JPS60121747A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60121747A
JPS60121747A JP15289284A JP15289284A JPS60121747A JP S60121747 A JPS60121747 A JP S60121747A JP 15289284 A JP15289284 A JP 15289284A JP 15289284 A JP15289284 A JP 15289284A JP S60121747 A JPS60121747 A JP S60121747A
Authority
JP
Japan
Prior art keywords
tab
mold part
leads
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15289284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468783B2 (enrdf_load_stackoverflow
Inventor
Keizo Otsuki
大槻　桂三
Hidetoshi Mochizuki
秀俊 望月
Akira Suzuki
明 鈴木
Yoshio Adachi
足達　嘉雄
Hideki Kosaka
小坂　秀樹
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15289284A priority Critical patent/JPS60121747A/ja
Publication of JPS60121747A publication Critical patent/JPS60121747A/ja
Publication of JPH0468783B2 publication Critical patent/JPH0468783B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP15289284A 1984-07-25 1984-07-25 半導体装置 Granted JPS60121747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15289284A JPS60121747A (ja) 1984-07-25 1984-07-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15289284A JPS60121747A (ja) 1984-07-25 1984-07-25 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9360778A Division JPS5521128A (en) 1978-08-02 1978-08-02 Lead frame used for semiconductor device and its assembling

Publications (2)

Publication Number Publication Date
JPS60121747A true JPS60121747A (ja) 1985-06-29
JPH0468783B2 JPH0468783B2 (enrdf_load_stackoverflow) 1992-11-04

Family

ID=15550405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15289284A Granted JPS60121747A (ja) 1984-07-25 1984-07-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS60121747A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466968A (en) * 1993-11-02 1995-11-14 Rohm Co. Ltd. Leadframe for making semiconductor devices
US20190348348A1 (en) * 2000-10-06 2019-11-14 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466968A (en) * 1993-11-02 1995-11-14 Rohm Co. Ltd. Leadframe for making semiconductor devices
US20190348348A1 (en) * 2000-10-06 2019-11-14 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US10886204B2 (en) * 2000-10-06 2021-01-05 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely

Also Published As

Publication number Publication date
JPH0468783B2 (enrdf_load_stackoverflow) 1992-11-04

Similar Documents

Publication Publication Date Title
JPS639378B2 (enrdf_load_stackoverflow)
JP3535328B2 (ja) リードフレームとこれを用いた半導体装置
JP2005142554A (ja) リードフレーム及びこれを適用した半導体パッケージの製造方法
US4912546A (en) Lead frame and method of fabricating a semiconductor device
JPH05291467A (ja) リードフレームおよび半導体装置
JPS60121747A (ja) 半導体装置
JPS58218149A (ja) 樹脂封止ダイオ−ド用リ−ドフレ−ム
JPS60121750A (ja) リ−ドフレ−ム
JPS60121749A (ja) リ−ドフレ−ム
JPS60121748A (ja) 半導体装置
JPS6248053A (ja) 半導体装置用リ−ドフレ−ムの製造方法
JP2751896B2 (ja) 樹脂封止型半導体装置
JP2772897B2 (ja) リ−ドフレ−ム、およびリ−ドフレ−ムを用いた接続端子の作製方法
KR970007128B1 (ko) 반도체장치
JPS62188350A (ja) リ−ドフレ−ム
JPH02228058A (ja) 半導体装置
JP2697743B2 (ja) 樹脂封止型半導体装置
JPS60121751A (ja) 半導体装置の製法
JPH043508Y2 (enrdf_load_stackoverflow)
JPH09116080A (ja) リード端子及びそれに用いるリードフレーム
JPH04164357A (ja) 半導体装置用リードフレーム
JP2589184B2 (ja) 半導体装置の製造方法
JPS60103653A (ja) 半導体装置の製造方法
JPH03152966A (ja) 半導体装置用リードフレーム
JPS621239A (ja) 半導体装置