DE3484132D1 - Mehrschichtleiterplatte struktur. - Google Patents
Mehrschichtleiterplatte struktur.Info
- Publication number
- DE3484132D1 DE3484132D1 DE8484306412T DE3484132T DE3484132D1 DE 3484132 D1 DE3484132 D1 DE 3484132D1 DE 8484306412 T DE8484306412 T DE 8484306412T DE 3484132 T DE3484132 T DE 3484132T DE 3484132 D1 DE3484132 D1 DE 3484132D1
- Authority
- DE
- Germany
- Prior art keywords
- layer pcb
- pcb structure
- layer
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/564,952 US4591659A (en) | 1983-12-22 | 1983-12-22 | Multilayer printed circuit board structure |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3484132D1 true DE3484132D1 (de) | 1991-03-28 |
Family
ID=24256579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484306412T Expired - Fee Related DE3484132D1 (de) | 1983-12-22 | 1984-09-19 | Mehrschichtleiterplatte struktur. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4591659A (de) |
EP (1) | EP0147014B1 (de) |
JP (1) | JPS60140898A (de) |
CA (1) | CA1230182A (de) |
DE (1) | DE3484132D1 (de) |
Families Citing this family (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4812792A (en) * | 1983-12-22 | 1989-03-14 | Trw Inc. | High-frequency multilayer printed circuit board |
JPS61220499A (ja) * | 1985-03-27 | 1986-09-30 | 株式会社日立製作所 | 混成多層配線基板 |
US4882000A (en) * | 1985-05-23 | 1989-11-21 | O. Key Printed Wiring Co., Ltc. | Method of manufacturing printed circuit boards |
JPH0246061Y2 (de) * | 1986-03-17 | 1990-12-05 | ||
US4888247A (en) * | 1986-08-27 | 1989-12-19 | General Electric Company | Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite |
US4755911A (en) * | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
US4814945A (en) * | 1987-09-18 | 1989-03-21 | Trw Inc. | Multilayer printed circuit board for ceramic chip carriers |
US4875282A (en) * | 1987-09-18 | 1989-10-24 | Trw Inc. | Method of making multilayer printed circuit board |
CA1298770C (en) * | 1987-12-18 | 1992-04-14 | Craig S. Mcewen | Low dielectric constant laminate of fluoropolymer and polyaramid |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4937934A (en) * | 1989-02-10 | 1990-07-03 | Rockwell International Corporation | Installation of surface mount components on printed wiring boards |
EP0393312A1 (de) * | 1989-04-21 | 1990-10-24 | Dyconex AG | Mehrlagige Leiterplatte |
US5224017A (en) * | 1989-05-17 | 1993-06-29 | The Charles Stark Draper Laboratory, Inc. | Composite heat transfer device |
US4963414A (en) * | 1989-06-12 | 1990-10-16 | General Electric Company | Low thermal expansion, heat sinking substrate for electronic surface mount applications |
US5195021A (en) * | 1989-08-21 | 1993-03-16 | Texas Instruments Incorporated | Constraining core for surface mount technology |
US5224030A (en) * | 1990-03-30 | 1993-06-29 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Semiconductor cooling apparatus |
US5316080A (en) * | 1990-03-30 | 1994-05-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration | Heat transfer device |
US5269863A (en) * | 1990-09-24 | 1993-12-14 | Akzo Nv | Continuous process for the manufacture of substrates for printed wire boards |
US5311406A (en) * | 1991-10-30 | 1994-05-10 | Honeywell Inc. | Microstrip printed wiring board and a method for making same |
WO1993023979A1 (en) * | 1992-05-15 | 1993-11-25 | Marina Adolfovna Sokolinskaya | Substrate for printed circuit boards and method of making it |
US5619018A (en) * | 1995-04-03 | 1997-04-08 | Compaq Computer Corporation | Low weight multilayer printed circuit board |
US5572405A (en) * | 1995-06-07 | 1996-11-05 | International Business Machines Corporation (Ibm) | Thermally enhanced ball grid array package |
US5888630A (en) | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly |
