JPS60113994A - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法Info
- Publication number
- JPS60113994A JPS60113994A JP22244783A JP22244783A JPS60113994A JP S60113994 A JPS60113994 A JP S60113994A JP 22244783 A JP22244783 A JP 22244783A JP 22244783 A JP22244783 A JP 22244783A JP S60113994 A JPS60113994 A JP S60113994A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paint
- copper foil
- jumper
- multilayer printed
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000003973 paint Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000009413 insulation Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22244783A JPS60113994A (ja) | 1983-11-25 | 1983-11-25 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22244783A JPS60113994A (ja) | 1983-11-25 | 1983-11-25 | 多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60113994A true JPS60113994A (ja) | 1985-06-20 |
JPH0118595B2 JPH0118595B2 (enrdf_load_stackoverflow) | 1989-04-06 |
Family
ID=16782541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22244783A Granted JPS60113994A (ja) | 1983-11-25 | 1983-11-25 | 多層プリント配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60113994A (enrdf_load_stackoverflow) |
-
1983
- 1983-11-25 JP JP22244783A patent/JPS60113994A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0118595B2 (enrdf_load_stackoverflow) | 1989-04-06 |
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