JPS60116737A - Copper alloy - Google Patents

Abstract

PURPOSE:To provide a Cu alloy consisting of prescribed percentages of Ti, Ni, Zn and P and the balance Cu and having superior mechanical characteristics such as heat resistance, high resistance to tension, tensile strength at high temp., resistance to stress corrosion cracking and elasticity. CONSTITUTION:This Cu alloy consists of 0.1-1.5% Ti, 0.2-2.5% Ni, 0.05-2.0% Zn, 0.003-0.2% P and the balance Cu. The Cu alloy is proof against high temp. and shows superior oxidation resistance and high strength even after annealing at high temp. The Cu alloy has superior characteristics with respect to electric conductivity and very high heat resistance, so it can be widely used as a material for a heat exchanger, parts for the electric industry, parts which undergo heating to high temp. by brazing or other method, etc.

Description

Detailed Description of the Invention The present invention (4) relates to a copper-based alloy that has excellent mechanical properties such as heat resistance, high tensile strength, tensile strength at high temperatures, stress resistance J';%' corrosion resistance, and elasticity. .

Copper is an excellent electrical and thermal conductor and has good workability, so it is used in many applications such as various objects, building materials, heat exchange equipment, and electronic materials. When using copper paulownia for these various uses, there are often problems with its mechanical strength, heat resistance, elasticity, etc., and until now, various alloying elements have been added to copper to achieve satisfactory properties. In order to obtain
Various heat-resistant copper alloys have been proposed, including phosphorus-deoxidized copper and red copper.

Generally, when alloying elements are added to copper, there is a drawback that copper's excellent workability and electrical and thermal conductivity are reduced. Therefore, in copper-based alloys, mechanical strength, heat resistance, elasticity,
There is a strong need for a material with a good balance between corrosion resistance, workability, electrical and thermal conductivity, etc. In addition to the above, it is desired to have a low manufacturing cost that does not require special heat treatment steps such as quenching and tempering during processing or the equipment required for these steps.

The present invention aims to eliminate the above-mentioned drawbacks of conventional copper base metals, and improves various mechanical properties without impairing copper's excellent workability and electrical and thermal conductivity. The object of the present invention is to provide a copper-based alloy that can be manufactured at low cost without requiring any special heat treatment during processing.

In order to achieve the above-mentioned object, the inventor of the present application repeated many experiments on mixtures of copper, titanium, nickel, zinc, phosphorus, and tin, and based on the results, developed a new combination as described below. Has a ratio of mechanical strength and heat resistance,! We have succeeded in developing a copper-based alloy that has excellent 1 lil properties, as well as high electrical and thermal conductivity and workability.

That is, based on the results of the above experiments, the inventors of Kif+ considered the amounts of titanium, nickel, zinc, phosphorus, and tin added, their effects, and the synergistic effects of the added elements on the alloy properties.
I learned the following facts.

■ When titanium is added alone, it improves heat resistance.
Although it is quite effective, the effect of improving mechanical strength and elasticity is extremely small, and the conductivity of heat and electricity is also poor.

(If nickel is added alone, heat resistance + I,
Although the mechanical strength and elasticity are slightly improved, the effect is not significant and the thermal and electrical conductivity is also poor.

■ When titanium and nickel are co-added, mechanical strength, heat resistance, and elasticity are significantly improved, and electrical conductivity is also significantly improved compared to when each element is added alone. .

In addition, titanium has no effect below 0.1%, and
Even if it is added in an amount exceeding 5%, no significant improvement in strength or heat resistance is observed, and on the contrary, electrical conductivity decreases, which also poses an economical problem. Therefore, the optimum amount of titanium is in the range of 0.1 to 1.5%. On the other hand, if nickel is contained in an amount of 0.2% or less, it has no effect, and if it is contained in an amount exceeding 2.5%, a large amount of nickel remains, which does not combine with titanium, resulting in a decrease in electrical conductivity. Therefore, the optimum range of nickel is 0.2 to 2.5%.

■ If zinc is added in advance during melting, it can significantly reduce the amount of oxygen in the molten copper, significantly reduce the loss of expensive titanium, and improve the flowability of the metal. Zinc can also improve mechanical strength and heat resistance.

In addition, it is not effective if the zinc content is less than 0.05%,
Moreover, even if it is added in an amount exceeding 2.0%, no improvement in flowability, prevention of titanium loss, strength, or heat resistance is observed, and on the contrary, electrical conductivity decreases. Therefore, the range of zinc is 0.05-2'
, C1% force) is the most uniform.

1. Phosphorus reduces the oxygen in molten copper in the same way as lead, improves the flow f/l, and reduces the amount of nickel and titanium in ≠ trix, and when titanium and nickel are co-added. Even more heat resistant, mechanical strength 1Ω°, +jlli
Improves sex. Phosphorus can also improve the conductivity of electricity and shoes.

Therefore, if the phosphorus content m is 0.003% or less (4 effects 1)!, and if the phosphorus content is 2% or more, the upliftability, prevention of titanium loss, strength, and resistance will be reduced. (No significant effect on the conductivity was observed, and on the contrary, there was a risk that the electrical conductivity would decrease and stress corrosion cracking would occur.) Therefore, the phosphorus content should be in the range of 0.003 to 0.2%. is desirable.

ψ) By adding titanium, nickel, zinc, and phosphorus, the initial (n
A 1:1 target can be achieved. However, by further adding tin, it is possible to reduce the amount of titanium in the matrix and improve heat resistance, mechanical strength, elasticity, and corrosion resistance.

Furthermore, tin has no effect if its content is less than 0.1%, and even if it is added more than 1.5%, no significant improvement is observed in heat resistance, mechanical strength, elasticity, or corrosion resistance; Conductivity decreases. Therefore, the optimum amount of tin is 0.1 to 1.5%.

The present invention has been completely newly and uniquely developed based on the above-mentioned knowledge, and the alloy according to the first invention is
The basic composition of the alloy is ``Titanium 0.1-1.5%, Nickel 0.2-2.5%, Zinc 0.05-2.0%, Rinho 00.
3% to 0.2% and the balance is copper.

In addition, the alloy according to the second invention has a basic composition of "Titanium 0.1 to 1.5%, Nickel 0.2 to 2.5%, Zinc 0.05 to 2.0%, Phosphorus 003 to 0.2%, tin sail 1~
1.5% and the balance copper.

Specific examples of the copper-based alloy according to the present invention will be described below.

Mechanical t' between the copper-based alloy according to the present invention and the conventional copper-based metal
l: In order to conduct a comparative investigation of fi, electrical conductivity, heat resistance, etc., several copper-based alloys with chemical compositions as shown in Table 1 below were prepared.
! J'Jf's Jinoko.

1st/< Chemical composition of copper-based alloy for comparison test (wL%)
In Table 1, I(l L~I≦4 is the copper-based alloy according to the present invention. /Its 5-&12 is the conventional copper-based alloy, and High 5 is the copper-based alloy with the addition of nickel and phosphorus. 766 is a Cu-Ni-Zn alloy with no addition of titanium or phosphorus, 7 is a Cu-Ti-Ni-Zn alloy with phosphorus added, 76, 3 is a Cu-Ti-Ni-Zn alloy with phosphorus added. IF-9 is a Cu-Ti-Zn-P alloy with the addition of N1, and IF-9 is a Cu-Ni-Z alloy without the addition of Ti.
n-P alloy, mud 10 is JIS standard moon copper plate type 1, j≦
J1 is JIS standard deoxidized copper, and High 12 is a Cu-Zn based heat-resistant copper alloy.

Each material is fully annealed and the material is reduced to a reduction rate of 209.
6. Cold rolled and tested for electrical conductivity, tensile strength, and elongation.

The hardness of each was measured. The results are as shown in Table 2.

Note that the Alloy No. 12 was subjected to predetermined quenching and tempering heat treatments, and its tensile strength, elongation, hardness, and electrical conductivity were measured. The results are shown in the bottom column of the 9th Yi.

Table 2 Mechanical Properties As is clear from Table 2, the tensile strength and hardness of the copper-based alloy according to the present invention are as follows: - Same level or higher than Zn-based alloys, with Ni and Ti alone
It is superior to copper alloys to which P is added, copper alloys that combine two elements of Ni, Ti, and P, as well as other copper-based metals.

Furthermore, in terms of elongation, it is superior to the heat treated material of J612 Cu-Zn alloy, and is comparable to or slightly inferior to other copper alloys. It is understood that the addition of tin lowers the electrical conductivity but improves the tensile strength and elongation.

Furthermore, in terms of electrical conductivity, deoxidized copper of Group 11 and the like. j612 C
Although it is inferior to the heat treated material of u-Zn alloy, it is found to be superior to other alloys. Thus, it can be seen that the copper-based alloy according to the present invention is a copper-based alloy that has an excellent balance between strength and electrical conductivity.

The following Table 3 shows the heat resistance temperature (softening temperature), high temperature oxidation property at 600°C, and annealing at 750°C for 30 minutes. These are the results of measuring the hardness after each test.

In Table 3, the samples used for each test of heat resistance temperature, high temperature oxidation resistance, and hardness measurement after 750C annealing are the same as the samples used in the mechanical property test in Table 2.

The heat resistance temperature was the heating temperature for 30 minutes at which the hardness reached 80% of the initial hardness (hardness at room temperature). Further, oxidation weight gain was used as the high temperature oxidation property, which was obtained by subtracting the sample weight at the initial stage (at room temperature) from the sample weight after heating at 600C for 130 minutes, and dividing this by the sample surface area. In other words, the oxidation weight gain represents the increase in the amount of oxygen in the oxide produced by high temperature oxidation per unit area.

As is clear from Table 3, the heat resistance temperature of the copper-based alloy according to the present invention is superior to any other alloy, and the oxidation weight gain is also superior to any other alloy. I understand. Furthermore, in terms of hardness after annealing at 750C, the copper-based alloy according to the present invention has a hardness of &7 Cu-Ti-
Except for being on the same level as the Ni-Zn alloy, it is superior to any other alloy, and even when considering the hardness reduction rate compared to the hardness at room temperature, the crystallinity is still excellent 11. I understand.

In addition, the addition of S11 particularly increases the high temperature oxidation property and the heat resistance is 4.
111 degrees, 750 F: It is clear from the results of sample ja/I that the hardness after annealing is also increased.

As described above, the copper base metal according to the present invention has a high heat resistance t1'l
A copper-based alloy with excellent overall heat resistance, with first-class oxidation resistance and high strength even after high-temperature annealing.
, Lul! : Jeru.

The copper-based alloy of the present invention has high tensile strength and elongation as described above.

It has excellent mechanical properties such as hardness, excellent electrical conductivity, and extremely high heat resistance. It can be widely used for parts that heat crystals, etc.

Further, the copper-based alloy according to the present invention 1ζ does not require any special heat treatment or the like for processing, so it can be manufactured at a relatively low cost and has extremely high practical utility.

Procedural amendment (voluntary) December 1980: L, 7th 1, Indication of case: Japanese Patent Application No. 5872261722, Title of invention: Copper base Gold 3, Relationship with the case by person making the amendment: Address of patent applicant: Osaka Prefecture 8-374 Sanpo-cho, Sakai City Name: Sanpo Shindo Kogyo Co., Ltd. Representative Yu Kuno Part 4, Agent 5 Column 6 of “3. Detailed Description of the Invention” of the specification subject to amendment Contents (2) Same 8 rt 10? 'r Ll l---&
12 is”, followed by “c.

-Znj is corrected by l'Co -ZrJ +C.

(3) :;il Page 10, line 8, “--ira 12 no” next “Cu-Z++ j worl Cu-Zr-I
B: Supplementary iE Sur.

(1) 1 Tsukasa 10 j't J4 fi eye [Cu
-Convert Zn J to "Cu-Zl".

Claims (2)

[Claims] (1) Titanium 0.1-15%, nickel sail 2-2.5
%, zinc 0.05-2.0%, phosphorus 0.003-0.2%
Copper-based alloys consisting of copper and the balance copper. (2) Ditan sail 1-1.5%, nickel 0.2-2.
5%, zinc 0.05-2.0%, phosphorus 003-0.2%
, a copper-based alloy consisting of 1 to 1.5% tin and the balance copper.