JPS57160631A - Aluminum base material laminated board for printed wiring board and its manufacture - Google Patents
Aluminum base material laminated board for printed wiring board and its manufactureInfo
- Publication number
- JPS57160631A JPS57160631A JP4771981A JP4771981A JPS57160631A JP S57160631 A JPS57160631 A JP S57160631A JP 4771981 A JP4771981 A JP 4771981A JP 4771981 A JP4771981 A JP 4771981A JP S57160631 A JPS57160631 A JP S57160631A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- base material
- printed wiring
- aluminum base
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4771981A JPS6049593B2 (en) | 1981-03-31 | 1981-03-31 | Aluminum base laminate for printed wiring boards and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4771981A JPS6049593B2 (en) | 1981-03-31 | 1981-03-31 | Aluminum base laminate for printed wiring boards and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57160631A true JPS57160631A (en) | 1982-10-04 |
JPS6049593B2 JPS6049593B2 (en) | 1985-11-02 |
Family
ID=12783116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4771981A Expired JPS6049593B2 (en) | 1981-03-31 | 1981-03-31 | Aluminum base laminate for printed wiring boards and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6049593B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085922U (en) * | 1983-11-18 | 1985-06-13 | 昭和アルミニウム株式会社 | Metal plate adhesive foam polystyrene molding |
JPS60127783A (en) * | 1983-12-14 | 1985-07-08 | 松下電工株式会社 | Metal base laminated board |
JPS60163492A (en) * | 1984-02-03 | 1985-08-26 | 東芝ケミカル株式会社 | Substrate for heat sink printed circuit |
JPH01168097A (en) * | 1987-12-24 | 1989-07-03 | Sumitomo Bakelite Co Ltd | Manufacture of metal lining plate for high frequency circuit |
JPH01211995A (en) * | 1988-02-19 | 1989-08-25 | Ok Print Haisen Kk | Manufacture of printed wiring board |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0453285U (en) * | 1990-09-11 | 1992-05-07 | ||
JP2014116351A (en) * | 2012-12-06 | 2014-06-26 | Nippon Multi Kk | High thermal-conductivity printed wiring board and method of manufacturing the same |
-
1981
- 1981-03-31 JP JP4771981A patent/JPS6049593B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085922U (en) * | 1983-11-18 | 1985-06-13 | 昭和アルミニウム株式会社 | Metal plate adhesive foam polystyrene molding |
JPS60127783A (en) * | 1983-12-14 | 1985-07-08 | 松下電工株式会社 | Metal base laminated board |
JPH0136993B2 (en) * | 1983-12-14 | 1989-08-03 | Matsushita Electric Works Ltd | |
JPS60163492A (en) * | 1984-02-03 | 1985-08-26 | 東芝ケミカル株式会社 | Substrate for heat sink printed circuit |
JPH01168097A (en) * | 1987-12-24 | 1989-07-03 | Sumitomo Bakelite Co Ltd | Manufacture of metal lining plate for high frequency circuit |
JPH01211995A (en) * | 1988-02-19 | 1989-08-25 | Ok Print Haisen Kk | Manufacture of printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPS6049593B2 (en) | 1985-11-02 |
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