JPS60105259A - 半導体機器用リ−ドフレ−ム材 - Google Patents

半導体機器用リ−ドフレ−ム材

Info

Publication number
JPS60105259A
JPS60105259A JP58213073A JP21307383A JPS60105259A JP S60105259 A JPS60105259 A JP S60105259A JP 58213073 A JP58213073 A JP 58213073A JP 21307383 A JP21307383 A JP 21307383A JP S60105259 A JPS60105259 A JP S60105259A
Authority
JP
Japan
Prior art keywords
metals
diffusion
base material
lead frame
different kind
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58213073A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0562467B2 (cs
Inventor
Kuniaki Seki
関　邦明
Shinichi Nishiyama
西山　進一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP58213073A priority Critical patent/JPS60105259A/ja
Publication of JPS60105259A publication Critical patent/JPS60105259A/ja
Publication of JPH0562467B2 publication Critical patent/JPH0562467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Physical Vapour Deposition (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58213073A 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材 Granted JPS60105259A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58213073A JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58213073A JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS60105259A true JPS60105259A (ja) 1985-06-10
JPH0562467B2 JPH0562467B2 (cs) 1993-09-08

Family

ID=16633091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58213073A Granted JPS60105259A (ja) 1983-11-11 1983-11-11 半導体機器用リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS60105259A (cs)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480056A (en) * 1987-09-21 1989-03-24 Dainippon Printing Co Ltd Manufacture of conductive material for electronic component
JPH04366A (ja) * 1990-04-16 1992-01-06 Mitsubishi Electric Corp 半導体リードフレーム材料及びその製造方法
JPH04138036U (ja) * 1991-06-20 1992-12-24 三菱電線工業株式会社 ワーク供給装置
EP0621981A4 (en) * 1992-01-17 1995-05-17 Olin Corp Lead frames with improved adhesion.
JPH08503423A (ja) * 1992-11-23 1996-04-16 ギューリング，ヨーク 交換可能な切削チップを備えたドリル
WO1996015284A1 (en) * 1994-11-09 1996-05-23 Cametoid Advanced Technologies Inc. Method of producing reactive element modified-aluminide diffusion coatings
WO2007052438A1 (ja) * 2005-11-01 2007-05-10 Advanced Systems Japan Inc. スパイラル状接触子およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147261A (en) * 1981-03-06 1982-09-11 Hitachi Cable Ltd Partly reinforcing method for metal
JPS58153356A (ja) * 1982-03-05 1983-09-12 Mitsubishi Metal Corp 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147261A (en) * 1981-03-06 1982-09-11 Hitachi Cable Ltd Partly reinforcing method for metal
JPS58153356A (ja) * 1982-03-05 1983-09-12 Mitsubishi Metal Corp 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480056A (en) * 1987-09-21 1989-03-24 Dainippon Printing Co Ltd Manufacture of conductive material for electronic component
JPH04366A (ja) * 1990-04-16 1992-01-06 Mitsubishi Electric Corp 半導体リードフレーム材料及びその製造方法
JPH04138036U (ja) * 1991-06-20 1992-12-24 三菱電線工業株式会社 ワーク供給装置
EP0621981A4 (en) * 1992-01-17 1995-05-17 Olin Corp Lead frames with improved adhesion.
JPH08503423A (ja) * 1992-11-23 1996-04-16 ギューリング，ヨーク 交換可能な切削チップを備えたドリル
WO1996015284A1 (en) * 1994-11-09 1996-05-23 Cametoid Advanced Technologies Inc. Method of producing reactive element modified-aluminide diffusion coatings
US5807613A (en) * 1994-11-09 1998-09-15 Cametoid Advanced Technologies, Inc. Method of producing reactive element modified-aluminide diffusion coatings
WO2007052438A1 (ja) * 2005-11-01 2007-05-10 Advanced Systems Japan Inc. スパイラル状接触子およびその製造方法
JP2007128684A (ja) * 2005-11-01 2007-05-24 Advanced Systems Japan Inc スパイラル状接触子およびその製造方法
EP1950851A4 (en) * 2005-11-01 2011-11-02 Advanced Systems Japan Inc SPIRAL CONTACT AND PROCESS FOR ITS MANUFACTURE

Also Published As

Publication number Publication date
JPH0562467B2 (cs) 1993-09-08

Similar Documents

Publication Publication Date Title
KR100318818B1 (ko) 리드프레임에대한보호피막결합
JPS60105259A (ja) 半導体機器用リ−ドフレ−ム材
US4035526A (en) Evaporated solderable multilayer contact for silicon semiconductor
WO1991003830A1 (en) Multi-element metallic composite article and method of manufacture
US4065588A (en) Method of making gold-cobalt contact for silicon devices
JP3303594B2 (ja) 耐熱銀被覆複合体とその製造方法
JPH06334087A (ja) 半導体装置用リードフレームの製造方法
JPS6243343B2 (cs)
JPS60153152A (ja) 半導体機器用リ−ドフレ−ム材の製造方法
JP2529774B2 (ja) 半導体装置リ―ドフレ―ム材料及びその製造方法
JPS5943973B2 (ja) Ａｇメッキ用リ−ドフレ−ム素材の製法
JPS5936954A (ja) 半導体用リ−ドフレ−ム
JPS57114265A (en) Ic lead frame and transistor comb and manufacture thereof
JPS6036000B2 (ja) 耐熱銀被覆銅線およびその製造方法
JPH0647181B2 (ja) 銅と鉄系またはニッケル系合金のクラッド材の製造方法
US3990094A (en) Evaporated solderable multilayer contact for silicon semiconductor
US4482611A (en) Electronic parts
JPS58509B2 (ja) メツキホウホウ
JP3463481B2 (ja) 表面硬化Ｆｅ−Ａｌ系合金の製造方法
JP2564633B2 (ja) 樹脂との接合性が良好なリードフレーム材の製造方法
JP2542735B2 (ja) 半導体リ―ドフレ―ム材料及びその製造方法
JPH06112389A (ja) リードフレームおよびその製造方法
JPS5943972B2 (ja) Ａｇメッキ用リ−ドフレ−ム素材の製法
JPS5827334B2 (ja) ジユメツト線
JPH10163397A (ja) 半導体装置用リードフレームの製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees