JPS60116737A - 銅基合金 - Google Patents
銅基合金Info
- Publication number
- JPS60116737A JPS60116737A JP22617283A JP22617283A JPS60116737A JP S60116737 A JPS60116737 A JP S60116737A JP 22617283 A JP22617283 A JP 22617283A JP 22617283 A JP22617283 A JP 22617283A JP S60116737 A JPS60116737 A JP S60116737A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- alloy
- resistance
- heat resistance
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract description 10
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 21
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 18
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 229910045601 alloy Inorganic materials 0.000 claims description 37
- 239000000956 alloy Substances 0.000 claims description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 239000010936 titanium Substances 0.000 claims description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 239000011701 zinc Substances 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 claims 1
- 230000003647 oxidation Effects 0.000 abstract description 10
- 238000007254 oxidation reaction Methods 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000000137 annealing Methods 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000005336 cracking Methods 0.000 abstract description 2
- 238000005219 brazing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910018605 Ni—Zn Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000004584 weight gain Effects 0.000 description 3
- 235000019786 weight gain Nutrition 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- LFVLUOAHQIVABZ-UHFFFAOYSA-N Iodofenphos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(I)C=C1Cl LFVLUOAHQIVABZ-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22617283A JPS60116737A (ja) | 1983-11-29 | 1983-11-29 | 銅基合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22617283A JPS60116737A (ja) | 1983-11-29 | 1983-11-29 | 銅基合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116737A true JPS60116737A (ja) | 1985-06-24 |
| JPS628491B2 JPS628491B2 (enrdf_load_stackoverflow) | 1987-02-23 |
Family
ID=16841003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22617283A Granted JPS60116737A (ja) | 1983-11-29 | 1983-11-29 | 銅基合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116737A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159541A (ja) * | 1984-12-28 | 1986-07-19 | Hitachi Metals Ltd | リ−ドフレ−ム用銅合金 |
| US4732731A (en) * | 1985-08-29 | 1988-03-22 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic instruments and method of manufacturing the same |
| JP2006144047A (ja) * | 2004-11-17 | 2006-06-08 | Dowa Mining Co Ltd | Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板 |
| JP2016518720A (ja) * | 2013-05-03 | 2016-06-23 | サン−ゴバン グラス フランス | 光電池又は光電池モジュール用のバックコンタクト基材 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106104591B (zh) | 2014-03-14 | 2019-12-17 | 起元科技有限公司 | 映射带键实体的属性 |
-
1983
- 1983-11-29 JP JP22617283A patent/JPS60116737A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159541A (ja) * | 1984-12-28 | 1986-07-19 | Hitachi Metals Ltd | リ−ドフレ−ム用銅合金 |
| US4732731A (en) * | 1985-08-29 | 1988-03-22 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic instruments and method of manufacturing the same |
| JP2006144047A (ja) * | 2004-11-17 | 2006-06-08 | Dowa Mining Co Ltd | Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板 |
| JP2016518720A (ja) * | 2013-05-03 | 2016-06-23 | サン−ゴバン グラス フランス | 光電池又は光電池モジュール用のバックコンタクト基材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628491B2 (enrdf_load_stackoverflow) | 1987-02-23 |
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