JPS60127783A - 金属ベ−ス積層板 - Google Patents
金属ベ−ス積層板Info
- Publication number
- JPS60127783A JPS60127783A JP23541183A JP23541183A JPS60127783A JP S60127783 A JPS60127783 A JP S60127783A JP 23541183 A JP23541183 A JP 23541183A JP 23541183 A JP23541183 A JP 23541183A JP S60127783 A JPS60127783 A JP S60127783A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plate
- rough surface
- metal plate
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims description 54
- 229910052751 metal Inorganic materials 0.000 title claims description 54
- 239000011888 foil Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 229910000976 Electrical steel Inorganic materials 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- -1 Tetoron Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23541183A JPS60127783A (ja) | 1983-12-14 | 1983-12-14 | 金属ベ−ス積層板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23541183A JPS60127783A (ja) | 1983-12-14 | 1983-12-14 | 金属ベ−ス積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60127783A true JPS60127783A (ja) | 1985-07-08 |
JPH0136993B2 JPH0136993B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-03 |
Family
ID=16985694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23541183A Granted JPS60127783A (ja) | 1983-12-14 | 1983-12-14 | 金属ベ−ス積層板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60127783A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0239930A (ja) * | 1988-07-29 | 1990-02-08 | Shin Kobe Electric Mach Co Ltd | 金属芯入金属箔張積層板およびその製造法 |
JP2022173751A (ja) * | 2021-05-10 | 2022-11-22 | デンカ株式会社 | 積層体、回路基板及び回路基板の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4999580A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-01-24 | 1974-09-20 | ||
JPS5617227A (en) * | 1979-07-24 | 1981-02-19 | Showa Denko Kk | Method and apparatus for folding inflated film |
JPS57160631A (en) * | 1981-03-31 | 1982-10-04 | Sumitomo Light Metal Ind | Aluminum base material laminated board for printed wiring board and its manufacture |
-
1983
- 1983-12-14 JP JP23541183A patent/JPS60127783A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4999580A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-01-24 | 1974-09-20 | ||
JPS5617227A (en) * | 1979-07-24 | 1981-02-19 | Showa Denko Kk | Method and apparatus for folding inflated film |
JPS57160631A (en) * | 1981-03-31 | 1982-10-04 | Sumitomo Light Metal Ind | Aluminum base material laminated board for printed wiring board and its manufacture |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0239930A (ja) * | 1988-07-29 | 1990-02-08 | Shin Kobe Electric Mach Co Ltd | 金属芯入金属箔張積層板およびその製造法 |
JP2022173751A (ja) * | 2021-05-10 | 2022-11-22 | デンカ株式会社 | 積層体、回路基板及び回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0136993B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-03 |
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