JPS60121733A - インナ−リ−ドボンダ− - Google Patents

インナ−リ−ドボンダ−

Info

Publication number
JPS60121733A
JPS60121733A JP59158847A JP15884784A JPS60121733A JP S60121733 A JPS60121733 A JP S60121733A JP 59158847 A JP59158847 A JP 59158847A JP 15884784 A JP15884784 A JP 15884784A JP S60121733 A JPS60121733 A JP S60121733A
Authority
JP
Japan
Prior art keywords
die
tape
bonding
lead
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59158847A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0151055B2 (cg-RX-API-DMAC10.html
Inventor
Yasunobu Suzuki
鈴木　安信
Seiichi Chiba
誠一 千葉
Akihiro Nishimura
明浩 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59158847A priority Critical patent/JPS60121733A/ja
Publication of JPS60121733A publication Critical patent/JPS60121733A/ja
Publication of JPH0151055B2 publication Critical patent/JPH0151055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP59158847A 1984-07-31 1984-07-31 インナ−リ−ドボンダ− Granted JPS60121733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59158847A JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59158847A JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP58035584A Division JPS59161040A (ja) 1983-03-03 1983-03-03 インナ−リ−ドボンダ−

Publications (2)

Publication Number Publication Date
JPS60121733A true JPS60121733A (ja) 1985-06-29
JPH0151055B2 JPH0151055B2 (cg-RX-API-DMAC10.html) 1989-11-01

Family

ID=15680702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59158847A Granted JPS60121733A (ja) 1984-07-31 1984-07-31 インナ−リ−ドボンダ−

Country Status (1)

Country Link
JP (1) JPS60121733A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637148A (ja) * 1992-07-15 1994-02-10 Kaijo Corp ボンディング装置及びボンディング方法
KR100451760B1 (ko) * 1998-12-29 2004-12-17 주식회사 하이닉스반도체 테이프캐리어패키지제조공정용인너리드본딩장치의구조

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413497A (en) * 1977-05-23 1979-01-31 Rhone Poulenc Ind Purifying method of wet process phosphoric acid
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS571235A (en) * 1980-06-04 1982-01-06 Hitachi Ltd Method for pellet bonding and manufacture thereof
JPS5753950A (en) * 1980-09-17 1982-03-31 Fujitsu Ltd Pellet bonding device
JPS57147245A (en) * 1981-03-05 1982-09-11 Shinkawa Ltd Positioning method and device for chip bonding
JPS58141A (ja) * 1981-06-25 1983-01-05 Shinkawa Ltd 自動インナ−リ−ドボンデイング方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413497A (en) * 1977-05-23 1979-01-31 Rhone Poulenc Ind Purifying method of wet process phosphoric acid
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS571235A (en) * 1980-06-04 1982-01-06 Hitachi Ltd Method for pellet bonding and manufacture thereof
JPS5753950A (en) * 1980-09-17 1982-03-31 Fujitsu Ltd Pellet bonding device
JPS57147245A (en) * 1981-03-05 1982-09-11 Shinkawa Ltd Positioning method and device for chip bonding
JPS58141A (ja) * 1981-06-25 1983-01-05 Shinkawa Ltd 自動インナ−リ−ドボンデイング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637148A (ja) * 1992-07-15 1994-02-10 Kaijo Corp ボンディング装置及びボンディング方法
KR100451760B1 (ko) * 1998-12-29 2004-12-17 주식회사 하이닉스반도체 테이프캐리어패키지제조공정용인너리드본딩장치의구조

Also Published As

Publication number Publication date
JPH0151055B2 (cg-RX-API-DMAC10.html) 1989-11-01

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