JPS60143655A - 集積回路部品 - Google Patents

集積回路部品

Info

Publication number
JPS60143655A
JPS60143655A JP58251351A JP25135183A JPS60143655A JP S60143655 A JPS60143655 A JP S60143655A JP 58251351 A JP58251351 A JP 58251351A JP 25135183 A JP25135183 A JP 25135183A JP S60143655 A JPS60143655 A JP S60143655A
Authority
JP
Japan
Prior art keywords
integrated circuit
terminal
resin mold
circuit component
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58251351A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6350866B2 (enrdf_load_stackoverflow
Inventor
Tsuneharu Katada
片田　恒春
Kiyoshi Sawairi
沢入　精
Kazuo Arisue
有末　一夫
Akira Shinohara
篠原　彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58251351A priority Critical patent/JPS60143655A/ja
Publication of JPS60143655A publication Critical patent/JPS60143655A/ja
Publication of JPS6350866B2 publication Critical patent/JPS6350866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58251351A 1983-12-29 1983-12-29 集積回路部品 Granted JPS60143655A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58251351A JPS60143655A (ja) 1983-12-29 1983-12-29 集積回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58251351A JPS60143655A (ja) 1983-12-29 1983-12-29 集積回路部品

Publications (2)

Publication Number Publication Date
JPS60143655A true JPS60143655A (ja) 1985-07-29
JPS6350866B2 JPS6350866B2 (enrdf_load_stackoverflow) 1988-10-12

Family

ID=17221532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58251351A Granted JPS60143655A (ja) 1983-12-29 1983-12-29 集積回路部品

Country Status (1)

Country Link
JP (1) JPS60143655A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (ja) * 1982-11-17 1984-05-28 松下電器産業株式会社 電子部品接続構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (ja) * 1982-11-17 1984-05-28 松下電器産業株式会社 電子部品接続構造

Also Published As

Publication number Publication date
JPS6350866B2 (enrdf_load_stackoverflow) 1988-10-12

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