JPS60127792A - 電子部品の実装方法 - Google Patents
電子部品の実装方法Info
- Publication number
- JPS60127792A JPS60127792A JP23503983A JP23503983A JPS60127792A JP S60127792 A JPS60127792 A JP S60127792A JP 23503983 A JP23503983 A JP 23503983A JP 23503983 A JP23503983 A JP 23503983A JP S60127792 A JPS60127792 A JP S60127792A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- conductor
- round
- adhesive
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23503983A JPS60127792A (ja) | 1983-12-15 | 1983-12-15 | 電子部品の実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23503983A JPS60127792A (ja) | 1983-12-15 | 1983-12-15 | 電子部品の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60127792A true JPS60127792A (ja) | 1985-07-08 |
JPH0325039B2 JPH0325039B2 (enrdf_load_stackoverflow) | 1991-04-04 |
Family
ID=16980175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23503983A Granted JPS60127792A (ja) | 1983-12-15 | 1983-12-15 | 電子部品の実装方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60127792A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109535A (ja) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | セット基板に対する表面実装水晶発振器の実装方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5187767A (ja) * | 1975-01-31 | 1976-07-31 | Hitachi Ltd | Handasokeiseihoho |
JPS5612378U (enrdf_load_stackoverflow) * | 1979-07-05 | 1981-02-02 |
-
1983
- 1983-12-15 JP JP23503983A patent/JPS60127792A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5187767A (ja) * | 1975-01-31 | 1976-07-31 | Hitachi Ltd | Handasokeiseihoho |
JPS5612378U (enrdf_load_stackoverflow) * | 1979-07-05 | 1981-02-02 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109535A (ja) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | セット基板に対する表面実装水晶発振器の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0325039B2 (enrdf_load_stackoverflow) | 1991-04-04 |
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