JPS60143655A - Integrated circuit parts - Google Patents

Integrated circuit parts

Info

Publication number
JPS60143655A
JPS60143655A JP25135183A JP25135183A JPS60143655A JP S60143655 A JPS60143655 A JP S60143655A JP 25135183 A JP25135183 A JP 25135183A JP 25135183 A JP25135183 A JP 25135183A JP S60143655 A JPS60143655 A JP S60143655A
Authority
JP
Japan
Prior art keywords
integrated circuit
terminal
resin mold
circuit component
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25135183A
Other languages
Japanese (ja)
Other versions
JPS6350866B2 (en
Inventor
Tsuneharu Katada
片田　恒春
Kiyoshi Sawairi
沢入　精
Kazuo Arisue
有末　一夫
Akira Shinohara
篠原　彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP25135183A priority Critical patent/JPS60143655A/en
Publication of JPS60143655A publication Critical patent/JPS60143655A/en
Publication of JPS6350866B2 publication Critical patent/JPS6350866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate manufacture of electronic parts by enabling symmetrical arrangement of terminal electrodes of electronic parts which are mounted on an upper surface by arranging terminal leads of an integrated circuit part in a manner the terminal leads which are bent upward are symmetrical to one side of a resin mold. CONSTITUTION:Each of terminal leads 2 led out on an end surface of a resin mold part 1 of an integrated circuit part is divided into two and one of them is bent downward and another is bent upward. The terminal lead 2 is arranged with being displaced in one direction for one side of the resin mold 1 the terminal 2 which is bent upward is so constituted that it is symmetrical to one side of the resin mold 1. And the relation of sizes (c) and (d) from external shapes of the terminal leads 2 of the integrated circuit part and the resin mold part 1 is so determined that the relation of sizes (m) and (n) from external shapes of terminal electrodes 8 and electronic part 7 mounted on the upper surface is m=n.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子機器に用いることができる集積回路部品に
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to integrated circuit components that can be used in electronic equipment.

従来例の構成とその問題点 近年、電子機器の小型化を進める為電子部品の小型化、
複合化、高密度実装が進められている。Conventional structure and its problems In recent years, electronic components have become smaller in order to advance the miniaturization of electronic devices.
Compositeization and high-density packaging are progressing.

以下図面を参照しながら従来の集積回路部品について説
明する０第１図は従来の集積回路部品の２へ・−ジ 斜視図であり、１は樹脂モールド部、２は端子リードで
ある。第２図はこの集積回路部品を機器に実装した時の
断側面図であり、３は回路を構成するコンデンサや抵抗
部品、４はプリント基板、５は銅箔、６は接続用の半田
である。A conventional integrated circuit component will be described below with reference to the drawings. FIG. 1 is a perspective view of a conventional integrated circuit component, in which 1 is a resin molded portion and 2 is a terminal lead. Figure 2 is a cross-sectional side view of this integrated circuit component when it is mounted on a device. 3 is the capacitor and resistor components that make up the circuit, 4 is the printed circuit board, 5 is the copper foil, and 6 is the solder for connection. .

以上の様に構成された集積回路部品においては、機器へ
実装する際、外付けのコンデンサや抵抗部品３は第２図
のようにプリント基板４上で平面的に個々に取付け、銅
箔や半田等によって結線する方法をとってきたが、回路
部品の実装面積が大きくなり、実装密度を向上させるこ
とが困難であるという問題点を有していた。When the integrated circuit components configured as described above are mounted on a device, external capacitors and resistor components 3 are individually mounted flat on a printed circuit board 4 as shown in Figure 2, and soldered with copper foil or solder. However, this method has had the problem that the mounting area of the circuit components becomes large and it is difficult to improve the mounting density.

そこで、実装密度を向上させるため、集積回路部品の上
面にコンデンサや抵抗等を構成した電子部品を取付け、
その結線方法として集積回路部品の端子リードを分割し
て上下に曲げ、上方に曲げた端子を利用する方法が提案
されている。このような積層タイプの部品の側面図を第
３図に示す。Therefore, in order to improve the packaging density, electronic components such as capacitors and resistors are mounted on the top surface of integrated circuit components.
As a connection method, a method has been proposed in which the terminal leads of the integrated circuit component are divided and bent vertically, and the upwardly bent terminals are used. A side view of such a laminated type component is shown in FIG.

第３図において、１は集積回路部品の樹脂モールド部、
２は端子リード、７はコンデンサや抵抗等３′ン を複合したセラミック等から成る電子部品、８はその端
子電極、ａは集積回路部品の端子リード間隔、ｂは樹脂
モールド外形からの端子リード寸法、ｋは上面に搭載し
た電子部品の外形から端子電極までの一方の寸法、２は
その反対側の寸法である。In FIG. 3, 1 is a resin molded part of an integrated circuit component;
2 is a terminal lead, 7 is an electronic component made of a ceramic compound with a capacitor, a resistor, etc., 8 is its terminal electrode, a is the terminal lead spacing of the integrated circuit component, and b is the terminal lead dimension from the resin mold outline. , k is one dimension from the outer shape of the electronic component mounted on the top surface to the terminal electrode, and 2 is the dimension on the opposite side.

