JPH0439778B2 - - Google Patents
Info
- Publication number
- JPH0439778B2 JPH0439778B2 JP59005888A JP588884A JPH0439778B2 JP H0439778 B2 JPH0439778 B2 JP H0439778B2 JP 59005888 A JP59005888 A JP 59005888A JP 588884 A JP588884 A JP 588884A JP H0439778 B2 JPH0439778 B2 JP H0439778B2
- Authority
- JP
- Japan
- Prior art keywords
- welding
- lid
- welding electrode
- semiconductor package
- package base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 claims description 81
- 239000004065 semiconductor Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/12—Vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59005888A JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59005888A JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60149152A JPS60149152A (ja) | 1985-08-06 |
JPH0439778B2 true JPH0439778B2 (enrdf_load_stackoverflow) | 1992-06-30 |
Family
ID=11623426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59005888A Granted JPS60149152A (ja) | 1984-01-17 | 1984-01-17 | シ−ム溶接方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60149152A (enrdf_load_stackoverflow) |
-
1984
- 1984-01-17 JP JP59005888A patent/JPS60149152A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60149152A (ja) | 1985-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2003188294A (ja) | 電子部品の製造方法 | |
JPH06204371A (ja) | 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法 | |
JP4219524B2 (ja) | 半導体素子用パッケージ | |
JPH0439778B2 (enrdf_load_stackoverflow) | ||
JPS5856357A (ja) | 半導体装置用パツケ−ジ | |
JPS5929001B2 (ja) | スイシヨウハツシンキノ セイゾウホウホウ | |
JPH0138373B2 (enrdf_load_stackoverflow) | ||
JP3194208B2 (ja) | シーム接合法 | |
JP2689621B2 (ja) | 半導体装置とその製造方法 | |
JP2001267867A (ja) | 圧電振動子の製造方法 | |
JPH0774576A (ja) | 圧電振動子 | |
JP4824063B2 (ja) | 半導体素子用パッケージ | |
JPS60223143A (ja) | パツケ−ジング方法 | |
JPH09205160A (ja) | 蓋体のシーム接合法 | |
JPS5915080Y2 (ja) | 半導体装置 | |
JPH10148736A (ja) | 光通信用パッケージ | |
JPS635234Y2 (enrdf_load_stackoverflow) | ||
KR100198993B1 (ko) | 반도체 패키지공정 및 패키지장치 | |
JPH0226041A (ja) | ワイヤボンデイング方法 | |
JPH07245356A (ja) | 半導体パッケージおよびその製造方法 | |
JPH03165006A (ja) | ガラス封止形サーミスタの製造方法 | |
JPS63249355A (ja) | 集積回路の外囲器 | |
JPS6052581B2 (ja) | 半導体装置用容器の気密封止方法 | |
JPH0457344A (ja) | 半導体装置の製造方法及び半導体装置 | |
JPH03255650A (ja) | Icパッケージ |