JPS60118781A - フレキシブル印刷回路基板用接着剤組成物 - Google Patents

フレキシブル印刷回路基板用接着剤組成物

Info

Publication number
JPS60118781A
JPS60118781A JP22541983A JP22541983A JPS60118781A JP S60118781 A JPS60118781 A JP S60118781A JP 22541983 A JP22541983 A JP 22541983A JP 22541983 A JP22541983 A JP 22541983A JP S60118781 A JPS60118781 A JP S60118781A
Authority
JP
Japan
Prior art keywords
adhesive
epoxy compound
parts
weight
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22541983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6359434B2 (de
Inventor
Kunihiko Yamamoto
邦彦 山本
Yoshiaki Masuda
増田　義昭
Takefumi Shibuya
渋谷　武文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP22541983A priority Critical patent/JPS60118781A/ja
Publication of JPS60118781A publication Critical patent/JPS60118781A/ja
Publication of JPS6359434B2 publication Critical patent/JPS6359434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP22541983A 1983-12-01 1983-12-01 フレキシブル印刷回路基板用接着剤組成物 Granted JPS60118781A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22541983A JPS60118781A (ja) 1983-12-01 1983-12-01 フレキシブル印刷回路基板用接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22541983A JPS60118781A (ja) 1983-12-01 1983-12-01 フレキシブル印刷回路基板用接着剤組成物

Publications (2)

Publication Number Publication Date
JPS60118781A true JPS60118781A (ja) 1985-06-26
JPS6359434B2 JPS6359434B2 (de) 1988-11-18

Family

ID=16829073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22541983A Granted JPS60118781A (ja) 1983-12-01 1983-12-01 フレキシブル印刷回路基板用接着剤組成物

Country Status (1)

Country Link
JP (1) JPS60118781A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62153373A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用難燃性接着剤組成物
JPS62153371A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用接着剤組成物
US5464494A (en) * 1991-11-15 1995-11-07 Henkel Kommanditgesellschaft Auf Aktien Dispersion-based heat-sealable coating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62153373A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用難燃性接着剤組成物
JPS62153371A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用接着剤組成物
US5464494A (en) * 1991-11-15 1995-11-07 Henkel Kommanditgesellschaft Auf Aktien Dispersion-based heat-sealable coating

Also Published As

Publication number Publication date
JPS6359434B2 (de) 1988-11-18

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