以上の様に構成された集積回路部品においては機器へ実
装する際、外付部品は減少し実装密度が向上するが上側
に装着する電子部品７の端子電極８の配置が左右非対称
であり、第３図に示すように寸法にと寸法λの関係がｋ
）２になり、印刷法による端子電極７の場合等は特に製
造工法上困難であり、精度が悪くなるばかりか生産性が
きわめて悪いという問題点を有していた。When the integrated circuit component configured as described above is mounted on a device, the number of external components is reduced and the mounting density is improved, but the arrangement of the terminal electrodes 8 of the electronic component 7 mounted on the upper side is asymmetrical, and As shown in Figure 3, the relationship between the dimensions and the dimension λ is k
) 2, it is particularly difficult to manufacture the terminal electrode 7 by the printing method, and there are problems in that not only the precision is poor but also the productivity is extremely poor.

発明の目的 本発明は、樹脂モールド部の上面に積層される電子部品
を製造しやすくすることができる集積回路部品を提供す
ることを目的とする。OBJECTS OF THE INVENTION An object of the present invention is to provide an integrated circuit component that can facilitate the manufacture of electronic components that are laminated on the upper surface of a resin molded part.

発明の構成 本発明の集積回路部品は、樹脂モールド部の端面に導出
された端子リードの各々が２分割され、その一方が下方
に曲げられると共に他方が上方に曲げられて成り、且つ
上記端子リードが樹脂モールドの各辺に対し一方向にず
らして配置され、上方に曲げられた端子が樹脂モールド
の一辺に対して対称になる様に構成したものであり、こ
れにより上側に搭載される電子部品の端子電極を一辺に
対して対称に配置出来、その電子部品の端子電極製造上
においてきわめて容易に製造出来るとともに、高精度に
製造出来る利点を有するものである。Structure of the Invention The integrated circuit component of the present invention is constructed in such a manner that each of the terminal leads led out from the end face of the resin molded part is divided into two parts, one of which is bent downward and the other bent upward, and the terminal lead is The terminals are arranged offset in one direction with respect to each side of the resin mold, and the terminals bent upward are arranged symmetrically with respect to one side of the resin mold. This has the advantage that the terminal electrodes of the electronic component can be arranged symmetrically with respect to one side, and that the terminal electrodes of the electronic component can be manufactured very easily and with high precision.

実施例の説明 以下本発明の一実施例について図面を参照しながら説明
する。第４図は本発明の一実施例における集積回路部品
にコンデンサや抵抗等を上側に実装した側面図を示すも
のである。第４図において、１は樹脂モールド部、２は
端子リード、７はコンデンサや抵抗等を複合したセラミ
ック等から成る電子部品、８はその端子電極、Ｃは集積
回路部品の樹脂モールド外形から端子リードまでの一方
の寸法、ｄはその反対側の寸法、ｍは上面に搭載した電
子部品７の外形から端子電極までの一方の寸５パ−ン 法、ｎはその反対側の寸法である。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a side view showing a capacitor, a resistor, etc. mounted on the upper side of an integrated circuit component according to an embodiment of the present invention. In Fig. 4, 1 is a resin molded part, 2 is a terminal lead, 7 is an electronic component made of a ceramic compound with a capacitor, a resistor, etc., 8 is its terminal electrode, and C is a terminal lead from the resin mold outline of the integrated circuit component. d is the dimension on the opposite side, m is the dimension on one side from the outer shape of the electronic component 7 mounted on the top surface to the terminal electrode, and n is the dimension on the opposite side.

以上の様に構成された集積回路部品では、まず上面に搭
載された電子部品７の端子電極８と外形からの寸法ｍ及
びｎの関係はｍ　＝　ｎとしており、一方集積回路部品
の端子リード２と樹脂モールド部１外形からの寸法Ｃ及
びｄの関係はｃｏｄ（ここではＯ＜ｄＫＬ、である。）
となる。これはｃＮｄとしたことによシ、ｍ　＝　ｎが
成シ立っことになシ、電子部品７の端面型１Ｉｉ８は電
子部品７の一辺における中心線θから左右対称に配置し
たことにほかならない。またこれは集積回路部品の端子
リード２のうち上方に曲げた端子と対応することであシ
、集積回路部品の上方に曲げた端子リードもまた中心線
θに対して左右対称に配置されていることにほかならな
い。In the integrated circuit component configured as described above, first, the relationship between the terminal electrode 8 of the electronic component 7 mounted on the top surface and the dimensions m and n from the external shape is m = n, and on the other hand, the terminal lead 2 of the integrated circuit component The relationship between the dimensions C and d from the outer shape of the resin mold part 1 is cod (here, O<dKL).
becomes. This is due to the fact that cNd is used, m = n holds true, and the end face mold 1Ii8 of the electronic component 7 is arranged symmetrically with respect to the center line θ on one side of the electronic component 7. This corresponds to the upwardly bent terminal of the terminal lead 2 of the integrated circuit component, and the upwardly bent terminal lead of the integrated circuit component is also arranged symmetrically with respect to the center line θ. Nothing but that.