US5900312A (en) | 1996-11-08 | 1999-05-04 | W. L. Gore & Associates, Inc. | Integrated circuit chip package assembly |
US5879786A (en) * | 1996-11-08 | 1999-03-09 | W. L. Gore & Associates, Inc. | Constraining ring for use in electronic packaging |
US6102112A (en) * | 1998-02-17 | 2000-08-15 | Lockheed Martin Corporation | Thermally conductive support structure |
GB9814835D0 (en) | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
US6913075B1 (en) * | 1999-06-14 | 2005-07-05 | Energy Science Laboratories, Inc. | Dendritic fiber material |
US20040009353A1 (en) * | 1999-06-14 | 2004-01-15 | Knowles Timothy R. | PCM/aligned fiber composite thermal interface |
US7132161B2 (en) * | 1999-06-14 | 2006-11-07 | Energy Science Laboratories, Inc. | Fiber adhesive material |
JP4365061B2 (ja) | 1999-06-21 | 2009-11-18 | 三菱電機株式会社 | 回路形成基板製造方法及び回路形成基板 |
IT1311277B1 (it) * | 1999-12-23 | 2002-03-12 | St Microelectronics Srl | Dispositivo elettronico con collegamenti a doppio filo, metodo difabbricazione di tale dispositivo elettronico e metodo di verifica |
EP1202098A1 (de) * | 2000-10-26 | 2002-05-02 | Agilent Technologies, Inc. (a Delaware corporation) | Schnittstelle mit niedrigem thermischen Widerstand zwischen Materialien mit verschiedenen thermischen Ausdehnungskoeffizienten und zugehöriges Herstellungsverfahren |
US6869664B2 (en) * | 2000-12-12 | 2005-03-22 | Thermalworks, Inc. | Lightweight circuit board with conductive constraining cores |
US20060099406A1 (en) * | 2001-08-31 | 2006-05-11 | Julian Norley | Heat spreader for printed circuit boards |
JP4119205B2 (ja) * | 2002-08-27 | 2008-07-16 | 富士通株式会社 | 多層配線基板 |
JP3822549B2 (ja) * | 2002-09-26 | 2006-09-20 | 富士通株式会社 | 配線基板 |
WO2004064467A1 (ja) * | 2003-01-16 | 2004-07-29 | Fujitsu Limited | 多層配線基板、その製造方法、および、ファイバ強化樹脂基板の製造方法 |
RU2005137313A (ru) * | 2003-05-01 | 2006-04-27 | Квин Мэри Энд Уестфилд Колледж (Gb) | Заключенное в оболочку терморегулирующее устройство и способ изготовления такого устройства |
TWI264973B (en) * | 2003-09-19 | 2006-10-21 | Fujitsu Ltd | Printed wiring board |
TW200603694A (en) * | 2004-05-15 | 2006-01-16 | Kalu K Vasoya | Printed wiring board with conductive constraining core including resin filled slots |
WO2006024009A2 (en) * | 2004-08-24 | 2006-03-02 | C-Core Technologies, Inc. | Edge plated printed wiring boards |
WO2006026566A1 (en) * | 2004-08-27 | 2006-03-09 | Vasoya Kalu K | Printed wiring boards possessing regions with different coefficients of thermal expansion |
US20060083927A1 (en) * | 2004-10-15 | 2006-04-20 | Zyvex Corporation | Thermal interface incorporating nanotubes |
JP4556174B2 (ja) * | 2004-12-15 | 2010-10-06 | 日本電気株式会社 | 携帯端末機器及び放熱方法 |
EP1862040A4 (de) * | 2005-03-15 | 2009-11-04 | Stablcore Inc | Herstellungsverfahren: einbau von stützkernmaterial in leiterplatten |
US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
JP4545682B2 (ja) * | 2005-12-05 | 2010-09-15 | 株式会社潤工社 | 弗素樹脂積層基板 |
WO2008008552A2 (en) * | 2006-07-14 | 2008-01-17 | Stablcor, Inc. | Build-up printed wiring board substrate having a core layer that is part of a circuit |
JP5040921B2 (ja) * | 2006-11-10 | 2012-10-03 | 日本電気株式会社 | 多層配線基板 |
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
JP5085266B2 (ja) * | 2007-10-12 | 2012-11-28 | 富士通株式会社 | 配線基板およびその製造方法 |
BRPI0917289A8 (pt) | 2008-08-18 | 2019-09-17 | Semblant Global Ltd | revestimento polimérico de halo-hidrocarboneto |
TWI402173B (zh) * | 2008-11-17 | 2013-07-21 | Fujitsu Ltd | 電路板及其製造方法(一) |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
TWI423750B (zh) * | 2010-09-24 | 2014-01-11 | Kuang Hong Prec Co Ltd | 非導電性載體形成電路結構之製造方法 |
US9899329B2 (en) | 2010-11-23 | 2018-02-20 | X-Celeprint Limited | Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance |
US8569631B2 (en) * | 2011-05-05 | 2013-10-29 | Tangitek, Llc | Noise dampening energy efficient circuit board and method for constructing and using same |
