 1984-01-17 1984-01-17 シ−ム溶接方法

Publications (2)

Publication Number Publication Date
JPS60149152A true JPS60149152A (ja) 1985-08-06
JPH0439778B2 JPH0439778B2 (enrdf_load_stackoverflow) 1992-06-30

Family

ID=11623426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59005888A Granted JPS60149152A (ja) 1984-01-17 1984-01-17 シ−ム溶接方法

Country Status (1)

Country Link
JP (1) JPS60149152A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0439778B2 (enrdf_load_stackoverflow) 1992-06-30

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