以上の様に本実施例によれば、集積回路部品の端子リー
ド配置を上方に曲げだ端子リードが樹脂モールドの一辺
に対して対称になる様にしたことによシ、上面に搭載す
る電子部品の端子電極をも対称に配置することが出来る
。As described above, according to this embodiment, the terminal leads of the integrated circuit components are bent upward so that the terminal leads are symmetrical with respect to one side of the resin mold. The terminal electrodes can also be arranged symmetrically.

６へ一ン 発明の効果 以上の説明から明らかな様に本発明は、集積回路部品の
端子リード配置を、上方に曲げた端子リードが樹脂モー
ルドの一辺に対して対称となる様にしたことにより、上
面に搭載した電子部品の端子電極を対称に配置すること
が出来、これによって電子部品の端子電極製造がきわめ
て容易になシ、生産性向上と共に高精度ならしめること
が出来る効果が得られる優れた利点を有する。6. Effects of the Invention As is clear from the above description, the present invention has an advantage in that the terminal leads of the integrated circuit component are arranged so that the upwardly bent terminal leads are symmetrical with respect to one side of the resin mold. , the terminal electrodes of the electronic components mounted on the top surface can be arranged symmetrically, which makes it extremely easy to manufacture the terminal electrodes of the electronic components, and has the advantage of improving productivity and achieving high precision. It has many advantages.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の集積回路部品の斜視図、第２図は従来の
集積回路部品の機器への実装における断側面図、第３図
は従来提案された集積回路部品と電子部品の実装におけ
る側面図、第４図は本発明の一実施例における集積回路
部品と電子部品の実装における側面図である。 １・・・・・・集積回路部品の樹脂モールド部、２・・
・・・・端子リード、７・・・・・・コンデンサや抵抗
等を複合したセラミック等から成る電子部品、８・・・
・・・端子電極○Figure 1 is a perspective view of a conventional integrated circuit component, Figure 2 is a cross-sectional side view of a conventional integrated circuit component mounted on a device, and Figure 3 is a side view of a previously proposed mounting of an integrated circuit component and an electronic component. FIG. 4 is a side view of the mounting of integrated circuit components and electronic components in one embodiment of the present invention. 1...Resin mold part of integrated circuit component, 2...
...Terminal lead, 7...Electronic component made of ceramic, etc., which is a composite of capacitors, resistors, etc., 8...
・・・Terminal electrode○

Claims (1)

【特許請求の範囲】[Claims] 樹脂モールド部の端面に導出された端子リードの各々が
２分割され、その一方が下方に曲げられると共に他方が
上方に曲げられて成り、かつ上記端子リードが樹脂モー
ルド部の各辺に対し一方向にずらして配置され、上方に
曲げられた端子が樹脂モールド部の一辺に対して対称に
なるように構成したことを特徴とする集積回路部品。Each of the terminal leads led out to the end face of the resin molded part is divided into two parts, one of which is bent downward and the other bent upward, and the terminal lead is bent in one direction with respect to each side of the resin molded part. An integrated circuit component characterized in that the terminals are arranged so as to be shifted from each other and bent upward so that they are symmetrical with respect to one side of a resin molded part.
JP25135183A 1983-12-29 1983-12-29 Integrated circuit parts Granted JPS60143655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25135183A JPS60143655A (en) 1983-12-29 1983-12-29 Integrated circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25135183A JPS60143655A (en) 1983-12-29 1983-12-29 Integrated circuit parts

Publications (2)

Publication Number Publication Date
JPS60143655A true JPS60143655A (en) 1985-07-29
JPS6350866B2 JPS6350866B2 (en) 1988-10-12

Family

ID=17221532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25135183A Granted JPS60143655A (en) 1983-12-29 1983-12-29 Integrated circuit parts

Country Status (1)

Country Link
JP (1) JPS60143655A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (en) * 1982-11-17 1984-05-28 松下電器産業株式会社 Electronic component connection structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (en) * 1982-11-17 1984-05-28 松下電器産業株式会社 Electronic component connection structure

Also Published As

Publication number Publication date
JPS6350866B2 (en) 1988-10-12

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