JPS60140898A - 多層プリント回路板構造及びその製造方法 - Google Patents

多層プリント回路板構造及びその製造方法

Info

Publication number
JPS60140898A
JPS60140898A JP59257282A JP25728284A JPS60140898A JP S60140898 A JPS60140898 A JP S60140898A JP 59257282 A JP59257282 A JP 59257282A JP 25728284 A JP25728284 A JP 25728284A JP S60140898 A JPS60140898 A JP S60140898A
Authority
JP
Japan
Prior art keywords
circuit board
graphite
layers
printed circuit
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59257282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533557B2 (https=
Inventor
ジヨセフ　デイヴイツド　リーボウイツツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Space and Mission Systems Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Publication of JPS60140898A publication Critical patent/JPS60140898A/ja
Publication of JPH0533557B2 publication Critical patent/JPH0533557B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP59257282A 1983-12-22 1984-12-05 多層プリント回路板構造及びその製造方法 Granted JPS60140898A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/564,952 US4591659A (en) 1983-12-22 1983-12-22 Multilayer printed circuit board structure
US564952 1983-12-22

Publications (2)

Publication Number Publication Date
JPS60140898A true JPS60140898A (ja) 1985-07-25
JPH0533557B2 JPH0533557B2 (https=) 1993-05-19

Family

ID=24256579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59257282A Granted JPS60140898A (ja) 1983-12-22 1984-12-05 多層プリント回路板構造及びその製造方法

Country Status (5)

Country Link
US (1) US4591659A (https=)
EP (1) EP0147014B1 (https=)
JP (1) JPS60140898A (https=)
CA (1) CA1230182A (https=)
DE (1) DE3484132D1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000079848A1 (en) * 1999-06-21 2000-12-28 Mitsubishi Denki Kabushiki Kaisha Method for producing circuit-forming board, circuit-forming board, and carbon sheet
JP2004515610A (ja) * 2000-12-12 2004-05-27 シュリ ディクシャ コーポレイション 伝導性制約コアを含む軽量回路板
US6869665B2 (en) 2002-09-26 2005-03-22 Fujitsu Limited Wiring board with core layer containing inorganic filler
US7224046B2 (en) 2003-01-16 2007-05-29 Fujitsu Limited Multilayer wiring board incorporating carbon fibers and glass fibers
WO2024203362A1 (ja) * 2023-03-24 2024-10-03 京セラ株式会社 多層基板