US8934259B2 (en) | 2011-06-08 | 2015-01-13 | Semprius, Inc. | Substrates with transferable chiplets |
KR102125905B1 (ko) * | 2013-04-25 | 2020-06-24 | 삼성디스플레이 주식회사 | 인쇄 회로 기판, 표시 장치 및 인쇄 회로 기판의 제조 방법 |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
US9799719B2 (en) | 2014-09-25 | 2017-10-24 | X-Celeprint Limited | Active-matrix touchscreen |
US9791704B2 (en) * | 2015-01-20 | 2017-10-17 | Microsoft Technology Licensing, Llc | Bonded multi-layer graphite heat pipe |
US10108017B2 (en) | 2015-01-20 | 2018-10-23 | Microsoft Technology Licensing, Llc | Carbon nanoparticle infused optical mount |
US10028418B2 (en) | 2015-01-20 | 2018-07-17 | Microsoft Technology Licensing, Llc | Metal encased graphite layer heat pipe |
US10444515B2 (en) | 2015-01-20 | 2019-10-15 | Microsoft Technology Licensing, Llc | Convective optical mount structure |
US10123412B2 (en) | 2016-01-28 | 2018-11-06 | Rogers Corporation | Thermosetting polymer formulations, circuit materials, and methods of use thereof |
WO2017144573A1 (en) | 2016-02-25 | 2017-08-31 | X-Celeprint Limited | Efficiently micro-transfer printing micro-scale devices onto large-format substrates |
US10600671B2 (en) | 2016-11-15 | 2020-03-24 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
US10395966B2 (en) | 2016-11-15 | 2019-08-27 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
WO2018091459A1 (en) | 2016-11-15 | 2018-05-24 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
US11024608B2 (en) | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
US11164934B2 (en) | 2019-03-12 | 2021-11-02 | X Display Company Technology Limited | Tiled displays with black-matrix support screens |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3952231A (en) * | 1974-09-06 | 1976-04-20 | International Business Machines Corporation | Functional package for complex electronic systems with polymer-metal laminates and thermal transposer |
US4054939A (en) * | 1975-06-06 | 1977-10-18 | Elfab Corporation | Multi-layer backpanel including metal plate ground and voltage planes |
US4294877A (en) * | 1979-04-05 | 1981-10-13 | E. I. Du Pont De Nemours And Company | Epoxy imide compositions |
DE3035749A1 (de) * | 1980-09-22 | 1982-05-06 | Siemens AG, 1000 Berlin und 8000 München | Waermeableitende leiterplatten |
US4472762A (en) * | 1980-09-25 | 1984-09-18 | Texas Instruments Incorporated | Electronic circuit interconnection system |
US4464704A (en) * | 1980-09-26 | 1984-08-07 | Sperry Corporation | Polyimide/glass-epoxy/glass hybrid printed circuit board |
US4327126A (en) * | 1980-11-10 | 1982-04-27 | Ralph Ogden | Method of making printed circuit boards |
US4318954A (en) * | 1981-02-09 | 1982-03-09 | Boeing Aerospace Company | Printed wiring board substrates for ceramic chip carriers |
JPS57145397A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Ltd | Method of producing multilayer printed circuit board |
US4456712A (en) * | 1982-06-14 | 1984-06-26 | International Business Machines Corporation | Bismaleimide triazine composition |
-
1983
- 1983-12-22 US US06/564,952 patent/US4591659A/en not_active Expired - Lifetime
-
1984
- 1984-09-19 DE DE8484306412T patent/DE3484132D1/de not_active Expired - Fee Related
- 1984-09-19 EP EP84306412A patent/EP0147014B1/de not_active Expired - Lifetime
- 1984-11-09 CA CA000467506A patent/CA1230182A/en not_active Expired
- 1984-12-05 JP JP59257282A patent/JPS60140898A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
CA1230182A (en) | 1987-12-08 |
JPS60140898A (ja) | 1985-07-25 |
EP0147014A2 (de) | 1985-07-03 |
JPH0533557B2 (de) | 1993-05-19 |
EP0147014A3 (en) | 1987-05-27 |
EP0147014B1 (de) | 1991-02-20 |
US4591659A (en) | 1986-05-27 |
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