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
JPS61220499A (ja) * 1985-03-27 1986-09-30 株式会社日立製作所 混成多層配線基板
US4882000A (en) * 1985-05-23 1989-11-21 O. Key Printed Wiring Co., Ltc. Method of manufacturing printed circuit boards
JPH0246061Y2 (https=) * 1986-03-17 1990-12-05
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4755911A (en) * 1987-04-28 1988-07-05 Junkosha Co., Ltd. Multilayer printed circuit board
US4875282A (en) * 1987-09-18 1989-10-24 Trw Inc. Method of making multilayer printed circuit board
US4814945A (en) * 1987-09-18 1989-03-21 Trw Inc. Multilayer printed circuit board for ceramic chip carriers
CA1298770C (en) * 1987-12-18 1992-04-14 Craig S. Mcewen Low dielectric constant laminate of fluoropolymer and polyaramid
US4868350A (en) * 1988-03-07 1989-09-19 International Business Machines Corporation High performance circuit boards
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US4987100A (en) * 1988-05-26 1991-01-22 International Business Machines Corporation Flexible carrier for an electronic device
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
US4937934A (en) * 1989-02-10 1990-07-03 Rockwell International Corporation Installation of surface mount components on printed wiring boards
EP0393312A1 (de) * 1989-04-21 1990-10-24 Dyconex AG Mehrlagige Leiterplatte
US5224017A (en) * 1989-05-17 1993-06-29 The Charles Stark Draper Laboratory, Inc. Composite heat transfer device
US4963414A (en) * 1989-06-12 1990-10-16 General Electric Company Low thermal expansion, heat sinking substrate for electronic surface mount applications
US5195021A (en) * 1989-08-21 1993-03-16 Texas Instruments Incorporated Constraining core for surface mount technology
US5316080A (en) * 1990-03-30 1994-05-31 The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration Heat transfer device
US5224030A (en) * 1990-03-30 1993-06-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Semiconductor cooling apparatus
US5269863A (en) * 1990-09-24 1993-12-14 Akzo Nv Continuous process for the manufacture of substrates for printed wire boards
US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
WO1993023979A1 (fr) * 1992-05-15 1993-11-25 Marina Adolfovna Sokolinskaya Substrat pour cartes de circuits imprimes et son procede de production
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US5572405A (en) * 1995-06-07 1996-11-05 International Business Machines Corporation (Ibm) Thermally enhanced ball grid array package
US5888630A (en) 1996-11-08 1999-03-30 W. L. Gore & Associates, Inc. Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly
US5879786A (en) * 1996-11-08 1999-03-09 W. L. Gore & Associates, Inc. Constraining ring for use in electronic packaging
US5900312A (en) * 1996-11-08 1999-05-04 W. L. Gore & Associates, Inc. Integrated circuit chip package assembly
US6102112A (en) * 1998-02-17 2000-08-15 Lockheed Martin Corporation Thermally conductive support structure
GB9814835D0 (en) 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US20040009353A1 (en) * 1999-06-14 2004-01-15 Knowles Timothy R. PCM/aligned fiber composite thermal interface
US7132161B2 (en) * 1999-06-14 2006-11-07 Energy Science Laboratories, Inc. Fiber adhesive material
US6913075B1 (en) * 1999-06-14 2005-07-05 Energy Science Laboratories, Inc. Dendritic fiber material
IT1311277B1 (it) * 1999-12-23 2002-03-12 St Microelectronics Srl Dispositivo elettronico con collegamenti a doppio filo, metodo difabbricazione di tale dispositivo elettronico e metodo di verifica
EP1202098A1 (en) * 2000-10-26 2002-05-02 Agilent Technologies, Inc. (a Delaware corporation) Low-stress interface between materials having different thermal coefficients of expansion and method for fabricating same
US20060099406A1 (en) * 2001-08-31 2006-05-11 Julian Norley Heat spreader for printed circuit boards
JP4119205B2 (ja) * 2002-08-27 2008-07-16 富士通株式会社 多層配線基板
KR20060010763A (ko) * 2003-05-01 2006-02-02 퀸 메리 앤드 웨스트필드 컬리지 케이스화된 열 관리 장치 및 그 제조 방법
TWI264973B (en) * 2003-09-19 2006-10-21 Fujitsu Ltd Printed wiring board
US20050257957A1 (en) * 2004-05-15 2005-11-24 Kaluk Vasoya Printed wiring board with conductive constraining core including resin filled channels
WO2006024009A2 (en) * 2004-08-24 2006-03-02 C-Core Technologies, Inc. Edge plated printed wiring boards
US7301105B2 (en) * 2004-08-27 2007-11-27 Stablcor, Inc. Printed wiring boards possessing regions with different coefficients of thermal expansion
US20060083927A1 (en) * 2004-10-15 2006-04-20 Zyvex Corporation Thermal interface incorporating nanotubes
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
JP5491026B2 (ja) * 2005-03-15 2014-05-14 スタブルコー テクノロジー，インコーポレイティド プリント配線基板中に補強コア材料を構成する製造方法
US20060225874A1 (en) * 2005-04-11 2006-10-12 Shives Gary D Sandwiched thermal article
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
JP4545682B2 (ja) * 2005-12-05 2010-09-15 株式会社潤工社 弗素樹脂積層基板
CN103298243B (zh) 2006-07-14 2016-05-11 斯塔布科尔技术公司 具有构成电路一部分的核心层的增层印刷线路板衬底
CN101543150B (zh) * 2006-11-10 2012-11-28 日本电气株式会社 多层布线基板
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5085266B2 (ja) * 2007-10-12 2012-11-28 富士通株式会社 配線基板およびその製造方法
JP5645821B2 (ja) 2008-08-18 2014-12-24 センブラント リミテッド ハロ炭化水素ポリマーコーティング
TWI402173B (zh) * 2008-11-17 2013-07-21 Fujitsu Ltd 電路板及其製造方法（一）
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI423750B (zh) * 2010-09-24 2014-01-11 光宏精密股份有限公司 非導電性載體形成電路結構之製造方法
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
KR102125905B1 (ko) * 2013-04-25 2020-06-24 삼성디스플레이 주식회사 인쇄 회로 기판, 표시 장치 및 인쇄 회로 기판의 제조 방법
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US9791704B2 (en) * 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10123412B2 (en) 2016-01-28 2018-11-06 Rogers Corporation Thermosetting polymer formulations, circuit materials, and methods of use thereof
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US11164934B2 (en) 2019-03-12 2021-11-02 X Display Company Technology Limited Tiled displays with black-matrix support screens
TWI748740B (zh) 2020-11-11 2021-12-01 宸寰科技有限公司 散熱導電軟板
CN115515303B (zh) * 2022-10-26 2026-04-24 郑州大学 一种ptfe低热膨胀系数覆铜板及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952231A (en) * 1974-09-06 1976-04-20 International Business Machines Corporation Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
US4054939A (en) * 1975-06-06 1977-10-18 Elfab Corporation Multi-layer backpanel including metal plate ground and voltage planes
US4294877A (en) * 1979-04-05 1981-10-13 E. I. Du Pont De Nemours And Company Epoxy imide compositions
DE3035749A1 (de) * 1980-09-22 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Waermeableitende leiterplatten
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
US4464704A (en) * 1980-09-26 1984-08-07 Sperry Corporation Polyimide/glass-epoxy/glass hybrid printed circuit board
US4327126A (en) * 1980-11-10 1982-04-27 Ralph Ogden Method of making printed circuit boards
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
US4456712A (en) * 1982-06-14 1984-06-26 International Business Machines Corporation Bismaleimide triazine composition

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000079848A1 (en) * 1999-06-21 2000-12-28 Mitsubishi Denki Kabushiki Kaisha Method for producing circuit-forming board, circuit-forming board, and carbon sheet
US6629362B2 (en) 1999-06-21 2003-10-07 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit print board
CN100393183C (zh) * 1999-06-21 2008-06-04 三菱电机株式会社 电路形成基板制造方法
JP2004515610A (ja) * 2000-12-12 2004-05-27 シュリ ディクシャ コーポレイション 伝導性制約コアを含む軽量回路板
US6869665B2 (en) 2002-09-26 2005-03-22 Fujitsu Limited Wiring board with core layer containing inorganic filler
US7224046B2 (en) 2003-01-16 2007-05-29 Fujitsu Limited Multilayer wiring board incorporating carbon fibers and glass fibers
US7640660B2 (en) 2003-01-16 2010-01-05 Fujitsu Limited Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers
WO2024203362A1 (ja) * 2023-03-24 2024-10-03 京セラ株式会社 多層基板

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DE3484132D1 (de) 1991-03-28
US4591659A (en) 1986-05-27
EP0147014B1 (en) 1991-02-20
EP0147014A3 (en) 1987-05-27
JPH0533557B2 (https=) 1993-05-19
CA1230182A (en) 1987-12-08
EP0147014A2 (en) 1985-07-03

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